NSC LMC555CTP

LMC555
CMOS Timer
General Description
Features
The LMC555 is a CMOS version of the industry standard
555 series general purpose timers. In addition to the standard package (SOIC, MSOP, and MDIP) the LMC555 is also
available in a chip sized package (8 Bump micro SMD) using
National’s micro SMD package technology. The LMC555
offers the same capability of generating accurate time delays
and frequencies as the LM555 but with much lower power
dissipation and supply current spikes. When operated as a
one-shot, the time delay is precisely controlled by a single
external resistor and capacitor. In the stable mode the oscillation frequency and duty cycle are accurately set by two
external resistors and one capacitor. The use of National
Semiconductor’s LMCMOS™ process extends both the frequency range and low supply capability.
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Less than 1 mW typical power dissipation at 5V supply
3 MHz astable frequency capability
1.5V supply operating voltage guaranteed
Output fully compatible with TTL and CMOS logic at 5V
supply
Tested to −10 mA, +50 mA output current levels
Reduced supply current spikes during output transitions
Extremely low reset, trigger, and threshold currents
Excellent temperature stability
Pin-for-pin compatible with 555 series of timers
Available in 8-pin MSOP Package and 8-Bump micro
SMD package
Pulse Width Modulator
00866915
00866920
Ordering Information
Package
Temperature Range
Package Marking
Transport Media
NSC Drawing
Industrial
−40˚C to +85˚C
8-Pin Small Outline (SO)
LMC555CM
LMC555CMX
8-Pin Mini Small Outline
(MSOP)
LMC555CMM
LMC555CMMX
8-Pin Molded Dip (MDIP)
LMC555CN
8-Bump micro SMD
LMC555CBP
LMC555CBPX
8-Bump micro SMD
NOPB
LMC555CTP
LMC555CTPX
LMC555CM
ZC5
LMC555CN
F1
F02
Rails
2.5k Units Tape and Reel
1k Units Tape and Reel
3.5k Units Tape and Reel
Rails
250 Units Tape and Reel
3k Units Tape and Reel
250 Units Tape and Reel
3k Units Tape and Reel
M08A
MUA08A
N08E
BPA08EFB
TPA08EFA
Note: See Mil-datasheet MNLMC555-X for specifications on the military device LMC555J/883.
LMCMOS™ is a trademark of National Semiconductor Corp.
© 2006 National Semiconductor Corporation
DS008669
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LMC555 CMOS Timer
May 2006
LMC555
Connection Diagrams
8-Pin SOIC, MSOP, MDIP
00866901
Top View
8-Bump micro SMD
00866909
Top View
(Bump Side Down)
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2
LMC555
Absolute Maximum Ratings (Notes 2, 3)
Thermal Resistance (θJA) (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
SO, 8-Pin Small
Outline
169˚C/W
MSOP, 8-Pin
Mini Small
Outline
225˚C/W
MDIP, 8-Pin
Molded Dip
111˚C/W
8-Bump micro
SMD
220˚C/W
Supply Voltage, V+
15V
Input Voltages, VTRIG, VRES, VCTRL,
VTHRESH
−0.3V to VS + 0.3V
Output Voltages, VO, VDIS
15V
Output Current IO, IDIS
100 mA
Storage Temperature Range
−65˚C to +150˚C
Maximum
Allowable Power
Dissipation @25˚C
Soldering Information
MDIP Soldering (10 seconds)
260˚C
SOIC, MSOP Vapor Phase (60 sec)
215˚C
SOIC, MSOP Infrared (15 sec)
220˚C
MDIP-8
Note: See AN-450 “Surface Mounting Methods and Their Effect on Product
Reliability” for other methods of soldering surface mount devices.
740 mW
MSOP-8
555 mW
8 Bump micro
SMD
Operating Ratings(Notes 2, 3)
Termperature
Range
1126 mW
SO-8
568 mW
−40˚C to +85˚C
Electrical Characteristics (Notes 1, 2)
Test Circuit, T = 25˚C, all switches open, RESET to VS unless otherwise noted
Symbol
Parameter
IS
Supply Current
VCTRL
Control Voltage
Conditions
Min
VS = 1.5V
VS = 5V
VS = 12V
VS = 1.5V
VS = 5V
VS = 12V
0.8
2.9
7.4
Typ
Max
Units
(Limits)
50
100
150
150
250
400
µA
1.0
3.3
8.0
1.2
3.8
8.6
V
VDIS
Discharge Saturation Voltage VS = 1.5V, IDIS = 1 mA
VS = 5V, IDIS = 10 mA
75
150
150
300
mV
VOL
Output Voltage (Low)
0.2
0.3
1.0
0.4
0.6
2.0
V
VS = 1.5V, IO = 1 mA
VS = 5V, IO = 8 mA
VS = 12V, IO = 50 mA
Output Voltage
(High)
VS = 1.5V, IO = −0.25 mA
VS = 5V, IO = −2 mA
VS = 12V, IO = −10 mA
1.0
4.4
10.5
1.25
4.7
11.3
VTRIG
Trigger Voltage
VS = 1.5V
VS = 12V
0.4
3.7
0.5
4.0
ITRIG
Trigger Current
VS = 5V
VRES
Reset Voltage
VS = 1.5V (Note 4)
VS = 12V
0.4
0.4
0.7
0.75
IRES
Reset Current
VS = 5V
10
ITHRESH
Threshold Current
VS = 5V
10
IDIS
Discharge Leakage
VS = 12V
1.0
100
t
Timing Accuracy
SW 2, 4 Closed
VS = 1.5V
VS = 5V
VS = 12V
1.1
1.1
1.1
1.25
1.20
1.25
VOH
∆t/∆VS
Timing Shift with Supply
V
0.6
4.3
10
0.9
1.0
1.0
VS = 5V ± 1V
0.3
3
V
pA
1.0
1.1
V
pA
pA
nA
ms
%/V
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LMC555
Electrical Characteristics (Notes 1, 2)
Test Circuit, T = 25˚C, all switches open, RESET to VS unless otherwise noted (Continued)
Symbol
Parameter
Conditions
Min
∆t/∆T
Timing Shift with
Temperature
fA
Astable Frequency
SW 1, 3 Closed, VS = 12V
fMAX
Maximum Frequency
Max. Freq. Test Circuit, VS = 5V
3.0
MHz
t R , tF
Output Rise and
Fall Times
Max. Freq. Test Circuit
VS = 5V, CL = 10 pF
15
ns
tPD
Trigger Propagation Delay
VS = 5V, Measure Delay
from Trigger to Output
100
ns
VS = 5V
−40˚C ≤ T ≤ +85˚C
Typ
Max
75
4.0
4.8
Units
(Limits)
ppm/˚C
5.6
kHz
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations.
Note 4: If the RESET pin is to be used at temperatures of −20˚C and below VS is required to be 2.0V or greater.
Note 5: For device pinout please refer to table 1
Test Circuit (Note 5)
Maximum Frequency Test Circuit (Note 5)
00866903
00866902
TABLE 1. Package Pinout Names vs. Pin Function
Pin Function
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Package Pin numbers
8-Pin SO, MSOP, and MDIP
8-Bump micro SMD
GND
1
A3
Trigger
2
B3
Output
3
C3
Reset
4
C2
Control Voltage
5
C1
Threshold
6
B1
Discharge
7
A1
V+
8
A2
4
MONOSTABLE OPERATION
In this mode of operation, the timer functions as a one-shot
(Figure 1). The external capacitor is initially held discharged
by internal circuitry. Upon application of a negative trigger
pulse of less than 1/3 VS to the Trigger terminal, the flip-flop
is set which both releases the short circuit across the capacitor and drives the output high.
Note: In monstable operation, the trigger should be driven high before the
end of timing cycle.
00866911
00866904
FIGURE 3. Time Delay
FIGURE 1. Monostable (One-Shot)
The voltage across the capacitor then increases exponentially for a period of tH = 1.1 RAC, which is also the time that
the output stays high, at the end of which time the voltage
equals 2/3 VS. The comparator then resets the flip-flop which
in turn discharges the capacitor and drives the output to its
low state. Figure 2 shows the waveforms generated in this
mode of operation. Since the charge and the threshold level
of the comparator are both directly proportional to supply
voltage, the timing internal is independent of supply.
ASTABLE OPERATION
If the circuit is connected as shown in Figure 4 (Trigger and
Threshold terminals connected together) it will trigger itself
and free run as a multivibrator. The external capacitor
charges through RA + RB and discharges through RB. Thus
the duty cycle may be precisely set by the ratio of these two
resistors.
00866910
VCC = 5V
Top Trace: Input 5 V/Div.
TIME = 0.1 ms/Div.
RA = 9.1 kΩ
00866905
Middle Trace: Output 5 V/Div.
Bottom Trace: Capacitor Voltage 2 V/Div.
FIGURE 4. Astable (Variable Duty Cycle Oscillator)
C = 0.01 µF
In this mode of operation, the capacitor charges and discharges between 1/3 VS and 2/3 VS. As in the triggered
mode, the charge and discharge times, and therefore the
frequency are independent of the supply voltage.
Figure 5 shows the waveform generated in this mode of
operation.
FIGURE 2. Monostable Waveforms
Reset overrides Trigger, which can override threshold.
Therefore the trigger pulse must be shorter than the desired
tH. The minimum pulse width for the Trigger is 20ns, and it is
400ns for the Reset. During the timing cycle when the output
is high, the further application of a trigger pulse will not effect
the circuit so long as the trigger input is returned high at least
10µs before the end of the timing interval. However the
circuit can be reset during this time by the application of a
5
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LMC555
negative pulse to the reset terminal. The output will then
remain in the low state until a trigger pulse is again applied.
When the reset function is not use, it is recommended that it
be connected to V+ to avoid any possibility of false triggering.
Figure 3 is a nomograph for easy determination of RC values
for various time delays.
Application Information
LMC555
Application Information
FREQUENCY DIVIDER
(Continued)
The monostable circuit of Figure 1 can be used as a frequency divider by adjusting the length of the timing cycle.
Figure 7 shows the waveforms generated in a divide by three
circuit.
00866912
VCC = 5V
Top Trace: Output 5 V/Div.
TIME = 20 µs/Div.
Bottom Trace: Capacitor Voltage 1 V/Div.
RA = 3.9 kΩ
00866914
RB = 9 kΩ
VCC = 5V
Top Trace: Input 4 V/Div.
C = 0.01 µF
TIME = 20 µs/Div.
Middle Trace: Output 2 V/Div.
RA = 9.1 kΩ
Bottom Trace: Capacitor 2 V/Div.
C = 0.01 µF
FIGURE 5. Astable Waveforms
The charge time (output high) is given by
t1 = 0.693 (RA + RB)C
And the discharge time (output low) by:
t2 = 0.693 (RB)C
Thus the total period is:
T = t1 + t2 = 0.693 (RA + RB)C
FIGURE 7. Frequency Divider Waveforms
PULSE WIDTH MODULATOR
When the timer is connected in the monostable mode and
triggered with a continuous pulse train, the output pulse
width can be modulated by a signal applied to the Control
Voltage Terminal. Figure 8 shows the circuit, and in Figure 9
are some waveform examples.
The frequency of oscillation is:
Figure 6 may be used for quick determination of these RC
Values. The duty cycle, as a fraction of total period that the
output is low, is:
00866920
FIGURE 8. Pulse Width Modulator
00866913
FIGURE 6. Free Running Frequency
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LMC555
Application Information
(Continued)
00866916
VCC = 5V
TIME = 0.1 ms/Div.
00866915
VCC = 5V
Top Trace: Modulation 1 V/Div.
TIME = 0.2 ms/Div.
Top Trace: Modulation Input 1 V/Div.
Bottom Trace: Output Voltage 2 V/Div.
RA = 3.9 kΩ
Bottom Trace: Output Voltage 2 V/Div.
RB = 3 kΩ
RA = 9.1 kΩ
C = 0.01 µF
C = 0.01 µF
FIGURE 11. Pulse Position Modulator Waveforms
FIGURE 9. Pulse Width Modulator Waveforms
50% DUTY CYCLE OSCILLATOR
The frequency of oscillation is
f = 1/(1.4 RCC)
PULSE POSITION MODULATOR
This application uses the timer connected for astable operation, as in Figure 10, with a modulating signal again applied
to the control voltage terminal. The pulse position varies with
the modulating signal, since the threshold voltage and hence
the time delay is varied. Figure 11 shows the waveforms
generated for a triangle wave modulation signal.
00866906
FIGURE 12. 50% Duty Cycle Oscillator
00866921
FIGURE 10. Pulse Position Modulator
micro SMD Marking Orientation
Top View
00866923
Bumps are numbered counter-clockwise
7
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LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted
Molded Small Outline (SO) Package (M)
NS Package Number M08A
8-Pin (0.118” Wide) Molded Mini Small Outline Package
NS Package Number MUA08A
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8
LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Molded Dual-in-line Package (N)
NS Package Number N08E
9
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LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
NS Package Number BPA08EFB
X1 = 1.387 X2 = 1.412 X3 = 0.850
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10
LMC555 CMOS Timer
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package
NS Package Number TPA08EFA
X1 = 1.387 X2 = 1.412 X3 = 0.500
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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LMC555 CMOS Timer
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