Preliminary GP1USC3xXP (Series) GP1USC3xXP (Series) Infrared Detector for Remote Control ■ Features ■ Agency Approvals/Compliance 1. Compact size: (mounting area 5.0 × 4.5; and 1.35 mm tall) 2. SMD (Surface Mount Device), reflow capable 3. Low power dissipation: 0.6 mA MAX. 4. Wide operating temperature range: -30 to + 85°C 5. Five parts, offering a number of center frequencies: 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS) (Chinese: ); refer to page 12. Part Number Center Bandpass Frequency (TYP.) GP1USC30XP 36 kHz GP1USC31XP 38 kHz GP1USC32XP 36.7 kHz GP1USC33XP 32.75 kHz GP1USC34XP 40 kHz ■ Applications 1. Automotive audio 2. Personal Computers 3. Audio visual equipment Notice The content of this Data Sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, Sharp takes no responsibility for any defects that may occur in equipment using any Sharp devices shown in catalogs, data books, etc. Contact Sharp in order to obtain the latest device specification sheets before using any Sharp device. 1 Sheet No.: OP08905 July, 2009 ©SHARP Corporation Preliminary GP1USC3xXP Series ■ External Dimensions 4.5 2.2 (0.9) 2.2 GND PD Center 2.4 5.0 2.6 GND Vout Vcc 1.35 Marking Area 2.0 1.1 0.9 0.9 2.25 2.7 2.25 0.9 0.9 1.1 1.1 1.1 Model No. Stamp GP1USC30XP R0 Day (01 - 31) GP1USC31XP R1 Month (1 - 9, X, Y, Z) GP1USC32XP R2 Year (2009: 9) GP1USC33XP R3 Model Number GP1USC34XP R4 R 4 9 7 1 4 NOTES: 1. Units: mm 2. Unspecified tolerance: ±0.3 3. Case and lead material: Cu (Au, Pd plating) 4. Mold resin: Epoxy resin 5. Product mass: Approx 0.06 g GP1USC3XP-1 Sheet No.: OP08905 July, 2009 2 Preliminary GP1USC3xXP Series ■ Block Diagram RL Amp Amp B.P.F. Demodulator Integrator Comparator Control Circuit Oscillator GND GP1USC3XP-4 VCC VOUT ■ Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage VCC 0 to 6 V Operating temperature Topr -30 to +85 °C Storage temperature Tstg -40 to +85 °C Soldering temperature Tsol 255 (peak) 230 °C Notes *1 *2 humidity kept above dew point. *12 Non-condensing: * 255°C is a peak maximum value when flow-soldering; for hand soldering, 230°C and apply heat no more than 40 seconds. Sheet No.: OP08905 July, 2009 3 Preliminary GP1USC3xXP Series ■ Electro-optical Characteristics Parameter Symbol Condition Operating supply voltage VCC Current dissipation ICC EV = 0 lx (no light) Output HIGH voltage VOH See Note 1 Output LOW voltage VOL Min. Typ. 2.7 IOL = 1.6 Max. Unit 5.5 V — 0.35 0.6 mA VCC – 0.5 — — V — 0.45 V mA*1 Output HIGH pulse width T1 See Figure 2 600 1200 µs Output LOW pulse width T2 See Figure 2 400 1000 µs Bandpass Frequency center ƒo Output pullup resistance GP1USC30XP 36 kHz GP1USC31XP 38 kHz GP1USC32XP 36.7 kHz GP1USC33XP 32.75 kHz GP1USC34XP 40 kHz 50 k RL 1 The waveform shown in Fig. 1 was transmitted at the test part’s center frequency. Reception measurements were begun at transmission start and ended at pulse 50. * Fig. 1. Transmitted and Received Pulses Transmitted signal 600 µs 1000 µs Output signal T2 T1 GP1USC3XP-5 Sheet No.: OP08905 July, 2009 4 Preliminary ● Performance Measurements GP1USC3xXP Series 2. Reception Angle Sensitivity: Distance between transmitter and receiver: 0.2 to 12 meters; detector face illumination: Ev < 10 lx, 30° 3. Transmitter Test Setup: In Fig. 2, the transmitter is set so that Vout will be 180 mV p-p. The PD49PI has a short-circuit current ISC = 2.6 µA at Ev = 100 lx. The parameters in the Characteristics tables were gathered using the transmitter jig in Fig. 2, along with the receiver jig in Fig. 3. 1. Linear Reception: Distance between transmitter and receiver: 0.2 to 15.0 meters; detector face illumination: Ev < 10 lx, = 0° Fig. 2. Transmitter Test Setup 20 cm 10 kΩ Transmitter ƒo: (Note 1) Duty cycle: 50% +5 V 10 µF PD49I VOUT 10 kΩ Oscilloscope NOTE: 1. The BPF center frequency ƒo varies with model, as shown in the Electro-optical Characteristics GP1USC3XP-6 Fig. 3. Receiver Test Setup Detector face Illuminance: Ev φ Transmitter VOUT φ Reception Distance: L NOTE: φ: Indicates horizontal and vertical directions GP1USC3XP-7 Sheet No.: OP08905 July, 2009 5 Preliminary GP1USC3xXP Series ■ Design Considerations Design Guidelines 1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant. 2. Avoid placing mechanical stress upon this part, whether to the case or terminals. Such stresses may crack the molding material, possibly breaking internal wire bonds in the part. 3. Conductive thermoplastics are used in the second mold resin of this part. Do not allow this resin to come in contact with the PCB landing or any circuit runs. 4. When using this part in a remote control detector, the incoming signal must be managed so that Tdata is less than 100 ms and Toff (suspend time) is more than 25 ms; and the minimum pulse width of modulated IR data is 250 µs during Ton. Should the signal format fail to meet these conditions, the reception distance or device output may be compromised. See Fig. 4. Fig. 4. Transmit Time for One Signal Block Transmitting time for 1 block: T Suspendx Period: TOFF Data Period: Tdata TON ... ... GP1USC3XP-2 5. Output noise may be caused by environmental factors, even in the absence of a received signal. If the device is used in the presence of strong external light, this may show up as noise in the detector. Sharp recommends checking the layout and structure so as to reduce the amount of external light interference. Also, confirm the device’s performance in actual operation, as the output may be affected by signal format, temperature, and the distance from the transmitter. 6. This device may have degraded optical performance if the detector surface becomes dirty or coated with any foreign substance. This may happen through the use of process chemicals, including washing; it is for this reason that Sharp does not recommend washing this part. If the detector surface becomes contaminated, use a soft cloth to wipe it clean. 7. Sharp recommends a circuit similar to the one shown in Fig. 5 to accompany this device. The values should be adjusted to reflect the actual circuit conditions, and be placed as physically close to the device as possible. Fig. 5. Device Connection R1 VCC + Ve C1 GND GND VOUT VO NOTES: R1 = 47 Ω ±5% C1 = 47 µF GP1USC3XP-3 Sheet No.: OP08905 July, 2009 6 Preliminary GP1USC3xXP Series 8. This device has a parallel transistor internally to protect it against static. However, the internal protection should not be counted upon to protect the device against overvoltage or noise spikes in the power supply, as the transistor could experience a secondary breakdown short. Sharp recommends decoupling the power supply near the device with a 47 (1/10 W) resistor and 10 µF capacitor. 9. This part is not highly tolerant of condensing conditions. Condensation can degrade the case and lead connections, leading to degraded electrical characteristics. ■ Manufacturing Guidelines ● Storage and Handling 1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use. 2. Store these parts between 10°C and 30°C, at a relative humidity of less than 70%, for up to a year. 3. After breaking the package seal, maintain the environment within 10°C to 30°C, at a relative humidity of less than 70%. Mount the parts within 2 days. 4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant. Store them as above, but since the seal has been broken, the parts must be used within 4 weeks. 5. If the parts are exposed to air for more than 3 days, if there are more than 3 days between reflow operations, or if the silica gel telltale indicates moisture contamination, bake the parts. If these parts will undergo a second reflow operation, and if they have exceeded the open time as noted above, they must be baked. In all cases, these parts may be baked only once: • When in the tape carrier, bake them at a temperature of 65°C for 48 hours. Bake only one reel at a time; reels will become deformed if stacked. • When loose on a metal tray or on a PCB, bake them at a temperature of 100°C to 110°C, for 12 to 24 hours. Temporary mounting on a PCB must be using an adhesive and not by soldering. Baking these particular parts in the reels is to be avoided if at all possible. To properly bake these parts, they should be mounted to a PCB with adhesive (not soldered) or placed in a metal tray. Sheet No.: OP08905 July, 2009 7 Preliminary GP1USC3xXP Series ● Soldering Instructions 1. Sharp recommends soldering this part no more than twice and at the profile shown in Fig. 6. Reflow should occur within three days, after storing at 10°C to 30°C, and at no more than 70% relative humidity. 2. When preheating this part with infrared, localized high temperatures can be generated in the resin of this part; therefore the process should be confirmed that it remains within the limits shown in Fig. 6. 3. When hand soldering, use a temperature-controlled iron with the point < 350°C < 5 seconds. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the device due to the PCB flexing during the soldering process. 5. Sharp recommends handling this part in a static-controlled work area. Fig. 6. Soldering Profile 255°C MAX. 230°C 1 - 3°C/s 180°C 1 - 5°C/s 150°C 1 - 3°C/s 25°C 90 ±30 s 40 s MAX. GP1USC3XP-8 ● Soldering Mask Fig. 7 shows the recommended solder mask for this device. Fig. 7. Soldering Mask GND GND 1.3 2.0 VOUT VCC 1.3 1.7 1.8 0.9 2.3 1.3 4.9 1.3 2.0 2.0 0.7 2.0 5.7 GP1USC3XP-13 Sheet No.: OP08905 July, 2009 8 Preliminary GP1USC3xXP Series ● Cleaning Instructions 1. If the detector face becomes contaminated, the optical characteristics of this part will be affected. Do not wash this part, as residue left from solvents may be left behind. Only clean the part with a soft cloth. 2. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. ■ Tape Specifications φ1.5 +0.10 -0.00 8.0 ±0.10 5.50 ±0.10 φ1.5 min 1.65 ±0.10 5.3 ±0.10 2.0 ±0.05 12.0 ±0.30 4.0 ±0.10 1.75 ±0.10 Fig. 8 Tape Shape and Dimensions 4.8 ±0.10 GP1USC3XP-9 Sheet No.: OP08905 July, 2009 9 Preliminary GP1USC3xXP Series ■ Reel Specifications Fig. 9 Reel Shape and Dimensions 18.5 ±1.0 φ21.0 ±0.8 φ100.0 ±1.0 φ13.0 ±0.2 g 254.0 ±1.0 13.5 ±1.0 GP1USC3XP-10 ■ Product Insertion Direction Fig. 10 shows the orientation of the device in the tape. Fig. 10 Product Insertion Indicator Pull out Label Chip GP1USC3XP-11 Sheet No.: OP08905 July, 2009 10 Preliminary GP1USC3xXP Series ● Packing Information Product is sealed in laminated aluminum bags with 2000 pieces per reel, silica gel desiccant, and humidity telltale. The EIAJ C-3 compliant label is filled out and affixed to the bag. Four of these packaged reels of product are then placed in the shipping box with pads separating them, as well as a pad on both the top and bottom. The boxes are then sealed with kraft tape, indicating number, quantity, and lot number. Each box carries 8000 pieces for a total mass of approximately 2 kg; the mass of each part is approximately 0.05 g. Fig. 11 Shipping Package Drawing Pad (5 Sheets Total) Reels in Moisture-proof Bags Taped Product in Reel Indicator Silica Gel Label Damp Proof Bag Label Tape-reel in a Moisture-proof Bag Packing Case Packing Case 150 mm TYP. 440 mm TYP. 370 mm TYP. NOTES: 1. Units: mm 2. Quantity: 8000 pcs/package 4. Regular packaged mass: Approximately 2.0 kg 5. Shipping Label: Model No., Quantity, and Lot No. Label GP1USC3XP-12 Sheet No.: OP08905 July, 2009 11 Preliminary GP1USC3xXP Series ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). • Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) Toxic and Hazardous Substances Category Infrared Detectors Lead (Pb) ✓ mercury (Hg) Cadmium (Cd) ✓ ✓ Hexavalent chromium (Cr 6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) ✓ ✓ ✓ NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. Sheet No.: OP08905 July, 2009 12 Preliminary ■ Important Notices GP1USC3xXP Series --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: Sheet No.: OP008905 July 2009 13