Express-IBR Extreme Rugged™ COM Express® Type 6 Module with 3rd Generation Intel® Core™ i3/i7 Processor Features Type 6 Quad/dual core 3rd Generation Intel® Core™ Processor Mobile Intel® QM77 Express Chipset Up to 16GB ECC 1600MHz DDR3 memory in two SODIMM sockets Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for graphics (or general purpose x8/4/1) 2x SATA 6 Gb/s, 2x SATA 3 Gb/s, Gigabit Ethernet, USB 2.0, 4 USB 3.0 COM Express® COM.0 R2.1 Type 6 Pinout Extended Temperature: -40°C to +85°C 50% Thicker PCB for high vibration environments Specifications Multi I/O Core System CPU Memory BIOS Hardware Monitor Debug Interface Watchdog Timer Expansion Busses Technologies 3rd Generation Intel® Core™ i7/i3, 22nm process, BGA type Intel® Core™ i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB L3 cache, 45W, quad core Intel® Core™ i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB L3 cache, 35W, quad core Intel® Core™ i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB L3 cache, 25W, dual core Intel® Core™ i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB L3 cache, 17W, dual core Intel® Core™ i3-3217UE 1.6GHz, 3MB L3 cache, 17W, dual core Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in dual SODIMM sockets AMI EFI with CMOS backup in 16 Mb SPI flash Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Programmable timer range to generate RESET PCI Express x16 (Gen3) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4) 7 PCI Express x1: Lanes 0/1/2/3/4/5/6 LPC bus, SMBus (system), I2C (user) PAVP 3.0, Intel® AMT 8.0, Intel® VT, Intel® AES-NI, Intel® HT, Intel® HD Graphics with Dynamic Frequency, Intel® Turbo Boost , Dynamic Turbo, Intel® AVX 1.0, Intel® Quick Sync Video Video Integrated in Processor Intel® HD Graphics 4000 at 650-1300 MHz Integrated Video DirectX 11.0, OpenGL 3.1, and OCL 1.1 Media Processing Decode (HW JPEG & MJPEG decode), encode (full HW MPEG2 encode), transcode Intel® Clear Video HD Technology + enhanced media processing VGA Interface Analog VGA support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug LVDS Interface Dual channel 18/24-bit LVDS Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO Chipset USB SATA Integrated on Mobile Intel® QM77 Express chipset Supports up to eight ports USB 2.0, 4 USB 3.0 Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID 0,1,5,10 Super I/O Connected to LPC bus on carrier if needed (BIOS supports W83627DHG) TPM (optional) Chipset Type Atmel AT97SC3204-U1A190 TPM 1.2 Power Input Power AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Power States Supports S0, S1, S3, S4, S5 Power Consumption 12W typical (i7-36xxQE) 8W typical (i7-3555LE/i7-3517UE/i3-3217UE) S3: 0.85W S5: 0.55W Smart Battery Support Yes (BIOS supports LTC4100 and LTC1760) Mechanical and Environmental Size Board Thickness Operating Temperature Storage Temperature Humidity Shock Vibration Compatibility Certifications COM Express Basic, 125 mm x 95 mm 0.093” (2.3mm) Standard: -20°C to 70°C Extended: -40°C to 85°C -55°C to 85°C 90% at 60°C non-condensing 50G peak-to-peak, 11ms duration, MIL-STD-202G Method 213B Operating: 11.96 Grms, 50-20,000 Hz, each axis, MIL-STD-202G Method 214A PICMG COM Express COM.0 R2.1 Type 6 CE, FCC, HALT Operating Systems Audio Chipset Audio Codec Integrated on Mobile Intel QM77 Express chipset Implemented on carrier board ® Ethernet Chipset Speed Intel® Gigabit LAN PHY WG82579LM 10/100/1000 Mbps Ethernet 17 Standard Support Windows 7 Linux Extended Support (BSP) Windows XPe/7, WEC 7 Linux, VxWorks 6.9, QNX 6.5 AIDI Library http://www.adlinktech.com/Computer-on-Module Functional Diagram SODIMM 1 Processor XDP SFF26 3rd Gen Intel® Core™ i7 Processor Quad & Dual Core 1600 MHz 1~8 GB ECC DDR3 SODIMM 2 1600 MHz 1~8 GB ECC DDR3 PCI Express x16 (Gen2) FDI DMI 2 x8 or 1x8 + 2x4 VGA Dual channel 18/24-bit LVDS DDI 1 DP / HDMI / DVI / SDVO 6x PCIe x1 (port 0~5) GbE LAN 82579 DDI 2 DP / HDMI / DVI PCIe x1 (port 7) PCH HDA Audio 2x SATA 6 Gb/s + 2x SATA 3 Gb/s 8x USB 2.0 (channel 0/7) Mobile Intel® QM77 Express Chipset DDI 3 DP / HDMI / DVI / eDP 4x USB 3.0 PCIe x1 (port 6) TPM Debug header AT97SC3204 LPC bus 4x GPI 4x GP0 GPIO Monitor PCA9535 ADT7490 SPI 0 BIOS SMBus SPI 1 I2C LVDS DDC I2C WDT BC SPI Ordering Information Accessories Modules Model Number Description/Configuration Model Number Express-IBR-i7-R-3615QE Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3615QE 2.3GHz 45W Quad Core CPU, two DDR3 ECC SODIMMs supported Heat Spreaders (for use with customer supplied thermal solution) Express-IBR- i7-R-3612QE Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3612QE 2.1GHz 35W Quad Core CPU , two DDR3 ECC SODIMMs supported Express-IBR-i7-R-3555LE Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3555LE 2.5GHz 25W Dual Core CPU, two DDR3 ECC SODIMMs supported Express-IBR-i7-R-3517UE Extreme Rugged COM Express Type 6 module with Intel® Core™ i7-3517UE 1.7GHz 17W Dual Core CPU, two DDR3 ECC SODIMMs supported Express-IBR-i3-R-3217UE Extreme Rugged COM Express Type 6 module with Intel® Core™ i3-3217UE 1.6GHz 17W Dual Core CPU, two DDR3 ECC SODIMMs supported Description/Configuration HTS-IBR-BTF Heat spreader for Express-IBR with through-hole standoffs for top-mounting HTS-IBR-B Heat spreader for Express-IBR with threaded standoffs for bottom-mounting Passive Heatsinks (for use with 17 and 25W CPUs) THSH-IBR-BTL Heatsink for Express-IBR with through-hole standoffs for top-mounting Active Heatsinks (recommended for 35 and 45W CPUs) THSF-IBR-BTL-CU Heatsink with FAN for Express-IBR with through-hole standoffs for top-mounting 18 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: Express-IBR-i7-R-3517UE Express-IBR-i7-R-3555LE