SHARP PT481FE0000F

PT481FE0000F
PT481FE0000F
Opaque Resin, Narrow Directivity Angle,
Darlington Phototransistor
■ Features
■ Agency Approvals/Compliance
1.
2.
3.
4.
5.
6.
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS)
(Chinese:
);
refer to page 7.
Side view detection package with long terminal
Plastic mold with opaque resin lens
Peak sensitivity wavelength: 860 nm (TYP.)
High sensitivity (IC: 10.0 mA TYP.)
Narrow acceptance angle (Δθ ±13° TYP.)
Lead free and RoHS directive compliant
■ Applications
1.
2.
3.
4.
5.
Optoelectronic switches
Automatic stroboscopes
Mechanical Systems
Office automation equipment
Audio visual equipment
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D1-A01401EN
Date: November 30, 2007
©SHARP Corporation
PT481FE0000F
2.95
2.15
■ External Dimensions
R0.8 ±0.1
1.15
0.75
3.0
0.5 MAX.
Gate burr
2-C0.5
(4°)
1.0 MAX.
resin burr
4.0
1.5
0.5
(4°)
0.15 MAX.
R0.5
(4°)
(4°)
1.4
φ1.5 E. PIN
(60°)
(1.7)
0.15
2 - 0.8
17.5 -1.0
+1.5
0.2 MAX.
Resin burr
Black
Marking
+0.3
+0.3
2 - 0.45 -0.1
0.5 MIN.
2 - 0.4 -0.1
(2.54)
1.6
Terminal connection
(6°)
(6°)
2
1
(6°)
(6°)
Pin Arrangement
1
(6°)
(6°)
2
No.
2.8
NOTES:
1. Units: mm
2. Unspecified tolerence: ±0.2 mm
3. ( ): Reference dimensions
4. Package: Visible light cut-off epoxy resin (black)
5. Mold burrs (0.05 mm MAX.) are not included in outline dimensions
6. Resin protrusion: 1.0 mm MAX.
7. Lead step is 1.4 mm MAX. from the part’s resin
Name
1
Emitter
2
Collector
Sheet No.: D1-A01401EN
2
PT481FE0000F
■ Absolute Maximum Ratings
Parameter
(Ta = 25°C)
Symbol
Rating
Unit
Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Collector current
IC
50
mA
Collector power dissipation
PC
75
mW
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +85
°C
Soldering temperature *1
Tsol
260
°C
1 5 s (MAX.) no closer than 1.4 mm from resin edge.
*
■ Electro-optical Charactertistics
Parameter
Collector current
Dark current
(Ta = 25°C)
Symbol
Conditions *1
MIN.
TYP.
MAX.
Unit
IC
Ee = 0.1 mW/cm2, VCE = 2 V
0.9
–
27
mA
ICEO
Ee = 0, VCE = 10 V
–
1.0
1000
nA
–
0.7
1.0
V
Ee = 1
mW/cm2,
Collector-emitter saturation voltage
VCE(sat)
IC = 1.5 mA
Collector-emitter breakdown voltage
BVCEO
IC = 0.1 mA, Ee = 0
35
–
–
V
Emitter-collector breakdown voltage
BVECO
IE = 0.01 mA, Ee = 0
6
–
–
V
Peak sensitivity wavelength
λp
–
–
860
–
nm
Response time (Rise)
tr
–
80
–
µs
Response time (Fall)
tf
VCE = 2 V, IC = 10 mA,
RL = 100 Ω
–
70
–
µs
1 Ee: Irradiance by CIE standard light source A (tungsten lamp)
*
Fig. 2 Spectral Sensitivity (TYP.)
Ta = 25°C
100
80
75
70
90
80
Relative sensitivity (%)
Collector power dissipation PC (mW)
Fig. 1 Collector Power Dissipation vs.
Ambient Temperature
60
50
40
30
70
60
50
40
30
20
10
20
15
10
0
400
500
600
700
800
900
1000
1100
Wavelength λ(nm)
0
-25
0
25
50
75 85
100
Ambient temperature Ta (°C)
Sheet No.: D1-A01401EN
3
PT481FE0000F
Fig. 3 Collector Dark Current vs.
Ambient Temperature
Fig. 5 Relative Collector Current vs.
Ambient Temperature
175
10-6
VCE = 2 V
Ee = 0.1 mW/cm2
VCE = 10 V
Relative collector current (%)
Collector dark current I CEO (A)
10-7
10-8
10-9
10-10
10-11
150
125
100
75
10-12
10-13
-25
0
25
50
75
50
-25
100
0
50
25
75
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Fig. 6 Collector Current vs.
Collector-Emitter Voltage
Fig. 4 Collector Current vs. Irradiance
VCE = 2 V
Ta = 25°C
16
Ta = 25°C
2
Collector current IC (mA)
Collector current IC (mA)
14
10
12
/cm
Ee
.2
=0
mW
2
10
5
0.1
/cm
mW
8
PC (MAX.)
2
/cm
0.1 mW
6
m
0.08 mW/c
4
0.06 mW/cm
2
0.04 mW/cm
0.02 mW/cm2
2
2
2
1
2
5
10-1
1
0
0
Irradiance Ee (mW/cm2)
2
4
6
8
10
12
14
16
Collector-emitter voltage VCE (V)
Sheet No.: D1-A01401EN
4
PT481FE0000F
Fig. 7 Response Time vs.
Load Resistance
Fig. 10 Relative Output vs Distance
Emitter: GL480E00000F
100
1000
tr
100
Relative output (%)
m
Response time ( s)
VCE = 2 V
IC = 10 mA
Ta = 25°C
tf
td
10
ts
10
1
1
100
10
5000
1000
1
Load resistance RL (W)
10
Distance between emitter and detector (mm)
Fig. 8 Test Circuit for Response Time
Fig. 11 Sensitivity vs. Axis (TYP.)
Input
(Ta = 25°C)
Output
-20°
90%
Output
tf
-40°
Fig. 9 Collector-to-Emitter Saturation
Voltage vs. Irradience
-50°
(Ta = 25°C)
-60°
2.0
20 mA
10 mA
5 mA
2 mA
IC = 0.5 mA
1 mA
-70°
Collector-emitter
saturation voltage VCE(sat) (V)
+20°
+30°
Relative sensitivity (%)
ts
tr
1.6
+10°
-30°
10%
td
1.8
0°
100
RL
VCC
-10°
80
60
40
1.4
+50°
+60°
20
-80°
-90°
+40°
+70°
+80°
0
Angular displacement θ
+90°
1.2
1.0
0.8
0.6
0.005 0.01
0.02 0.05 0.1
Irradiance Ee
0.2
0.5
1
(mW/cm2)
Graph data is for reference only and is not guaranteed data.
Sheet No.: D1-A01401EN
5
PT481FE0000F
■ Design Notes
1. This product is not designed to resist electromagnetic and ionized-particle radiation.
■ Manufacturing Guidelines
● Soldering Instructions
1. Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part are
pre-coated with lead-free solder.
2. If hand soldering, use temperatures ≤ 260° for ≤ 5 seconds.
3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the
solder, the pad, and the circuit board.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process.
Fig. 12 Soldering Area
1.4 mm
Solderable
● Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A01401EN
6
PT481FE0000F
■ Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
• Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese:
)
Toxic and Hazdardous Substances
Category
Photo Transistor
Lead (Pb) mercury (Hg) Cadmium (Cd)
✓
✓
✓
Hexavalent
chromiun (Cr6+)
Polybrominated
biphenyls (PBB)
Polybrominated
diphenyl ethers
(PBDE)
✓
✓
✓
NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
Sheet No.: D1-A01401EN
7
PT481FE0000F
■ Packing Specifications
1. Parts are packed in a plastic zipper bag, with a quantity of 1000 pieces per bag.
2. Bags are secured in a box as shown in Figure 13.
3. Product mass: 0.09 g (approximately)
Fig. 13 Packing Composition
Inner packing
Product (1000 pcs)
Plastic zipper bag
NOTES:
1. Inner packing material : Plastic zipper Bag (Polyethylene)
2. Quantity: 1000 pcs/bag
Outer packing
Cushioning material (2 sheets)
Plastic zipper bag with products (2 bags)
Cushioning material (2 sheets)
Packing case
Cellophane tape
NOTES:
1. Outer material : Packing case (Corrugated cardboard),
Cushioning material (Urethane), Cellophane tape
2. Quantity: 2000 pcs/box
3. Regular packaged mass: Approximately 270 g
4. Indication: Model No., Quantity, and Lot No.
Model No., Quantity, and Lot No.
Sheet No.: D1-A01401EN
8
PT481FE0000F
■ Important Notices
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, structure, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
Sheet No.: D1-A01401EN
9