CLD-AP115 Rev 5A soldering & handling Cree® XLamp® XQ Family LEDs Introduction Table of Contents This application note applies to XLamp® XQ Family LEDs, Handling XLamp® XQ Family LEDs...........................................2 which have order codes in the following format. XQ Family Design Guidelines....................................................4 Circuit Board Preparation & Layouts.........................................4 XQxxxx-xx-xxxx-xxxxxxxxx Case Temperature (Ts) Measurement Point.............................5 Notes on Soldering XLamp® XQ Family LEDs..........................5 This application note explains how XLamp XQ Family LEDs Moisture Sensitivity...................................................................7 and assemblies containing these LEDs should be handled ESD..............................................................................................7 during manufacturing. Please read the entire document to XLamp® XQ Family LED Reflow Soldering Characteristics......8 understand how to properly handle XLamp XQ Family LEDs. Chemicals & Conformal Coatings.............................................9 Assembly Storage & Handling................................................ 10 Tape and Reel.......................................................................... 11 www.cree.com/Xlamp Packaging & Labels................................................................ 12 Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 1 XLamp ® XQ family LED Soldering & Handling Handling XLamp® XQ Family LEDs Manual Handling Use tweezers to grab XLamp XQ Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 600 g of shear force onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp XQ Family LEDs or assemblies containing these LEDs: • Avoid putting excessive mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. • Cree recommends always handling XQ family LEDs with appropriate ESD grounding. • Cree recommends handling XQ family LEDs wearing clean, lint‑free gloves. Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XQ Family LEDs from the factory tape & reel packaging. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 XLamp ® XQ family LED Soldering & Handling Pick & Place Nozzle For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be constructed of non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles fabricated from 95a urethane. The following pick & place tools are specific to the XQ Family LEDs. XQ-B & XQ-D All dimensions in mm. Measurement tolerances: .xxx = .001 mm 1.400 2.700 .200 D XQ-E 4 8 6 7 3 5 2 Ø 1.000 THE INFORMATION CONTAINED IN THIS DRAWING THE SOLE PROPERTY OF REVISIONS .800IS OR COUNT ON TOOLS, INC. ANY REPRODUCTION WHOLE WITHOUTRev. 4INØ PART 8 6 7 THE 3 5 2 1 DESCRIPTION WRITTEN PERMISSION OF THE COUNT ONPROPERTY TOOLS, INC.OFIS PROHIBITED. REVISIONS A PRINT RELEASE THE INFORMATION CONTAINED IN THIS DRAWING IS SOLE COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTRev. DESCRIPTION DATE APPROVED THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED. A PRINT RELEASE JDL 2 4 8 6 7 3 11/6/2014 5 THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF REVISIONS COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUTRev. D DESCRIPTION THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED. A PRINT RELEASE D 1.016 0.787 Ø 0.0400 D 1.016 Ø 0.0310 0.787 Ø 0.0400 Ø 0.0310 1.016 0.787 Ø 0.0400 Ø 0.0310 DATE 11/6/2 DATE 11/6/2 C C C C 30° 30° B B 30° B B ITEM PART OR NO. NOMENCLATURE MA NO. IDENTIFYING SPE OR DESCRIPTION PARTS LIST PART OR NOMENCLATURE QTY MATERIAL IDENTIFYING NO. UNLESS SPECIFICATION OR DESCRIPTION REQD OTHERWISE CADSPECIFIED GENERATED DRAWING, PARTS LISTAREDOINNOT DIMENSIONS INCHES MANUALLY UPDATE TOLERANCES ARE: UNLESS OTHERWISE CADSPECIFIED GENERATED DRAWING, DATE APPROVALS DECIMALS ANGLESNOMENCLATURE ITEM DIMENSIONS AREDOINNOT INCHES PART OR MANUALLY MA A XX = .002 DRAWN NO. NO. 1/2UPDATE SPEC OR DESCRIPTION 11/6/2014 TOLERANCES ARE: J. Lancaster XXXDATE .001 =IDENTIFYING APPROVALS PARTS LIST DECIMALS ANGLES CHECKED XXXX .0002 = A A XX = .002 1/2 DRAWN UNLESS OTHERWISE 11/6/2014 CADSPECIFIED GENERATED DRAWING, MATERIAL J. Lancaster XXX.001 = RESP ENG DIMENSIONS ARE INCHES DOINNOT MANUALLY2013-1565 UPDATE Cree XQ CHECKED XXXX.0002 = TOLERANCES ARE: FINISH ® ® MATERIAL DATE APPROVALS MFG ENG Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and XLamp are registered trademarks and the Cree logo is a DWG. trademark DECIMALS ANGLES RESP ENG NO. SIZE 32 endorsement, A XX = .002 DRAWN 2013-1565 Cree XQ LED 1/2 of Cree, Inc. Other trademarks, product and company names are the property of their respective owners andFINISH do not imply specific product and/or vendor sponsorship or association. 11/6/2014 A tip This J. Lancaster QUAL ENG XXXNOT .001 = SCALE DO DRAWING MFG ENG CHECKED REV. DWG. NO. document is provided for informational purposes only and is not a warranty or a specification. For product specifications, available at www.cree.com. SCALECAD FILE: XXXX .0002 = SIZE 32please see the data sheets A MATERIAL 6 DO NOT SCALE 5 QUAL 4 8 2 7 ENG 3 DRAWING RESP3FILE: ENG SHEET O2013-1565 F06, 2014 SCALECAD Cree XQ Thursday, November 2:52:10 3 FINISH 6 5 4 8 2 MFG ENG 7 1 SIZE DWG. NO. 32 Thursday, November 06, 2014 2:52:10 PM A ITEM NO. XLamp ® XQ family LED Soldering & Handling XQ Family Design Guidelines Due to the unique light emission of XQ-B and XQ-D LEDs, Cree recommends the following guidelines to help maximize the performance of XQ-B and XQ-D LEDs. LED positioning guideline • Due to the unique light emission of XQ-B and XQ-D LEDs, to minimize light interference between LEDs, Cree recommends a minimum distance of 2.0 mm between XQ-B and XQ-D LEDs. 1.60 LED PCB guideline and recommendation • .375 1.60 .375 To take advantage of the light that shines backwards from the LED, Cree recommends the use of either a highly reflective white PCB or white optic material surrounding the XQ-B and XQ-D LEDs. A 5% increase R.936 in light output can be realized by using a white optic. R.936 Circuit Board Preparation 1.60& Layouts 1.60 1.500 Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp XQ Family LEDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp XQ Family LEDs. 1.58 ±.08 1.58 ±.08 All dimensions in mm. Measurement tolerance: .xx = .±13 mm 1.500 1.500 .300 .65 .65 .30 1.60 .300 3.300 1.60 1.60 SOLDER PAD REFERENCE .30 SOLDER PAD REFERENCE 3.300 1.60 Recommended PCB solder pad RECOMMENDED PCRECOMMENDED BOARD SOLDERPC PAD BOARD SOLDER PAD 3.300 3.300 RECOMMENDEDRecommended TRACE LAYOUT trace RECOMMENDED TRACElayout LAYOUT Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 XLamp ® XQ family LED Soldering & Handling Case Temperature (Ts) Measurement Point XLamp XQ Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s base as possible. This measurement point is shown in the pictures below. Connect the thermocouple at a point where the voltage potential is below the rating for the meter. XQ Family LEDs do not have an isolated thermal pad and care should be exercised to avoid bridging the anode and cathode together, which may occur if the thermocouple bead is large. Cree recommends using a 36 AWG (0.01267 mm2) thermocouple wire for Ts measurements. XQ-B & XQ-D XQ-E High Density XQ-E High Intensity It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XQ Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. Notes on Soldering XLamp® XQ Family LEDs XLamp XQ Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCB on a hotplate and following the reflow soldering profile listed on page 8. Do not wave solder XLamp XQ Family LEDs. Do not hand solder XLamp XQ Family LEDs. P CORRECT X WRONG P CORRECT Solder Paste Type Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree strongly recommends using “no clean” solder paste with XLamp MPL-EZW LEDs5 so that cleaning the PCB after reflow soldering is not required. Cree uses the following XLamp ® XQ family LED Soldering & Handling Notes on Soldering XLamp® XQ Family LEDs - Continued Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp XQ Family LEDs so that cleaning the PCB after reflow soldering is not required. Cree uses Kester® R276 solder paste internally. Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver). Solder Paste Thickness The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 4-mil (102-μm) bond line, i.e., the solder joint thickness after reflow soldering. P CORRECT X WRONG After Soldering After soldering, allow XLamp XQ Family LEDs to return to room temperature before subsequent handling. Handling of the device, especially around the lens, before cooling could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. This can be done by X-ray or by shearing selected devices from the circuit board. The solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 6 XLamp ® XQ family LED Soldering & Handling Moisture Sensitivity Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XQ Family LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP. ESD XQ-B and XQ-D LEDs have an ESD class rating of 1. Cree recommends following the JESD 625 standard, “Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices,” when handling XQ-B and XQ-D LEDs or any LED component. Passing a static charge through an electrostatic-discharge-sensitive device can result in performance degradation or catastrophic failure of the device. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 XLamp ® XQ family LED Soldering & Handling XLamp® XQ Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp XQ Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak IPC/JEDEC J-STD-020C Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Free Solder 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) 65-150 seconds 217 °C 45-90 seconds 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 XLamp ® XQ family LED Soldering & Handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Cleaning Solutions Cree has found the following chemicals to be safe to use with XLamp XQ Family LEDs. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp XQ Family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XQ Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland® PLIOBOND® adhesive) Hermetically Sealing Luminaires For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically sealing LEDs in an enclosed space is not recommended. Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 XLamp ® XQ family LED Soldering & Handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XQ Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XQ Family LEDs should be stacked in a way to allow at least 1 cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XQ Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 10 INFORMATION RY AND C. THIS PLOT ISCLOSED TO ANY RITTEN CONSENT REV BY DESCRIPTION DATE APP'D XLamp ® XQ family LED Soldering & Handling D Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Except as noted, all dimensions in mm. Measurement tolerances unless 4.0 ±.1 indicated otherwise: .xx = ±.25 mm, .xxx = ±.125 mm 1.5 ±.1 1.75 ±.10 4.000 C 8.0 ±.1 1.500 +.10 -.00 2.5 ±.1 Cathode Side CATHODE SIDE 1.750 A +.3 12.0 .0 1.65 8.000 NOMINAL 8.30 MAX 1.000 2.000 1.85 Anode Side A by + and circle) 3.50 ±.10 (denoted ANODE SIDE .30 ± .10 END START Loaded Pockets (2,000 Lamps) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) THIRD ANGLE PROJECTION mulative tolerance ± B User Feed Direction 0.2mm REFERENCE VENDORLeader PART NUMBER 021142 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .25 .XXX ± .125 X° ± .5 ° FOR SHEET METAL PARTS ONLY .X ± 1.5 .XX ± .75 .XXX ± .25 X° ± .5 ° 400 mm (min) of empty pockets with at least 100 mm D. CRONIN 5/31/12 sealed by tape (50 empty pockets min.) DRAWN BY DATE CHECK DATE APPROVED DATE 3 Fax (919) 313-5558 A Carrier Tape, 1.7X1.7 XPQ MATERIAL SIZE FINAL PROTECTIVE FINISH SCALE SURFACE FINISH: 1.6 4 Phone (919) 313-5300 TITLE User Feed Direction 5 4600 Silicon Drive Durham, N.C 27703 2 C 4.000 REV. DRAWING NO. 2402-00023 SHEET A OF 1 Cover Tape Pocket Tape 13mm 7" Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 11 1 /1 XLamp ® XQ family LED Soldering & Handling Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp XQ Family LEDs. XLamp XQ Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 12