SHENZHENFREESCALE MC4614A

Freescale
AO4614A/ MC4614A
N & P-Channel 40-V (D-S) MOSFET
Key Features:
• Low rDS(on) trench technology
• Low thermal impedance
• Fast switching speed
PRODUCT SUMMARY
rDS(on) (mΩ)
VDS (V)
42 @ VGS = 10V
40
60 @ VGS = 4.5V
90 @ VGS = -10V
-40
125 @ VGS = -4.5V
ID (A)
5.8
4.8
-3.9
-3.4
Typical Applications:
• White LED boost converters
• Automotive Systems
• Industrial DC/DC Conversion Circuits
ABSOLUTE MAXIMUM RATINGS (TA = 25°C UNLESS OTHERWISE NOTED)
Parameter
Symbol Nch Limit Pch Limit
VDS
Drain-Source Voltage
40
-40
VGS
Gate-Source Voltage
±20
±20
TA=25°C
5.8
-3.9
ID
Continuous Drain Current a
TA=70°C
4.5
-3.1
IDM
Pulsed Drain Current b
20
-20
a
I
2.6
-2.5
Continuous Source Current (Diode Conduction)
S
T
=25°C
2.1
2.1
A
PD
Power Dissipation a
TA=70°C
1.3
1.3
TJ, Tstg
-55 to 150
Operating Junction and Storage Temperature Range
Maximum Junction-to-Ambient a
THERMAL RESISTANCE RATINGS
Parameter
t <= 10 sec
Steady State
Symbol Maximum
62.5
RθJA
110
Units
V
A
A
W
°C
Units
°C/W
Notes
a.
Surface Mounted on 1” x 1” FR4 Board.
b.
Pulse width limited by maximum junction temperature
1
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AO4614A/ MC4614A
Electrical Characteristics
Parameter
Gate-Source Threshold Voltage
Symbol
VGS(th)
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current a
ID(on)
Drain-Source On-Resistance a
rDS(on)
Forward Transconductance a
gfs
Diode Forward Voltage a
VSD
Test Conditions
Static
VDS = VGS, ID = 250 uA (N-ch)
VDS = VGS, ID = -250 uA (P-ch)
VDS = 0 V, VGS = ±20 V
VDS = 32 V, VGS = 0 V
(N-ch)
VDS = -32 V, VGS = 0 V (P-ch)
VDS = 5 V, VGS = 10 V
(N-ch)
VDS = -5 V, VGS = -10 V (P-ch)
VGS = 10 V, ID = 5.3 A
(N-ch)
VGS = 4.5 V, ID = 4.4 A (N-ch)
VGS = -10V, ID = -3.6 A (P-ch)
VGS = -4.5 V, ID = -2.6 A (P-ch)
VDS = 15 V, ID = 5.3 A
(N-ch)
VDS = -15 V, ID = -3.6 A (P-ch)
IS = 1.3 A, VGS = 0 V
(N-ch)
IS = -1.2 A, VGS = 0 V
(P-ch)
Min
Typ
Max
1
-1
±100
1
-1
10
-10
Unit
V
V
nA
uA
A
A
42
60
90
125
13
11
0.77
-0.81
mΩ
mΩ
S
S
V
V
Dynamic b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
N - Channel
VDS = 20 V, VGS = 10 V, ID = 5.3 A
N - Channel
VDD = 20 V, RL = 3.5 Ω, ID = 5.3 A,
VGEN = 10 V, RGEN = 6 Ω
N - Channel
VDS = 15 V, VGS = 0 V, f = 1 MHz
P - Channel
VDS = -20 V, VGS = -10 V, ID = -3.6 A
P - Channel
VDD = -20 V, RL = 5.5 Ω, ID = -3.6 A,
VGEN = -10 V, RGEN = 6 Ω
P - Channel
VDS = -15 V, VGS = 0 V, f = 1 MHz
2
3.6
1.3
1.4
2
18
16
5
287
42
34
5.8
1.6
2.3
4
5
17
7
384
36
36
nC
ns
pF
nC
ns
pF
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AO4614A/ MC4614A
Typical Electrical Characteristics - N-channel
5
0.15
4
3V
ID - Drain Current (A)
RDS(on) - On-Resistance(Ω)
TJ = 25°C
0.1
3.5V
0.05
4V,4.5V,6V,8V,10V
3
2
1
0
0
0
2
4
6
8
10
0
2
4
VGS - Gate-to-Source Voltage (V)
ID-Drain Current (A)
1. On-Resistance vs. Drain Current
2. Transfer Characteristics
10
0.3
TJ = 25°C
IS - Source Current (A)
RDS(on) - On-Resistance(Ω)
TJ = 25°C
ID = 5.3A
0.2
0.1
0
1
0.1
0.01
0
2
4
6
8
10
0
VGS - Gate-to-Source Voltage (V)
0.2
0.4
0.6
0.8
1
1.2
1.4
VSD - Source-to-Drain Voltage (V)
3. On-Resistance vs. Gate-to-Source Voltage
4. Drain-to-Source Forward Voltage
10
500
F = 1MHz
10V,8V,6V,4.5V,4V
8
400
Capacitance (pf)
ID - Drain Current (A)
6
3.5V
6
3V
4
Ciss
300
200
2
100
0
0
Coss
Crss
0
0.2
0.4
0.6
0.8
0
5
10
15
20
VDS-Drain-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
5. Output Characteristics
6. Capacitance
3
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Freescale
AO4614A/ MC4614A
Typical Electrical Characteristics - N-channel
2
VDS = 20V
ID = 5.3A
RDS(on) - On-Resistance(Ω)
(Normalized)
VGS-Gate-to-Source Voltage (V)
10
8
6
4
2
1.5
1
0.5
0
-50
0
2
4
6
Qg - Total Gate Charge (nC)
0
25
50
75
100
125
150
TJ -JunctionTemperature(°C)
7. Gate Charge
8. Normalized On-Resistance Vs
Junction Temperature
30
PEAK TRANSIENT POWER (W)
100
10 uS
100 uS
10
1 mS
ID Current (A)
-25
8
10 mS
100 mS
1
1 SEC
10 SEC
100 SEC
0.1
1
DC
Idm limit
25
20
15
10
5
Limited by
RDS
0
0.001
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
VDS Drain to Source Voltage (V)
t1 TIME (SEC)
9. Safe Operating Area
10. Single Pulse Maximum Power Dissipation
1
D = 0.5
0.2
0.1
RθJA(t) = r(t) + RθJA
RθJA = 110°C /W
0.1
0.05
0.02
Single Pulse
P(pk)
t1
t2
0.01
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1 TIME (sec)
11. Normalized Thermal Transient Junction to Ambient
4
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Freescale
AO4614A/ MC4614A
Typical Electrical Characteristics - P-channel
5
TJ = 25°C
4
ID - Drain Current (A)
RDS(on) - On-Resistance(Ω)
0.3
0.2
3.5V
4V
0.1
4.5V,6V,8V,10V
3
2
1
0
0
0
1
2
3
4
ID-Drain Current (A)
0
5
2
1. On-Resistance vs. Drain Current
10
TJ = 25°C
ID = -3.6A
TJ = 25°C
IS - Source Current (A)
0.6
0.4
0.2
0
1
0.1
0.01
0
2
4
6
0
VGS - Gate-to-Source Voltage (V)
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
VSD - Source-to-Drain Voltage (V)
3. On-Resistance vs. Gate-to-Source Voltage
4. Drain-to-Source Forward Voltage
600
4
F = 1MHz
10V,8V,6V,4.5V,4V
500
Ciss
3
Capacitance (pf)
RDS(on) - On-Resistance(Ω)
6
2. Transfer Characteristics
0.8
ID - Drain Current (A)
4
VGS - Gate-to-Source Voltage (V)
3.5V
2
400
300
200
1
100
0
Coss
Crss
0
0
0.2
0.4
0.6
0
5
10
15
20
VDS-Drain-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
5. Output Characteristics
6. Capacitance
5
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Freescale
AO4614A/ MC4614A
Typical Electrical Characteristics - P-channel
10
2
ID = -3.6A
RDS(on) - On-Resistance(Ω)
(Normalized)
VGS-Gate-to-Source Voltage (V)
VDS = -20V
8
6
4
2
1.5
1
0
0.5
0
5
10
15
-50
-25
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
TJ -JunctionTemperature(°C)
7. Gate Charge
8. Normalized On-Resistance Vs
Junction Temperature
100
PEAK TRANSIENT POWER (W)
30
10 uS
100 uS
10
1 mS
ID Current (A)
0
10 mS
100 mS
1
1 SEC
10 SEC
100 SEC
0.1
1
DC
Idm limit
Limited by
RDS
25
20
15
10
0
0.001
0.01
0.1
1
10
100
5
1000
0.01
0.1
1
10
100
1000
VDS Drain to Source Voltage (V)
t1 TIME (SEC)
9. Safe Operating Area
10. Single Pulse Maximum Power Dissipation
1
D = 0.5
0.2
0.1
RθJA(t) = r(t) + RθJA
RθJA = 110°C /W
0.1
0.05
0.02
Single Pulse
P(pk)
t1
t2
0.01
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1 TIME (sec)
11. Normalized Thermal Transient Junction to Ambient
6
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Freescale
AO4614A/ MC4614A
Package Information
Note:
1. All Dimension Are In mm.
2. Package Body Sizes Exclude Mold Flash, Protrusion Or Gate Burrs. Mold Flash, Protrusion Or Gate Burrs Shall
Not Exceed 0.10 mm Per Side.
3. Package Body Sizes Determined At The Outermost Extremes Of The Plastic Body Exclusive Of Mold Flash, Tie
Bar Burrs, Gate Burrs And Interlead Flash, But Including Any Mismatch Between The Top And Bottom Of The
Plastic Body.
4. The Package Top May Be Smaller Than The Package Bottom.
5. Dimension "B" Does Not Include Dambar Protrusion. Allowable Dambar Protrusion Shall Be 0.08 mm Total In
Excess Of "B" Dimension At Maximum Material Condition. The Dambar Cannot Be Located On The Lower Radius
Of The Foot.
7
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