TI SN74LV138ATPW

SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
FEATURES
•
•
Ioff Supports Partial-Power Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
A
B
C
G2A
G2B
G1
Y7
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
RGY PACKAGE
(TOP VIEW)
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
B
C
G2A
G2B
G1
Y7
VCC
•
•
1
16
2
15
3
4
14
13
Y0
Y1
Y2
12 Y3
11 Y4
10 Y5
5
6
7
GND
8
9
Y6
•
Inputs Are TTL-Voltage Compatible
4.5-V to 5.5-V VCC Operation
Max tpd of 7.6 ns at 5 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 5 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 5 V, TA = 25°C
Support Mixed-Mode Voltage Operation on All
Ports
A
•
•
•
•
DESCRIPTION/ORDERING INFORMATION
The SN74LV138AT is a 3-line to 8-line decoder/demultiplexer, designed for high-performance memory-decoding
or data-routing applications requiring very short propagation delay times. In high-performance memory systems,
this decoder can be used to minimize the effects of system decoding. When employed with high-speed memories
utilizing a fast enable circuit, the delay times of the decoder and the enable time of the memory usually are less
than the typical access time of the memory. This means that the effective system delay introduced by the
decoder is negligible.
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
Tube of 40
SN74LV138ATD
Reel fo 2500
SN74LV138ATDR
SOP – NS
Reel of 2000
SN74LV138ATNSR
74LV138AT
SSOP – DB
Reel of 2000
SN74LV138ATDBR
LV138AT
TVSOP – DGV
Reel of 2000
SN74LV138ATDGVR
LV138AT
Tube of 90
SN74LV138ATPW
Reel of 2000
SN74LV138ATPWR
Reel of 250
SN74LV138ATPWT
TSSOP – PW
(1)
TOP-SIDE MARKING
SN74LV138ATRGYR
SOIC – D
–40°C to 125°C
ORDERABLE PART NUMBER
Reel of 1000
VV138AT
LV138AT
LV138AT
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The conditions at the binary-select inputs (A, B, C) and the three enable inputs (G1, G2A, G2B) select one of
eight output lines. The two active-low (G2A, G2B) and one active-high (G1) enable inputs reduce the need for
external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters
and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing
applications.
This device is fully specified for partial-power-down application susing Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
ENABLE INPUTS
2
SELECT INPUTS
OUTPUTS
G1
G2A
G2B
C
B
A
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
X
H
X
X
X
X
H
H
H
H
H
H
H
H
X
X
H
X
X
X
H
H
H
H
H
H
H
H
L
X
X
X
X
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
L
H
H
H
H
H
H
H
L
L
L
H
L
H
H
L
H
H
H
H
H
H
L
L
L
H
H
H
H
H
L
H
H
H
H
H
L
L
H
L
L
H
H
H
H
L
H
H
H
H
L
L
H
L
H
H
H
H
H
H
L
H
H
H
L
L
H
H
L
H
H
H
H
H
H
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
L
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
15
A
1
14
Select
Inputs
B
13
3
12
11
10
Enable
Inputs
6
4
G2A
G2B
Y1
2
C
G1
Y0
9
7
Y2
Y3
Data
Outputs
Y4
Y5
Y6
Y7
5
3
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage
–0.5
7
V
VI
Input voltage range (2)
–0.5
7
V
–0.5
VCC + 0.5
range (2) (3)
UNIT
VO
Output voltage
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±50
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
Continuous current through VCC or GND
D package (4)
73
DB package (4)
θJA
Package thermal impedance
(1)
(2)
(3)
(4)
(5)
82
DGV package (4)
120
NS package (4)
64
PW package (4)
108
RGY
Tstg
package (5)
Storage temperature range
V
°C/W
39
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited of 5.5 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
VCC = 4.5 V to 5.5 V
VIL
Low-level input voltage
VCC = 4.5 V to 5.5 V
VI
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
MIN
MAX
4.5
5.5
2
UNIT
V
V
0.8
V
0
5.5
V
0
VCC
V
VCC = 4.5 V to 5.5 V
–12
mA
Low-level output current
VCC = 4.5 V to 5.5 V
12
mA
∆t/∆v
Input transition rise or fall rate
VCC = 4.5 V to 5.5 V
20
ns/V
TA
Operating free-air temperature
125
°C
(1)
4
–40
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
II
ICC
∆ICC (1)
(1)
TEST CONDITIONS
TA = –40°C
to 85°C
TA = 25°C
VCC
MIN
TYP
4.5
IOH = –50 µA
4.5 V
4.4
IOH = –12 mA
4.5 V
3.8
IOL = 50 µA
4.5 V
IOL = 12 mA
0
MAX
MIN
TA = –40°C
to 125°C
MAX
MIN
4.4
4.4
3.8
3.8
UNIT
MAX
V
0.1
0.1
0.1
4.5 V
0.55
0.55
0.55
0 to 5.5 V
V
±0.1
±1
±1
µA
VI = VCC or GND, IO = 0
5.5 V
2
20
20
µA
One input at 3.4 V,
Other inputs at VCC or GND
5.5 V
1.35
1.5
1.5
mA
VI = 5.5 V or GND
Ioff
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
0
4
0.5
5
5
µA
10
10
10
pF
This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V ot VCC.
Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A, B, or C
tpd
tpd
G1
Y
TA = –40°C
to 125°C
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2.7
7.6
10.4
1
12
1
13
2.5
6.6
9.1
1
10.5
1
12
G2A or G2B
2.8
7
9.6
1
11
1
12
A, B, or C
3.9
8.1
11.4
1
13
1
14
3.7
7.1
10.1
1
11.5
1
12
4
7.5
10.6
1
12
1
13
G1
Y
G2A or G2B
CL = 15 pF
TA = –40°C
to 85°C
TA = 25°C
CL = 50 pF
UNIT
ns
ns
Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
TYP
79
UNIT
pF
5
SN74LV138AT
3-LINE TO 8-LINE DECODER/DEMULTIPLEXER
www.ti.com
SCLS691 – AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
S1
Open
TEST
GND
CL
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
3V
1.5 V
Timing Input
0V
tw
3V
1.5 V
Input
1.5 V
th
tsu
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
In-Phase
Output
50% VCC
tPHL
Out-of-Phase
Output
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
3V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuits and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV138ATD
ACTIVE
SOIC
D
16
SN74LV138ATDBR
ACTIVE
SSOP
DB
SN74LV138ATDBRE4
ACTIVE
SSOP
SN74LV138ATDBRG4
ACTIVE
SN74LV138ATDE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATDRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATNSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATNSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATNSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATPWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV138ATRGYR
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV138ATRGYRG4
ACTIVE
VQFN
RGY
Pins Package Eco Plan (2)
Qty
16
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
SN74LV138ATDBR
SSOP
DB
16
2000
330.0
16.4
8.2
SN74LV138ATDGVR
TVSOP
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74LV138ATDR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LV138ATNSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV138ATPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138ATPWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138ATRGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV138ATDBR
SSOP
DB
16
2000
367.0
367.0
38.0
SN74LV138ATDGVR
TVSOP
DGV
16
2000
367.0
367.0
35.0
SN74LV138ATDR
SOIC
D
16
2500
367.0
367.0
38.0
SN74LV138ATNSR
SO
NS
16
2000
367.0
367.0
38.0
SN74LV138ATPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74LV138ATPWT
TSSOP
PW
16
250
367.0
367.0
35.0
SN74LV138ATRGYR
VQFN
RGY
16
3000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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