COM-965 07 COM Express CPU Module with Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processors COM Express CPU Modules Features Dual-channel DDR2 SODIMM 2-pin Wafer for RTC Battery µFC-PGA (Socket P) ICH8M Intel ® 82566MM Gigabit Ethernet Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processors Intel® GME965 + ICH8M Dual-channel DDR2 SODIMM 533/667 Memory, Max. 4 GB Gigabit Ethernet CRT, Up To 24-bit Dual-channel LVDS LCD, SDVO High Definition Audio Interface PATA x 1, SATA 3.0Gb/s x 3 USB2.0 x 8 PCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5 Wide DC Input Range, +8.5V To +19V (Optional) COM Express Basic Module Pin-out Type 2, COM.0 Rev. 1.0 GME965 Specifications System Form Factor COM Express basic module, Pin-out Type 2, COM.0 Rev. 1.0 Processor Intel® Core™ 2 Duo/ Celeron® M (Socket-P based) processors System Memory 200-pin DDR2 SODIMM x 2, Max. 4 GB (DDR2 533/667), supports dualchannel function Chipset Intel® GME965 + ICH8M I/O Chipset ICH8M Ethernet Intel® 82566MM, 10/100/1000Base-TX TPM v1.2, Infineon SLB9635TT1.2 BIOS Award BIOS v6.0 SPI Type, 2 MB ROM EEPROM Atmel® AT24C02, save BIOS and configuration data (Optional) Wake on LAN Yes Watchdog Timer Fintek F75111 H/W Status Monitoring Supports CPU temperature monitoring Expansion Interface PCI-Express [x16] x 1 (Shared with 2 SDVO ports) PCI-Express [x1] x 5 32-bit PCI x 4 LPC bus x 1 SMBus x 1 I2C x 1 Power Requirement Wide DC input range, +8.5V to +19V (Optional) Nominal: +12V 2-pin wafer for RTC battery Power Consumption (Typical) Intel® T7500 2.2GHz, DDR2 667 1 GB 3.7A @ +12V, 0.8A @ +5V (w/ECB-916M) Board Size 4.92”(L) x 3.74"(W) (125mm x 95mm) Gross Weight Operating Temperature Storage Temperature 0.66 lb (0.3 Kg) Operating Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 100,000 Display Supports CRT/LCD simultaneous/ dual view displays Chipset Intel® GME965 integrated Memory Shared system memory up to 384 MB/ DVMT 4.0 Resolution Up to 2048 x 1536 (QXGA) @ 60 Hz for CRT Up to 2048 x 1536 (QXGA) for LCD LCD Interface Up to 24-bit dual-channel LVDS SDVO/ DVO/ Side Port Supports SDVO x 2 (Shared with PCI-Express [x16]) 32°F ~ 140°F (0°C ~ 60°C) -40°F ~ 176°F (-40°C ~ 80°C) For Wide Temperature series of this model, please refer to Chapter 1 Wide Temperature Boards, to get detailed specification of COM-965W1. Packing list • M2.5 Screw x 5 • Product CD • COM-965 Ordering Information • TF-COM-965-A10 COM Express CPU Module, Socket P, Dual DDR2, Gigabit Ethernet, USB2.0, Rev. A1.0 • TF-COM-965-A10-01 COM Express CPU Module, Socket P, Dual DDR2, Gigabit Ethernet, USB2.0, TPM, Rev. A1.0 Optional Accessories • TF-ECB-916M-A10-01 COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express, AT/ATX, Rev. A1.0 • TF-PER-A051 CPU Cooler, For COM-965/COM-45SP, Socket-type CPU, 12V Fan • TF-PER-A052 CPU Cooler, For COM-965/COM-45SP, Onboard CPU, 12V Fan • TF-PER-A082 Passive Heat-sink, For COM-965/COM-45SP, Socket-type CPU • TF-PER-A067 Passive Heat-sink, For COM-965/COM-45SP, Onboard CPU • TF-PER-A072 Heat Spreader Kit, For COM-965/COM-45SP, Socket-type CPU • TF-PER-A066 Heat Spreader Kit, For COM-965/COM-45SP, Onboard CPU I/O 07-5 Storage PATA x 1 (Two devices), SATA 3.0Gb/s x 3 USB USB2.0 x 8 Audio High definition audio GPIO Up to 4 in or 4 out Note: All specifications are subject to change without notice.