Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter General Description Features The AP3502E is a 340kHz fixed frequency, current mode, PWM synchronous buck (step-down) DC-DC converter, capable of driving a 2A load with high efficiency, excellent line and load regulation. The AP3502E exhibits high efficiency at light load. The device integrates N-channel power MOSFET switches with low on-resistance. Current mode control provides fast transient response and cycle-by-cycle current limit. • • • • • • • • • • • • The AP3502E employs complete protection to ensure system security. Including output Over Voltage Protection, input Under Voltage Lock Out, programmable Soft Start, Over Temperature Protection and hiccup mode Short Circuit Protection. AP3502E Input Voltage Range: 4.5V to 18V Fixed 340kHz Frequency High Efficiency at Light Load High Efficiency: up to 95% Output Current: 2A Current Mode Control Built-in Over Current Protection Built-in Thermal Shutdown Function Built-in UVLO Function Built-in Over Voltage Protection Programmable Soft Start Hiccup Mode SCP Applications • • • • This IC is available in SOIC-8 package. LCD TV Set Top Box Portable DVD Digital Photo Frame SOIC-8 Figure 1. Package Type of AP3502E May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 1 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Pin Configuration M Package (SOIC-8) BS 1 8 SS IN 2 7 EN SW 3 6 COMP GND 4 5 FB Figure 2. Pin Configuration of AP3502E (Top View) Pin Description Pin Number Pin Name 1 BS 2 IN 3 SW 4 GND 5 FB 6 COMP 7 EN 8 SS May. 2012 Function Bootstrap pin. A bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap capacitor drives the internal high-side power MOSFET Supply power input pin. A capacitor should be connected between the IN pin and GND pin to keep the input voltage constant Power switch output pin. This pin is connected to the inductor and bootstrap capacitor Ground pin Feedback pin. This pin is connected to an external resistor divider to program the system output voltage. When the FB pin voltage exceeds 1.1V, the over voltage protection is triggered. When the FB pin voltage is below 0.3V, the oscillator frequency is lowered to realize short circuit protection Compensation pin. This pin is the output of the transconductance error amplifier and the input to the current comparator. It is used to compensate the control loop. Connect a series RC network from this pin to GND. In some cases, an additional capacitor from this pin to GND pin is required Control input pin. EN is a digital input that turns the regulator on or off. Drive EN high/low to turn on/off the regulator. Pull up with 100kΩ resistor for automatic startup Soft-start control input pin. SS controls the soft-start period. Connect a capacitor from SS to GND to set the soft-start period. A 0.1µF capacitor sets the soft-start period to 15ms. To disable the soft-start feature, leave SS unconnected Rev. 1. 3 BCD Semiconductor Manufacturing Limited 2 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Functional Block Diagram Figure 3. Functional Block Diagram of AP3502E Ordering Information AP3502E - Circuit Type G1: Green Package M: SOIC-8 Package Temperature Range SOIC-8 -40 to 85°C TR: Tape & Reel Blank: Tube Part Number Marking ID Packing Type AP3502EM-G1 3502EM-G1 Tube AP3502EMTR-G1 3502EM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 3 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit IN Pin Voltage VIN -0.3 to 20 V EN Pin Voltage VEN -0.3 to VIN V SW Pin Voltage VSW 21 V BS Pin Voltage VBS -0.3 to VSW+6 V FB Pin Voltage VFB -0.3 to 6 V VCOMP -0.3 to 6 V SS Pin Voltage VSS -0.3 to 6 V Thermal Resistance θJA 105 ºC/W Operating Junction Temperature TJ 150 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10sec) TLEAD 260 ºC ESD (Human Body Model) VHBM 2000 V ESD (Machine Model) VMM 200 V COMP Pin Voltage Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input Voltage VIN 4.5 18 V Operating Ambient Temperature TA -40 85 ºC May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 4 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Electrical Characteristics TA=25ºC, VIN=VEN=12V, VOUT=3.3V, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit 1.2 0.1 18 1.4 10 V mA µA SUPPLY VOLTAGE (IN PIN) Input Voltage Quiescent Current Shutdown Supply Current VIN IQ ISHDN 4.5 VFB=1V, VEN=3V VEN=0V UNDER VOLTAGE LOCKOUT Input UVLO Threshold Input UVLO Hysteresis VUVLO VHYS VIN Rising 3.65 4.00 200 4.25 V mV 1.1 1.5 2 V ENABLE (EN PIN) EN Shutdown Threshold Voltage EN1Shutdown1Threshold1Voltage1Hysteresis (Note 3) 350 EN Lockout Threshold Voltage EN Lockout Hysteresis mV 2.2 2.5 210 2.7 V mV 0.907 0.925 1.1 0.943 V V µA VOLTAGE REFERENCE (FB PIN) Feedback Voltage Feedback Over Voltage Threshold Feedback Bias Current VFB VFBOV IFB VFB=1V RDSONH RDSONL ISW=0.2A/0.7A ISW=-0.2A/-0.7A ILEAKH ILIMH ILIML VIN=18V,VEN=VSW=0V -0.1 0.1 MOSFET High-side Switch On-resistance (Note 2) Low-side Switch On-resistance (Note 2) 100 100 mΩ mΩ CURRENT LIMIT High-side Switch Leakage Current High-side Switch Current Limit Low-side Switch Current Limit 2.7 Drain to Source 0.1 3.5 0 10 µA A mA 340 90 90 400 kHz kHz % % SWITCHING REGULATOR Oscillator Frequency Short Circuit Oscillator Frequency Max. Duty Cycle Min. Duty Cycle fOSC1 fOSC2 DMAX DMIN 280 VFB=0.85V VFB=1V 0 ERROR AMPLIFIER Error Amplifier Voltage Gain (Note 3) Error Amplifier Transconductance COMP to Current Sense Transconductance AEA GEA GCS 400 800 3.5 V/V µA/V A/V TOTSD THYS 160 30 ºC ºC 15 5 ms µA THERMAL SHUTDOWN Thermal Shutdown (Note 3) Thermal Shutdown Hysteresis (Note 3) SOFT START (SS PIN) Soft-start Time (Note 3) Soft-start Current Note 2: RDSON= tSS C4=0.1µF,IOUT=500mA VSW1 - VSW2 ISW1 - ISW2 Note 3: Not tested, guaranteed by design. May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 5 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Typical Performance Characteristics TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted. 1.4 100 90 1.3 Quiescent Current (mA) 80 Efficiency (%) 70 60 50 40 VOUT=3.3V,L=10µH TA=25oC 30 VIN=5V 10 0.01 0.1 1.1 1.0 VIN=12V 20 1.2 1 0.9 10 -50 Load Current (A) -25 0 25 50 75 100 125 150 o Temperature ( C) Figure 4. Efficiency vs. Load Current Figure 5. Quiescent Current vs. Temperature 0.94 3.6 3.5 Output Voltage (V) Feedback Voltage (V) 0.93 0.92 3.4 3.3 3.2 0.91 3.1 3.0 0.90 -50 -25 0 25 50 75 100 125 0.0 150 Temperature ( C) 0.8 1.2 1.6 2.0 2.4 Figure 7. Output Voltage vs. Load Current Figure 6. Feedback Voltage vs. Temperature May. 2012 0.4 Load Current (A) o Rev. 1. 3 BCD Semiconductor Manufacturing Limited 6 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Typical Performance Characteristics (Continued) TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted. 4.0 3.6 3.6 Max Load Current (A) Output Voltage (V) 3.5 3.4 3.3 3.2 3.1 3.2 2.8 2.4 2.0 VOUT=3.3V,L=10µH 1.6 1.2 3.0 4 8 12 16 4 20 Figure 8. Output Voltage vs. Input Voltage VIN(AC) 500mV/div 12 16 20 Figure 9. Maximum Load Current vs. Input Voltage VOUT (AC) 100mV/div VOUT (AC) 20mV/div IL 1A/div IOUT 1A/div VSW 10V/div Time 2µs/div Time Figure 10. Output Ripple (IOUT=2A) May. 2012 8 Input Voltage (V) Input Voltage (V) 400µs/div Figure 11. Load Transient (IOUT=1 to 2A) Rev. 1. 3 BCD Semiconductor Manufacturing Limited 7 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Typical Performance Characteristics (Continued) TA=25ºC, VIN=12V, VOUT=3.3V, unless otherwise noted. VEN 2V/div VEN 2V/div VSS 2V/div VSS 2V/div VOUT 2V/div VOUT 2V/div IL 1A/div IL 1A/div Time 4ms/div Time 200µs/div Figure 12. Enable Turn-on Characteristic (VIN=12V, VEN=3.3V, VOUT=3.3V, IOUT=2A) VOUT 2V/div Figure 13. Enable Turn-off Characteristic (VIN=12V, VEN=3.3V, VOUT=3.3V, IOUT=2A) VOUT 2V/div VSW 10V/div VSS 1V/div IL 2A/div VSW 10V/div VSS 1V/div IL 2A/div Time 40ms/div Time 40ms/div Figure 14. Short Circuit Protection (IOUT=2A) May. 2012 Figure 15. Short Circuit Recovery (IOUT=2A) Rev. 1. 3 BCD Semiconductor Manufacturing Limited 8 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Typical Application Input Voltage=12V 1 2 Output Voltage=3.3V L 10µH C4 10nF 3 4 BS IN SW AP3502E R4 100k SS EN COMP GND FB C11 10µF/25V 8 C5 0.1µF 7 C6 Optional 6 C3 4.7nF 5 R3 13k R2 10k C21 C22 22µF/25V 22µF/25V D1 Optional R1 26.1k Figure 16. Typical Application of AP3502E May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 9 Preliminary Datasheet 340kHz, 2A Synchronous DC-DC Buck Converter AP3502E Mechanical Dimensions SOIC-8 4.700(0.185) 5.100(0.201) 7° Unit: mm(inch) 0.320(0.013) 1.350(0.053) 1.750(0.069) 8° 8° 7° 0.675(0.027) 0.725(0.029) D 5.800(0.228) 1.270(0.050) 6.200(0.244) TYP D 20:1 0.800(0.031) 0.300(0.012) R0.150(0.006) 0.100(0.004) 0.200(0.008) 0° 8° 1.000(0.039) 3.800(0.150) 4.000(0.157) 0.330(0.013) 0.190(0.007) 0.250(0.010) 1° 5° 0.510(0.020) 0.900(0.035) R0.150(0.006) 0.450(0.017) 0.800(0.031) Note: Eject hole, oriented hole and mold mark is optional. May. 2012 Rev. 1. 3 BCD Semiconductor Manufacturing Limited 10 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. 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