® ® Cree XLamp XQ-D LED PRODUCT DESCRIPTION Cree XLamp XQ-D LEDs revolutionize low-cost, high-power LEDs by delivering lighting-class reliability and a wider spread of light than typical plastic packages. The XQ- FEATURES Table of Contents • Cree’s smallest lighting class Characteristics.......................... 2 LED: 1.6 X 1.6 X 1.6 mm Flux Characteristics.................... 3 • Available in white, 80-minimum Relative Spectral Power CRI white, and 70-minimum CRI Distribution.............................. 4 cool white Relative Flux vs. Junction D’s innovative wide light emission • Binned at 25 °C Temperature............................. 4 can improve the omnidirectionality • 700 mA maximum drive current Electrical Characteristics............. 5 of replacement lamps, while also • Low thermal resistance: Thermal Design......................... 5 reducing system cost by using fewer LEDs. Using Cree’s newest generation of 7.5 °C/W Relative Flux vs. Current............ 6 • Wide viewing angle: 145° Typical Spatial Distribution.......... 6 • Reflow solderable - JEDEC Reflow Soldering Characteristics.. 7 J-STD-020C compatible Notes....................................... 8 silicon carbide-based LED chips, • Unlimited floor life at Mechanical Dimensions.............. 9 XQ-D is optimized to dramatically ≤ 30 °C/85% RH Tape and Reel......................... 10 lower system cost in replacement lamp, non-directional and outdoor • UL-recognized component Packaging............................... 11 (E349212) www.cree.com/Xlamp area lighting applications. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 CLD-DS52 Rev 0A Product family data sheet xlamp xQ-D led Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 7.5 degrees 145 mV/°C -3 Viewing angle (FWHM) Temperature coefficient of voltage ESD classification (HBM per Mil-Std-883D) DC forward current Minimum Typical Maximum Class 1 mA Reverse voltage V Forward voltage (@ 350 mA, 25 °C) V LED junction temperature °C 350 700 -5 3.1 3.5 150 Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 xlamp xQ-D led Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XQ-D LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XQ-D Binning and Labeling document. Color CCT Range Min. Cool White 70 CRI Minimum Cool White Neutral White 80 CRI Minimum White Warm White 5000 K 5000 K 3700 K 2600 K 2600 K Max. 8300 K 8300 K 5000 K 4300 K 3700 K Base Order Codes Minimum Luminous Flux @ 350 mA Calculated Minimum Luminous Flux (lm)* Order Code Group Flux (lm) 700 mA R4 130 227 XQDAWT-00-0000-00000LG51 R3 122 213 XQDAWT-00-0000-00000LF51 R2 114 199 XQDAWT-00-0000-00000LE51 R4 130 227 XQDAWT-00-0000-00000BG51 R3 122 213 XQDAWT-00-0000-00000BF51 R2 114 199 XQDAWT-00-0000-00000BE51 R3 122 213 XQDAWT-00-0000-00000BFE5 R2 114 199 XQDAWT-00-0000-00000BEE5 Q5 107 187 XQDAWT-00-0000-00000LDE5 Q4 100 172 XQDAWT-00-0000-00000HCE7 Q3 93.9 164 XQDAWT-00-0000-00000HBE7 Q2 87.4 153 XQDAWT-00-0000-00000HAE7 Q4 100 172 XQDAWT-00-0000-00000LCE7 Q3 93.9 164 XQDAWT-00-0000-00000LBE7 Q2 87.4 153 XQDAWT-00-0000-00000LAE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Typical CRI for Neutral White, 3700 K - 5000K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 70 CRI Minimum Cool White is 70. • Minimum CRI for 80 CRI Minimum White is 80. * Calculated flux values at 700 mA are for reference only. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 xlamp xQ-D led Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) 100% 80% 60% Warm White Neutral White Cool White 40% 20% 0% 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 350 mA) Relative Luminous Flux 120% 100% 80% 60% 40% 20% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 xlamp xQ-D led Electrical Characteristics (TJ = 25 °C) Electrical Characteristics (Tj = 85ºC) 700 Forward Current (mA) 600 500 400 300 200 100 0 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Forward Voltage (V) Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to Thermal Design ambient in order to optimize lamp life and optical characteristics. 800 Maximum Current (mA) 700 600 500 400 Rj-a Rj-a Rj-a Rj-a 300 200 = = = = 10°C/W 15°C/W 20°C/W 25°C/W 100 0 0 20 40 60 80 100 120 140 Ambient Temperature (ºC) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 xlamp xQ-D led Relative Intensity vs. Current (Tj = 85ºC) Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) 180% 160% 140% 120% 100% 80% 60% 40% 20% 0% 0 100 200 300 400 500 600 700 Forward Current (mA) Typical Spatial Radiation Pattern Typical Spatial Distribution 100% Relative Luminous Intensity (%) 90% 80% 70% 60% 50% 40% 30% 20% 10% -90 -70 -50 -30 0% -10 10 30 50 70 90 Angle (º) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 xlamp xQ-D led Reflow Soldering Characteristics In testing, Cree has found XLamp XQ-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature t 25˚C to Peak Time Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 xlamp xQ-D led Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/XRE_ lumen_maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XQ-D LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. UL Recognized Component Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See the LED Eye Safety application note at www.cree.com/xlamp_app_notes/led_eye_safety. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 D C B A 6 5 4 3 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. xlamp xQ-D led 6 5 66 55 Mechanical Dimensions 4 44 33 3 22 2 11 1 REVISONS REVISONSREVISONS 1.60 NOTICE NOTICE NOTICE D THIS PLOT CREECONFIDENTIAL. CONFIDENTIAL. THIS PLOT AND THEINFORMATION INFORMATION CREE CONFIDENTIAL. AND THEAND INFORMATION CREE THIS PLOT THE CONTAINED WITHIN ARETHE THEPROPRIETARY PROPRIETARY AND CONTAINED WITHIN ARE THEARE PROPRIETARY AND CONTAINED WITHIN AND CONFIDENTIAL INFORMATION OF CREE, INC. THISPLOT PLOT CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONFIDENTIAL INFORMATION OF CREE, INC. THIS MAY NOTBE BECOPIED, COPIED,REPRODUCED REPRODUCED ORDISCLOSED DISCLOSED TOANY ANY MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY TO MAY NOT OR UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. OF CREEOF INC. CREE INC. REV REV REV REV All dimensions in mm. BY DESCRIPTION DESCRIPTION DESCRIPTION BY DATE BY .600 A Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm 1.60 DD 1.60 1.60 .600 1.60 .600 .600 .600 .600 .600 1.500 1.41 NOTCH ISON ON NOTCHNOTCH IS ON IS CATHODE (-)SIDE SIDE CATHODE (-) SIDE(-) CATHODE 1.60 1.60 1.60 1.41 1.500 1.500 1.500 1.41 1.41 C 1.60± .05 CC 1.60± .05 .05 1.60± .05 1.60± .300 .300 .300 1.500 1.500 1.500 1.500 .300 .65 .65 .65 .30 .30 .30 .300 .300 .300 .65 SOLDER PAD SOLDER PAD PAD SOLDER REFERENCE REFERENCE REFERENCE .30 BB SOLDER PAD REFERENCE B 3.300 3.300 3.300 1.60 1.60 1.60 3.300 1.60 1.60 1.60 1.60 1.60 RECOMMENDED PCBOARD BOARD SOLDER PAD RECOMMENDED PC BOARD SOLDER PAD PAD RECOMMENDED PC SOLDER 3.300 3.300 3.300 AA DRAWN BY RECOMMENDED TRACELAYOUT LAYOUT RECOMMENDED TRACETRACE LAYOUT RECOMMENDED RECOMMENDED PC BOARD SOLDER PAD 3.300 A 6 66 5 55 4 44 DATE DATE DRAWN BY DATE DRAWN BY UNLESSOTHERWISE OTHERWISE SPECIFIED UNLESS OTHERWISE SPECIFIED SPECIFIED UNLESS CRONIN 5/23/12 5/23/12 5/23/12 DIMENSIONS AREININD. CRONIND.D.CRONIN DIMENSIONS ARE IN DIMENSIONS ARE CHECK DATE CHECK DATE DATE MILLIMETERS ANDAFTER AFTER FINISH. CHECK MILLIMETERS AND AFTERAND FINISH. MILLIMETERS FINISH. TOLERANCE UNLESSSPECIFIED: SPECIFIED: -TOLERANCE UNLESS SPECIFIED: ---- ----TOLERANCE UNLESS .XX ± ± .25 .25 .XX ± .25 .XX DATE APPROVED APPROVED DATE DATE APPROVED .XXX ± ± .125 .125 TITLE .XXX ± .XXX .125 ----- ----X° ± .5X°° ± ± X° .5.5° ° THIRD ANGLEPROJECTION PROJECTION THIRD ANGLE PROJECTION THIRD ANGLE MATERIAL MATERIAL FORSHEET SHEET METAL PARTS ONLY MATERIAL FOR SHEETFOR METAL PARTS ONLY METAL PARTS ONLY .X ± ± 1.5 .X ± 1.5 .X 1.5 SIZE .XX ± ± .75 .75 .XX ± .75 .XX .XXX ± ± .25 .25 .XXX ± .XXX .25 FINAL PROTECTIVE FINISH FINAL PROTECTIVE FINISH FINAL PROTECTIVE FINISH X° ± .5X°° ± ± X° .5.5° ° 33 3 Pho Phone (919) 313-530 Phone Fax Fax (919) 313-5558 Fax (9 TITLE TITLE XQxOUTLINE OUTLINE XQx OUTLINE XQx UNLESS OTHERWISE SPECIF DIMENSIONS ARE IN MILLIMETERS AND AFTER FINIS 2610-00026 2610-00026 2610-00026 TOLERANCE UNLESS SPECIFI SCALE SHEE SHEET 45.000 -.XX SHEET ± .25OF ---- SCALE 45.000SCALE 45.000 .XXX ±1 .125 11 2 22 X° ± .5 ° THIRD ANGLE PROJECTION FOR SHEET METAL PARTS ON .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° -- 1.6 1.6 FINISH: 1.6 SURFACE FINISH: SURFACE FINISH: RECOMMENDED TRACE SURFACE LAYOUT 4600 4600 Silicon Drive 4600 S Durh Durham, N.C 27703 Durha ---- C DRAWING NO. SIZE DRAWING NO.DRAWING NO. SIZE C C SURFACE FINISH: 1.6 6 5 4 3 Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 INFORMATION RY AND C. THIS PLOT ISCLOSED TO ANY RITTEN CONSENT REV BY DESCRIPTION DATE APP'D xlamp xQ-D led D Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm 1.500 +.10 -.00 4.0 ±.1 4.000 C 1.5 ±.1 CATHODE SIDE 1.75 ±.10 8.0 ±.1 1.750 A 2.5 ±.1 1.65 Cathode Side 12.0 8.000 NOMINAL 8.30 MAX +.3 .0 1.85 1.000 2.000 ANODE SIDE A 3.50 ±.10 .30 ± .10 B Anode Side (denoted by + and circle) User Feed Direction END START REFERENCE VENDOR PART NUMBER 021142 Loaded Pockets (2,000 Lamps) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) mulative tolerance ± THIRD ANGLE PROJECTION 0.2mm UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° Leader 5/31/12 400 mm (min) of empty pockets with at least 100 mm Carrier Tape, 1.7X1.7 XPQ sealed by tape (50 empty pockets min.)2402-00023 DATE DRAWN BY CHECK DATE 4 3 Phone (919) 313-5300 Fax (919) 313-5558 APPROVED A DATE TITLE MATERIAL SIZE FINAL PROTECTIVE FINISH SCALE SURFACE FINISH: 1.6 5 4600 Silicon Drive Durham, N.C 27703 D. CRONIN User Feed Direction C 4.000 DRAWING NO. SHEET 2 REV. OF 1 Cover Tape Pocket Tape 13mm 7" Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 10 A 1 /1 xlamp xQ-D led Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-D LEDs. XLamp XQ-D LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on bottom of box) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 11