PT483F1E000F PT483F1E000F Opaque Resin, Narrow Directivity Angle, Long Terminal Darlington Phototransistor ■ Features ■ Agency Approvals/Compliance 1. 2. 3. 4. 5. 6. 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (popular name: China RoHS) (Chinese: ); refer to page 7. Side view detection package with long terminal leads Plastic mold with opaque resin lens Peak sensitivity wavelength: 860 nm TYP. High sensitivity (IC: 1.5 mA MIN.) Narrow acceptance angle (Δθ ±13° TYP.) Lead free and RoHS directive compliant ■ Applications 1. 2. 3. 4. 5. Optoelectronic switches Automatic stroboscopes Mechanical Systems Office automation equipment Audio visual equipment Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D1-A01501EN Date: November 30, 2007 ©SHARP Corporation PT483F1E000F 2.15 2.95 ■ External Dimensions 1.15 R0.8 ±0.1 0.75 3.0 0.5 MAX. Gate burr 2-C0.5 4° 1.0 MAX. resin burr 4.0 1.5 0.5 4° φ1.5 E. PIN 0.15 MAX. 4° R0.5 1.4 4° 60° 0.15 (1.7) 2 - 0.8 40.0 ±1.0 (3.0) (2-0.6) 0.2 MAX. Resin burr (18.5) Black Marking +0.3 2 - 0.4 -0.1 +0.3 0.5 MIN. 2 - 0.45-0.1 (2.54) 1.6 Terminal connection (6°) (6°) 2 1 (6°) (6°) 1 Pin Arrangement 2 (6°) (6°) No. 2.8 NOTES: 1. Units: mm 2. Unspecified tolerence: ±0.2 mm 3. ( ): Reference dimensions 4. Package: Visible light cut-off (black) epoxy resin 5. The thin burr thickness (0.05 mm MAX.) is not included in outline dimensions 6. Resin protrusion: 1.0 mm MAX. 7. However, the thin burr adhering to the lead is 1.4 mm MAX. from the resin. Name 1 Emitter 2 Collector Sheet No.: D1-A01501EN 2 PT483F1E000F ■ Absolute Maximum Ratings Parameter (Ta = 25°C) Symbol Rating Unit Collector-emitter voltage VCEO 35 V Emitter-collector voltage VECO 6 V Collector current IC 50 mA Collector power dissipation PC 75 mW Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +85 °C Soldering temperature *1 Tsol 260 °C 1 5 s (MAX.) position of 1.4 mm from resin edge. * ■ Electro-optical Charactertistics Parameter Collector current Dark current (Ta = 25°C) Symbol Conditions *1 MIN. TYP. MAX. Unit IC Ee = 0.1 mW/cm2, VCE = 2 V 1.5 – 4 mA ICEO Ee = 0, VCE = 10 V – 1.0 1000 nA – 0.7 1.0 V Ee = 1 mW/cm2, Collector-emitter saturation voltage VCE(sat) IC = 2.5 mA Collector-emitter breakdown voltage BVCEO IC = 0.1 mA, Ee = 0 35 – – V Emitter-collector breakdown voltage BVECO IE = 0.01 mA, Ee = 0 6 – – V Peak sensitivity wavelength λp – – 860 – nm Response time (Rise) tr – 80 – µs Response time (Fall) tf VCE = 2 V, IC = 10mA, RL = 100 Ω – 70 – µs 1 Ee: Irradiance by CIE standard light source A (tungsten lamp) * Fig. 2 Spectral Sensitivity (TYP.) Ta = 25°C 100 80 75 70 80 Relative sensitivity (%) Collector power dissipation PC (mW) Fig. 1 Collector Power Dissipation vs. Ambient Temperature 60 50 40 30 60 40 20 20 15 10 0 400 500 600 700 800 900 1000 1100 Wavelength λ (nm) 0 -25 0 25 50 75 85 100 Ambient temperature Ta (°C) Sheet No.: D1-A01501EN 3 PT483F1E000F Fig. 3 Collector Dark Current vs. Ambient Temperature Fig. 5 Relative Collector Current vs. Ambient Temperature 175 10-6 VCE = 2 V Ee = 0.1 mW/cm2 VCE = 10 V Relative collector current (%) Collector dark current I CEO (A) 10-7 10-8 10-9 10-10 10-11 150 125 100 75 10-12 10-13 -25 0 25 50 75 50 -25 100 0 100 Fig. 6 Collector Current vs. Collector-Emitter Voltage Fig. 4 Collector Current vs. Irradiance VCE = 2 V Ta = 25°C 16 Ta = 25°C 2 Collector current IC (mA) 14 Collector current IC (mA) 75 Ambient temperature Ta (°C) Ambient temperature Ta (°C) 50 50 25 10 12 /cm Ee .2 =0 mW 2 10 5 0.1 /cm mW 8 PC (MAX.) 2 /cm 0.1 mW 6 m 0.08 mW/c 4 0.06 mW/cm 2 0.04 mW/cm 0.02 mW/cm2 2 2 2 1 10-1 Irradiance Ee 1 0 0 (mW/cm2) 2 4 6 8 10 12 14 16 Collector-emitter voltage VCE (V) Graph data is for reference only and is not guaranteed data. Sheet No.: D1-A01501EN 4 PT483F1E000F Fig. 7 Response Time vs. Load Resistance Fig. 10 Collector-to-Emitter Saturation Voltage vs. Irradience 1000 (Ta = 25°C) td 10 ts 20 mA 10 mA 5 mA 1.6 2 mA tf IC = 0.5 mA 1.8 tr 100 1 mA 2.0 Collector-emitter saturation voltage VCE(sat) (V) Response time (μs) VCE = 2 V IC = 10 mA Ta = 25°C 1.4 1.2 1.0 0.8 1 100 10 5000 1000 0.6 0.005 0.01 Load resistance RL (Ω) 0.02 0.05 0.1 0.2 Irradiance Ee (mW/cm Fig. 8 Test Circuit for Response Time 0.5 1 2) Fig. 11 Relative Output vs Distance Input (Emitter: GL480E00000F) 100 Output 90% 50 10% 20 RL VCC td Relative output (%) Output ts tf tr Fig. 9 Sensitivity vs. Axis (TYP.) -20° -10° 0° +10° 100 (Ta = 25°C) +20° -60° -70° Relative sensitivity (%) -50° 5 2 1 0.5 +30° -30° -40° 10 80 0.2 0.5 1 2 5 10 20 50 Distance between emitter and detector (mm) +40° 60 0° 40 +50° +60° 20 -80° +70° +80° 0 Angular displacement q Graph data is for reference only and is not guaranteed data. Sheet No.: D1-A01501EN 5 PT483F1E000F ■ Design Notes 1. This product is not designed to resist electromagnetic and ionized-particle radiation. ■ Manufacturing Guidelines ● Soldering Instructions 1. Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part are pre-coated with lead-free solder. 2. If hand soldering, use temperatures ≤ 260°C for ≤ 5 seconds. 3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process. Fig. 12 Soldering Area 1.4 mm Solderable ● Cleaning Instructions 1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production conditions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. Sheet No.: D1-A01501EN 6 PT483F1E000F ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). • Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) Toxic and Hazdardous Substances Category Photo Transistor Lead (Pb) mercury (Hg) Cadmium (Cd) ✓ ✓ ✓ Hexavalent chromiun (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) ✓ ✓ ✓ NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard. Sheet No.: D1-A01501EN 7 PT483F1E000F ■ Packing Specifications 1. Parts are packed in an antistatic bag, with 100 pieces per bag. 2. Bags are secured in a box as shown in Figure 13. 3. Product mass: 0.09 g (approximately) Fig. 13 Packing Composition Product (100 pcs) Inner packing Antistatic plastic bag Bag is stapled in 2 places NOTES: 1. Inner packing material: Antistatic plastic bag (PVAL: Polyvinyl Alchol) 2. Quantity: 100 pcs/bag Outer packing Cushioning material (2 sheets) Antistatic plastic bag with products (10 bags) Cushioning material (2 sheets) Packing case Cellophane tape NOTES: 1. Outer material: Packing case (Corrugated cardboard), Cushioning material (Urethane), Cellophane tape 2. Quantity: 1000 pcs/box 3. Regular packaged mass: Approximately 245 g 4. Indication: Model No., Quantity, and Lot. No. Model No., Quantity, and Lot. No. Sheet No.: D1-A01501EN 8 PT483F1E000F ■ Important Notices --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba) · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: Sheet No.: D1-A01501EN 9