APL3513 2A High Side Load Switches Features General Description • • • • • • • The APL3513 is a power-distribution switch with some protection that can deliver current up to 2A. The device 70mΩ High Side MOSFET Wide Supply Voltage Range: 2.7V to 5.5V incorporates a 70mΩ N-channel MOSFET power switch that is controlled by an enable logic pin. Current-Limit and Short-Circuit Protections The protection features include current-limit protection, short-circuit protection, and over-temperature protection. Over-Temperature Protection Fault Indication Output Logic Level Enable Pin The device limits the output current at current limit threshold level. When VOUT drops below VIN-1V, the devices limit Lead Free and Green Devices Available the current to a lower and safer level. The over-temperature protection limits the junction temperature below (RoHS Compliant) 140oC in case of short circuit or over load conditions. Simplified Application Circuit Applications • • • • • • VOUT 5V Cellular Telephones VIN Digital Still Cameras Hot Swap Supplies VOUT APL3513 Notebook Computers EN Personal Communication Devices EN GND Personal Digital Assistants (PDAs) Pin Configuration VIN 1 VOUT 2 EN 3 GND 4 8 VIN 7 VIN 6 VIN 5 VIN APL3513 TDFN2x2-8(Top View) = Exposed Pad (connected to ground plane for better heat dissipation) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 1 www.anpec.com.tw APL3513 Ordering and Marking Information Package Code QB : TDFN2x2-8 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL3513 Assembly Material Handling Code Temperature Range Package Code APL3513 QB: L13 X X - Date Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN VOUT VENB, VEN TJ TSTG TSDR (Note 1) Parameter Rating Unit VIN Input Voltage (VIN to GND) -0.3 ~ 7 V VOUT to GND Voltage -0.3 ~ 7 V EN, ENB to GND Voltage -0.3 ~ 7 Maximum Junction Temperature Storage Temperature Maximum Lead Soldering Temperature, 10 Seconds V 150 o -65 ~ 150 o 260 o C C C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol θJA Parameter Junction-to-Ambient Resistance in Free Air Typical Value (Note 2) TDFN2x2-8 Unit o 80 C/W Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of TDFN2x2-8 is soldered directly on the PCB. Recommended Operating Conditions (Note 3) Symbol Parameter VIN VIN Input Voltage IOUT OUT Output Current Range Unit 2.7 ~ 5.5 V 0 ~2 A TA Ambient Temperature -40 ~ 85 o TJ Junction Temperature -40 ~ 125 o C C Note 3 : Refer to the typical application circuit Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 2 www.anpec.com.tw APL3513 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. Symbol Parameter APL3513 Test Conditions Min. Typ. Unit Max. SUPPLY CURRENT No load, VEN=0V - - 1 µA No load, VEN=5V - 65 100 µA Leakage Current VOUT=GND, VEN=0V - - 1 µA Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V - - 1 µA IOUT=1.5A, TA= 25 oC - 70 90 mΩ 2.3 - 2.65 V - 0.2 - V 2.1 2.5 3.6 A VIN Supply Current POWER SWITCH RDS(ON) Power Switch On Resistance UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN rising, TA= -40 ~ 85 oC VIN UVLO Hysteresis CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM ISHORT Current Limit Threshold VIN=2.7V to 5.5V, TA= -40 ~ 85 oC Short-Circuit Output Current VIN=2.7V to 5.5V - 0.8 - A EN INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 2 - - V VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V Input Current - - 1 µA VOUT Discharge Resistance VEN=0V - 150 - Ω - µs tD(ON) Turn on Delay Time - 30 tD(OFF) Turn off Delay Time - 30 - µs Soft-Start Time No load, COUT=1µF, VIN=5V - 400 - µs TJ rising - 140 - °C - 20 - °C tSS OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 3 www.anpec.com.tw APL3513 Typical Operating Characteristics Switch On Resistance vs. Junction Temperature Switch On Resistance vs. Input Voltage 130 Switch On Resistance, RDS(ON) (mΩ) Switch On Resistance, RDS(ON) (mΩ) 160 140 120 100 80 60 40 20 0 VIN =5V, IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/X7R, -50 0 50 100 Junction Temperature ( oC) 120 110 100 90 80 70 60 50 150 IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/X7R, TA=25oC 2.5 Supply Current vs. Junction Temperature 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 5.5 Supply Current vs. Input Voltage 60 100 Supply Current, ICC (µA) Supply Current, ICC (µA) 55 80 60 40 20 VIN =5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic 0 50 100 35 30 RLOAD = Open, CIN =COUT =33µF/Electrolytic, TA=25℃ 3.0 3.5 4.0 4.5 5.0 Junction Temperature ( oC) Input Voltage (V) Current Limit Threshold vs. Junction Temperature Current Limit Threshold vs. Input Voltage 5.5 2.8 Current Limit Threshold, ILIM (A) Current Limit Threshold, ILIM (A) 40 20 2.5 150 3.0 2.5 2.0 1.5 1.0 0.5 VIN =5V 0.0 -50 45 25 0 -50 50 0 50 100 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2.5 150 Junction Temperature ( oC) Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 2.6 4 TA =25oC 3.0 3.5 4.0 4.5 Input Voltage (V) 5.0 5.5 www.anpec.com.tw APL3513 Typical Operating Characteristics (Cont.) Current-Limit Response vs. Output Peak Current Short-Circuit Output Current vs. Input Voltage Short-Circuit Output Current, ISHORT (A) 300 Current-Limit Response (µs) VIN = 5V, TA=25oC 250 200 150 100 50 0 0 2 4 6 8 10 12 EN pin Threshold Voltage, VEN (V) EN Rising EN Falling 1.0 RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic 0.4 0.2 0.0 2.5 3.0 3.5 4.0 4.5 5.0 0 50 100 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 150 EN Falling VIN =5V, RLOAD =50Ω, CIN = COUT =33µF/Elctrolytic, T A=25oC 3.5 4.0 4.5 Input Voltage (V) Turn-Off Leakage Current vs. Junction Temperature UVLO Threshold Voltage vs. Junction Temperature 2.5 3.0 2.5 2.0 1.5 1.0 0.5 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 3.0 5.0 5.5 3.2 VIN =5V, RLOAD =0Ω, CIN = COUT =33µF/Elctrolytic 0 50 100 Junction Temperature (oC) 5.5 EN Rising Junction Temperature ( oC) UVLO Threshold Voltage, VVLOC (V) EN Pin Threshold Voltage, VEN (V) Turn-Off Leakage Current, ILEAK (µA) 0.6 EN Pin Threshold Voltage vs. Input Voltage 1.5 0.0 -50 0.8 EN Pin Threshold Voltage vs. Junction Temperature 2.0 3.5 1.0 Input Voltage (V) 2.5 4.0 TA=25oC 1.2 Output Peak Current (A) 3.0 0.5 -50 1.4 2.8 UVLO Rising 2.4 1.6 1.2 0.8 -50 150 UVLO Falling 2.0 VIN Increasing, IOUT =15mA, CIN = COUT =33µF/Elctrolytic 0 50 100 150 Junction Temperature (oC) 5 www.anpec.com.tw APL3513 Typical Operating Characteristics (Cont.) Turn-On Rising Time vs. Junction Temperature Switch Off Supply Current, ICC(off) (µA) 4.0 700 Turn-On Rising Time, tR (µs) Switch Off Supply Current vs. Junction Temperature VIN = 5V, R LOAD =30Ω, CIN = 33µF/Elctrolytic, COUT =1µF/X7R 600 500 400 300 200 100 0 -50 0 50 100 Junction Temperature ( oC) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 150 0 50 100 Junction Temperature ( oC) 150 Turn-Off Falling Time vs. Junction Temperature Output Voltage vs. Output Current 200 6 VIN = 5V, TA=25℃ 5 Turn-Off Falling Time, tf (µs) Output Voltage, VOUT (V) VIN = 5V, RLOAD = Open, CIN = COUT =33µF/Elctrolytic 3.5 4 3 2 1 VIN = 5V, RLOAD =30Ω, CIN = 33µF/Elctrolytic, COUT =1µF/X7R 150 100 50 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 -50 0 50 100 150 Junction Temperature ( oC) Output Current (A) 6 www.anpec.com.tw APL3513 Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. Turn On Response Turn Off Response VEN VE N 1 1 VOUT VOUT 2 2 VIN =5V, RLOAD =30Ω, CIN =1µF/Electrolytic, COUT =0.1µF/Electrolytic CH1: VEN, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 10µs/Div VIN =5V, RLOAD =30Ω, CIN =1µF/Electrolytic, COUT =0.1µF/Electrolytic CH1: VEN, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 100µs/Div Power On Power Off VIN VIN VOUT V OUT 1 1 2 2 VIN =5V, R LOAD =30Ω, CIN =1µF/Electrolytic, COUT =0.1µF/Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC TIME:10ms/Div VIN =5V, RLOAD =30Ω, CIN =1µF/Electrolytic, COUT =0.1µF/Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC TIME:5ms/Div Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 7 www.anpec.com.tw APL3513 Operating Waveforms (Cont.) The test condition is VIN=5V, TA= 25oC unless otherwise specified. Over Load Response VIN V OUT 1 2 IOUT 3 VIN =5V, C IN =1µF/Electrolytic, C OUT =0.1µF/ Electrolytic CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 1ms/Div Pin Description PIN FUNCTION NO. NAME 1,5,6,7,8 VIN 2 VOUT 3 EN 4 GND Power Supply Input. Connect this pin to external DC supply. Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor. Enable control input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be left floating. Ground. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 8 www.anpec.com.tw APL3513 Block Diagram VOUT VIN UVLO Short-Circuit Protection Charge Pump Current Limit Gate Driver and Control Logic EN GND OTP Typical Application Circuit VOUT 5V CIN VIN VOUT CBYP 1µF 0.1µF APL3513 EN GND Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 9 www.anpec.com.tw APL3513 Function Description VIN Under-Voltage Lockout (UVLO) Over-Temperature Protection The APL3513 series of power switches have a built-in When the junction temperature exceeds 140oC, the inter- under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. The UVLO nal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junc- circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When tion temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed input voltage exceeds the UVLO threshold, the output output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of voltage starts a soft-start to reduce the inrush current. over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125oC. Power Switch The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a current flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection The APL3513 series of power switches provide the current-limit protection function. During current limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Protection When the output voltage drops below VIN-1V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will enter the thermal shutdown. Enable/Disable Pull the EN below 0.8V will disable the device, and EN above 2V will enable the device. When the IC is disabled, the supply current is reduced to less than 1µA. The enable input is compatible with both TTL and CMOS logic levels. The EN pin cannot be left floating. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 10 www.anpec.com.tw APL3513 Application Information Input Capacitor A 1µF ceramic bypass capacitor from VIN to GND, located near the APL3513, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry. Output Capacitor A bypassing 0.1µF ceramic capacitor improves the immunity of the device to short-circuit transients. A low-ESR high capacitance between VOUT and GND is suggested to reduce the voltage droop during load transient. Layout Consideration The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling highfrequency ripples. 3. Locate APL3513 and output capacitors near the load to reduce parasitic resistance and inductance for excellent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUT traces as wide and short as possible. Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 11 www.anpec.com.tw APL3513 Package Information TDFN2x2-8 A b E D D2 A1 E2 A3 L Pin 1 Corner e S Y M B O L MIN. MAX. MIN. MAX. A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 TDFN2x2-8 MILLIMETERS A3 INCHES 0.20 REF 0.008 REF b 0.18 0.30 0.007 0.012 D 1.90 2.10 0.075 0.083 D2 1.00 1.60 0.039 0.063 E 1.90 2.10 0.075 0.083 E2 0.60 1.00 0.024 0.039 0.45 0.012 e L 0.50 BSC 0.30 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 0.020 BSC 12 0.018 www.anpec.com.tw APL3513 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application TDFN2x2-8 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.20 1.75±0.10 3.50±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.4 3.35 MIN 3.35 MIN 1.30±0.20 (mm) Devices Per Unit Package Type Unit Quantity TDFN2x2-8 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 13 www.anpec.com.tw APL3513 Taping Direction Information TDFN2x2-8 USER DIRECTION OF FEED Classification Profile Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 14 www.anpec.com.tw APL3513 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 15 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA www.anpec.com.tw APL3513 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.2 - May., 2010 16 www.anpec.com.tw