REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED 91-11-27 M. A. FRYE Sheet 4, Table I, trigger current; with VDD = 15 V, change maximum limit from A 50 nA to 100 nA; with VDD = 18 V, change maximum limit from 50 nA to 100 nA. Sheet 5, Table I, threshold current; with VDD = 15 V, change maximum limit from 50 nA to 100 nA; with VDD = 18 V, change maximum limit from 50 nA to 100 nA. Sheet 6, Table I, low level output voltage, device types 03 and 04, with VDD = 18 V, change IOL = 20 mA to IOL = 3.2 mA. Sheet 7, reset current; with VDD = 15 V, change maximum value from 50 nA to 100 nA; with VDD = 18 V, change maximum limit from 50 nA to 100 nA. Sheet 8, figure 1, for device type 03, add case outline “P”. Sheet 15, paragraph 6.6, add vendor CAGE number 44720. Changes in accordance with N.O.R. 5962-R054-92. B Table I, for device type 01 only, add reset voltage level test. Changes in accordance with N.O.R. 5962-R063-93. 93-01-19 M. A. FRYE C Add device type 05. Add vendor CAGE 27014. Make changes to 1.3, 1.4, table I, figures 1, 3, 4, 5, and 6. 93-05-10 M. A. FRYE Sheet 12, figure 2,device types 03, 04, and 05, for threshold D voltage 2/3 (VDD); change RESET from “low” to “high”. Changes in accordance with N.O.R. 5962-R053-94. 94-06-24 M. A. FRYE E Redrawn with changes. Technical and editorial changes throughout. 94-10-28 M. A. FRYE F Make change to ICEX test for device type 05 as specified under table I. - ro 98-01-06 R. MONNIN G Make change to VOH and VOL tests for device type 05 as specified under table I. - rrp 00-12-21 R. MONNIN H Drawing updated to reflect current requirements. - rrp 04-11-01 R. MONNIN J Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 11-02-15 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV J SHEET 15 REV STATUS REV J J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY GARY ZAHN STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY CHARLES E. B ESORE APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 89-12-04 REVISION LEVEL J MICROCIRCUIT, LINEAR, CMOS, PRECISION TIMERS, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-89503 1 OF 15 5962-E158-11 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89503 01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Generic number Device type 01 02 03 04 05 Circuit function TLC555 TLC556 7555 7556 LMC555 CMOS, precision timer, single CMOS, precision timer, dual CMOS, low power, precision timer, single CMOS, low power, precision timer, dual CMOS, low voltage, precision timer, single 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C G P 2 Descriptive designator Terminals GDIP1-T14 or CDIP2-T14 MACY1-X8 GDIP1-T8 or CDIP2-T8 CQCC1-N20 14 8 8 20 Package style Dual-in-line Can Dual-in-line Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VDD): Device types 01-04 .................................................................................. Device type 05 ......................................................................................... Input voltage range ..................................................................................... Output sink current: Device types 01 and 02 ........................................................................... Device types 03 and 04 ........................................................................... Device type 05 ......................................................................................... Output source current: Device types 01 and 02 ........................................................................... Device types 03 and 04 ........................................................................... Device type 05 ......................................................................................... Storage temperature range ......................................................................... Lead temperature (soldering, 10 seconds) .................................................. Junction temperature (TJ) ........................................................................... STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 18 V dc 15 V dc -0.3 V to VDD (+0.3 V) 150 mA 20 mA 100 mA 15 mA 0.8 mA 10 mA -65C to +150C +300C +175C SIZE 5962-89503 A REVISION LEVEL J SHEET 2 1.3 Absolute maximum ratings - continued. Power dissipation (PD): (TA = +125C): Device types 01-04: Cases C and 2 ..................................................................................... Case G ................................................................................................. Case P ................................................................................................. Device type 05: Cases C, G, P, and 2 ........................................................................... Thermal resistance, junction-to-case (JC): Cases C and P ........................................................................................ Case G: Device types 01-04 .............................................................................. Device type 05 ..................................................................................... Case 2 ..................................................................................................... Thermal resistance, junction-to-ambient (JA): Cases C and 2 ......................................................................................... Case G: Device types 01-04 .............................................................................. Device type 05 ..................................................................................... Case P: Device types 01-04 .............................................................................. Device type 05 ..................................................................................... 550 mW 23 mW 420 mW 550 mW 28C/W 70C/W 30C/W 20C/W 91C/W 150C/W 180C/W 119C/W 125C/W 1.4 Recommended operating conditions. Supply voltage range (VDD): Device types 01-02 .................................................................................. Device types 03-04 .................................................................................. Device type 05 ......................................................................................... Ambient operating temperature range (TA) ................................................. +5.0 V dc to +15.0 V dc +5.0 V dc to +18.0 V dc +1.5 V dc to +15.0 V dc -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram and circuit operation table. The block diagram and circuit operation table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Group A Device subgroups type Conditions 1/ -55C TA +125C unless otherwise specified Power supply 3/ IDD Min 1,2,3 A 01 700 02 1.4 mA 03 300 A 04 400 05 300 VDD = 12 V 05 400 VDD = 15 V 01 1000 02 2.0 mA 03 300 A 04 600 05 600 03 350 04 700 1,2,3 05 0.4 0.6 01-04 1.26 2.06 05 1.30 2.00 VDD = 12.0 V 05 3.70 4.30 VDD = 15.0 V 01-04 4.05 5.50 VDD = 18.0 V 03-04 4.70 6.85 01 0.4 1.5 0.3 1.8 VDD = 1.5 V VDD = 5.0 V Reset voltage level Max 200 VDD = 18 V VTR Unit 05 VDD = 1.5 V VDD = 5.0 V Trigger voltage Limits 2/ 1 VRESET 2,3 V V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A Device subgroups type Conditions 1/ -55C TA +125C unless otherwise specified Trigger current 3/ ITR VDD = 1.5 V, Limits 2/ Min 1,2 Unit Max 05 50 03-05 50 05 50 03,04 100 03,04 100 nA TA = +25C, +125C VDD = 5.0 V, TA = +25C, +125C VDD = 12.0 V, TA = +25C, +125C VDD = 15.0 V, TA = +25C, +125C VDD = 18.0 V, TA = +25C, +125C Threshold voltage Threshold current 3/ VTH ITH 1,2,3 05 0.70 1.90 VDD = 5.0 V All 2.70 3.90 VDD = 12.0 V 05 7.30 8.70 VDD = 15 V 01-04 9.15 10.80 VDD = 18 V 03-04 10.90 13.15 VDD = 1.5 V VDD = 1.5 V, 1,2 05 50 03-05 50 05 50 03,04 100 03,04 100 V nA TA = +25C, +125C VDD = 5.0 V, TA = +25C, +125C VDD = 12.0 V, TA = +25C, +125C VDD = 15.0 V, TA = +25C, +125C VDD = 18.0 V, TA = +25C, +125C See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A Device subgroups type Conditions 1/ -55C TA +125C unless otherwise specified High level output voltage VOH Min 1,2,3 VDD = 5.0 V, IOH = -1 mA VDD = 15.0 V, IOH = -5 mA 13.50 VDD = 15.0 V, IOH = -1 mA 14.20 03,04 Max V 3.80 VDD = 15.0 V, IOH = -0.8 mA 14.20 VDD = 18.0 V, IOH = -0.8 mA 17.30 05 1.00 1.50 VDD = 5.0 V, IOH = -1.0 mA 4.20 5.00 VDD = 12.0 V, IOH = -10 mA 10.25 12.00 VDD = 12.0 V, IOH = -5 mA 10.70 12.00 VDD = 12.0 V, IOH = -1 mA 11.0 12.0 908 1110 858 1161 900 1250 5.0 V VDD 15 V, 9 RT = 10 k, CT = 0.1 F, 03,04 10,11 Unit 4.10 12.50 VDD = 1.5 V, IOH = -0.25 mA tMON 01,02 VDD = 15.0 V, IOH = -10 mA VDD = 5.0 V, IOH = -0.8 mA Monostable timing accuracy Limits 2/ s see figures 3 and 5 1.5 V VDD 12 V, 9,10,11 RT = 10 k, CT = 0.1 F, 05 see figures 3 and 5 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups Conditions 1/ -55C TA +125C Device type unless otherwise specified Low level output voltage VOL Min 1,2,3 VDD = 5.0 V, IOL = 8.0 mA Limits 2/ VDD = 5.0 V, IOL = 5.0 mA 0.60 05 0.45 V 0.40 01,02 VDD = 15.0 V, IOL = 100 mA 3.80 VDD = 15.0 V, IOL = 50 mA 1.50 VDD = 15.0 V, IOL = 10 mA 0.45 03,04 VDD = 5.0 V, IOL = 3.2 mA 0.50 VDD = 15.0 V, IOL = 20.0 mA 1.25 VDD = 18.0 V, IOL = 3.2 mA 0.50 05 VDD = 1.5 V, IOL = 1.0 mA tAST Max 01,02, VDD = 5.0 V, IOL = 3.2 mA Astable timing accuracy Unit 0.40 VDD = 12.0 V, IOL = 75 mA 3.50 VDD = 12.0 V, IOL = 50 mA 2.25 VDD = 12.0 V, IOL = 10 mA 1.00 5.0 V VDD 15 V, 9 03,04 1818 2222 1717 2323 178 250 s RTA = 10 k, RTB = 10 k, CT = 0.1 F, 10,11 see figures 4 and 6 VDD = 12 V, RTA = 1 k, RTB = 1 k, CT = 0.1 F, 9,10,11 05 1,2 03,04 see figures 4 and 6 Discharge transistor leakage current ICEX VDD = 5.0 V, 300 nA TA = +25C, +125C VDD = 15.0 V, 300 TA = +25C, +125C VDD = 18.0 V, 300 TA = +25C, +125C See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A Device subgroups type Conditions 1/ -55C TA +125C unless otherwise specified Discharge transistor leakage current Reset current 3/ ICEX IR Limits 2/ Min Max VDD = 1.5 V, 1 TA = +25C, +125C 2 1000 VDD = 5.0 V, 1 100 TA = +25C, +125C 2 1000 VDD = 12.0 V, 1 100 TA = +25C, +125C 2 1000 VDD = 5.0 V, 1,2 Unit 05 100 All 50 01-04 100 03-04 100 05 50 nA nA TA = +25C, +125C VDD = 15.0 V, TA = +25C, +125C VDD = 18.0 V, TA = +25C, +125C VDD = 1.5 V and 5.0 V, TA = +25C, +125C VDD = 12.0 V, 50 TA = +25C, +125C Discharge transistor saturation voltage VSAT 1,2,3 VDD = 5.0 V, IOL = 10 mA 01,02 0.60 1.80 VDD = 15.0 V, IOL = 100 mA 03,04 VDD = 5.0 V, IOL = 10 mA V 0.60 VDD = 15.0 V, IOL = 10 mA 0.60 VDD = 18.0 V, IOL = 10 mA 0.60 05 150 mV VDD = 5.0 V, IOL = 10 mA 0.30 V VDD = 12.0 V, IOL = 25 mA 2.00 VDD = 1.5 V, IOL = 1.0 mA 1/ Each side of device types 02 and 04 are tested separately. 2/ The limiting terms "min" (minimum) and "max" (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ 1/3 VDD VIN 2/3 VDD. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 9 Device types 01 01 02 and 04 see note 1 02 03 and 05 Case outlines P 2 C 2 G and P see note 2 Terminal number Terminal symbol 1 GND NC DSCH1 NC GND 2 TRIG GND THRES1 DSCH1 TRIG 3 OUT NC CONT1 THRES1 OUT 4 RESET NC RESET1 CONT1 RESET 5 CONT TRIG OUT1 NC CONT 6 THRES NC TRIG1 RESET1 THRES 7 DSCH OUT GND NC DSCH 8 VDD NC TRIG2 OUT1 VDD 9 --- NC OUT2 TRIG1 --- 10 --- RESET2 GND --- 11 --- NC CONT2 NC --- 12 --- CONT THRES2 TRIG2 --- 13 --- NC DSCH2 OUT2 --- 14 --- NC VDD RESET2 --- 15 --- THRES --- NC --- 16 --- NC --- CONT2 --- 17 --- DSCH --- NC --- 18 --- NC --- THRES2 --- 19 --- NC --- DSCH2 --- 20 --- VDD --- VDD --- RESET NOTES: 1. VDD and GND are common to both sides. 2. VDD and case are connected. FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 10 Device types 01 - 05 Output Discharge switch Low Low On 1/3 (VDD) High Low On 2/3 (VDD) 1/3 (VDD) High Stable Stable Don’t care 1/3 (VDD) High High Off Threshold voltage Trigger voltage Don’t care Don’t care 2/3 (VDD) RESET NOTE: 1 of 2 device types 02 and 04. FIGURE 2. Block diagram and circuit operation table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 11 Device types 03, 04, and 05 NOTE: tr = tf 10 ns FIGURE 3. Timing parameter (monostable). Device types 03, 04, and 05 FIGURE 4. Timing parameter (astable). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 12 Device types 03, 04, and 05 FIGURE 5. Monostable operation. Device types 03, 04, and 05 FIGURE 6. Astable operation). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 13 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 14 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) --1*,2,3,9 1,2,3,9,10,11 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0547. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89503 A REVISION LEVEL J SHEET 15 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 11-02-15 Approved sources of supply for SMD 5962-89503 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8950301PA 01295 TLC555MJGB 5962-89503012A 01295 TLC555MFKB 5962-8950302CA 01295 TLC556MJB 5962-89503022A 01295 TLC556MFKB 5962-8950303GA 3V146 ICM7555MTV/883 5962-8950303GC 3V146 ICM7555MTV/883 3/ ICM7555MTV/883B 5962-8950303PA 3/ HI-7555CM-02 5962-8950304CA 3/ ICM7556MJD/883B 5962-8950305CA 3/ LMC555H/883 5962-8950305GA 3/ LMC555H/883 5962-8950305PA 3/ LMC555J/883C 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 3V146 Rochester Electronics Inc. 16 Malcolm Hoyt Drive Newburyport, MA 01950 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.