SN74AVCB164245-Q1 www.ti.com SCES809A – MARCH 2010 – REVISED MAY 2010 16-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS Check for Samples: SN74AVCB164245-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Member of the Texas Instruments Widebus™ Family DOC™ Circuitry Dynamically Changes Output Impedance, Resulting in Noise Reduction Without Speed Degradation Dynamic Drive Capability Is Equivalent to Standard Outputs With IOH and IOL of ±24 mA at 2.5-V VCC Control Inputs VIH/VIL Levels Are Referenced to VCCB Voltage If Either VCC Input Is at GND, Both Ports Are in the High-Impedance State • • • • • Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data Communications Ioff Supports Partial-Power-Down Mode Operation Fully Configurable Dual-Rail Design Allows Each Port to Operate Over Full 1.4-V to 3.6-V Power-Supply Range Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 750-V Charged-Device Model (C101) DESCRIPTION This 16-bit (dual-octal) noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.4 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.4 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes. The SN74AVCB164245 is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the outputs so the buses are effectively isolated. The SN74AVCB164245 is designed so that the control pins (1DIR, 2DIR, 1OE, and 2OE) are supplied by VCCB. To ensure the high-impedance state during power up or power down, OE should be tied to VCCB through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. If either VCC input is at GND, both ports are in the high-impedance state. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) TSSOP – DGG Tape and reel ORDERABLE PART NUMBER CAVCB164245QDGGRQ1 TOP-SIDE MARKING AVCB164245Q For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated SN74AVCB164245-Q1 SCES809A – MARCH 2010 – REVISED MAY 2010 www.ti.com TERMINAL ASSIGNMENTS DGG PACKAGE (TOP VIEW) 1DIR 1B1 1B2 GND 1B3 1B4 VCCB 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCCB 2B5 2B6 GND 2B7 2B8 2DIR 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCCA 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCCA 2A5 2A6 GND 2A7 2A8 2OE FUNCTION TABLE (EACH 8-BIT SECTION) INPUTS OE 2 DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 SN74AVCB164245-Q1 www.ti.com SCES809A – MARCH 2010 – REVISED MAY 2010 LOGIC DIAGRAM (POSITIVE LOGIC) 1DIR 1 2DIR 48 1A1 25 1OE 47 2A1 2 24 2OE 36 13 1B1 2B1 To Seven Other Channels To Seven Other Channels Pin numbers shown are for the DGG and DGV packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCCA VCCB Supply voltage range VI Input voltage range (2) MIN MAX –0.5 4.6 I/O ports (A port) –0.5 4.6 I/O ports (B port) –0.5 4.6 Control inputs –0.5 4.6 A port –0.5 4.6 B port –0.5 4.6 A port –0.5 VCCA + 0.5 B port –0.5 VCCB + 0.5 UNIT V V VO Voltage range applied to any output in the high-impedance or power-off state (2) VO Voltage range applied to any output in the high or low state (2) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA (3) Continuous current through VCCA, VCCB, or GND qJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) ±100 DGG package –65 V V mA 70 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 3 SN74AVCB164245-Q1 SCES809A – MARCH 2010 – REVISED MAY 2010 www.ti.com Recommended Operating Conditions (1) (2) (3) over operating free-air temperature range (unless otherwise noted) MIN MAX VCCA Supply voltage VCCI 1.4 3.6 V VCCB Supply voltage 1.4 3.6 V VIH High-level input voltage VIL Low-level input voltage VIH High-level input voltage VIL Low-level input voltage VI Input voltage Data inputs Data inputs Control inputs (referenced to VCCB) Control inputs (referenced to VCCB) VCCO 1.4 V to 1.95 V VCCI × 0.65 1.95 V to 2.7 V 1.7 2.7 V to 3.6 V 2 VCCI × 0.35 1.95 V to 2.7 V 0.7 2.7 V to 3.6 V 0.8 VCCB × 0.65 1.95 V to 2.7 V 1.7 2.7 V to 3.6 V 2 Output voltage IOH VCCB × 0.35 1.95 V to 2.7 V 0.7 3.6 Active state 0 VCCO 3-state 0 3.6 IOL Low-level output current Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) (2) (3) 4 V 0.8 0 High-level output current V V 1.4 V to 1.95 V 2.7 V to 3.6 V VO V 1.4 V to 1.95 V 1.4 V to 1.95 V UNIT 1.4 V to 1.6 V –2 1.65 V to 1.95 V –4 2.3 V to 2.7 V –8 3 V to 3.6 V –12 1.4 V to 1.6 V 2 1.65 V to 1.95 V 4 2.3 V to 2.7 V 8 3 V to 3.6 V 12 5 –40 125 V V mA mA ns/V °C VCCI is the VCC associated with the data input port. VCCO is the VCC associated with the data output port. All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 SN74AVCB164245-Q1 www.ti.com SCES809A – MARCH 2010 – REVISED MAY 2010 Electrical Characteristics (1) (2) over operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL Control inputs II A port Ioff IOZ B port (4) A or B ports B port TEST CONDITIONS 1.4 V to 3.6 V 1.4 V to 3.6 V VCCO – 0.2 VCCO – 0.2 MIN TYP (3) MAX MIN TYP (3) MAX VI = VIH IOH = –2 mA VI = VIH 1.4 V 1.4 V 1.05 1.05 IOH = –4 mA VI = VIH 1.65 V 1.65 V 1.2 1.2 IOH = –8 mA VI = VIH 2.3 V 2.3 V 1.75 1.75 IOH = –12 mA VI = VIH 3V 3V 2.3 2.3 IOH = 100 mA VI = VIL 1.4 V to 3.6 V 1.4 V to 3.6 V 0.2 0.2 IOH = 2 mA VI = VIL 1.4 V 1.4 V 0.35 0.35 IOH = 4 mA VI = VIL 1.65 V 1.65 V 0.45 0.45 IOH = 8 mA VI = VIL 2.3 V 2.3 V 0.55 0.55 IOH = 12 mA VI = VIL 3V 3V 0.7 0.7 1.4 V to 3.6 V 3.6 V ±2.5 ±2.5 VI = VCCB or GND VI or VO = 0 to 3.6 V OE = VIH VO = VCCO or GND, VI = VCCI or GND VI = VCCI or GND, ICCB TA = -40°C to 125°C VCCB IOH = –100 mA A port ICCA TA = -40°C to 85°C VCCA VI = VCCI or GND, OE = don't care IO = 0 IO = 0 UNIT V 0V 0 to 3.6 V ±10 ±10 0 to 3.6 V 0V ±10 ±10 3.6 V 3.6 V ±12.5 ±12.5 0V 3.6 V ±12.5 ±12.5 3.6 V 0V ±12.5 ±12.5 1.6 V 1.6 V 20 35 1.95 V 1.95 V 20 35 2.7 V 2.7 V 30 45 0V 3.6 V -40 -50 3.6 V 0V 40 50 3.6 V 3.6 V 40 50 1.6 V 1.6 V 20 35 1.95 V 1.95 V 20 35 2.7 V 2.7 V 30 45 0V 3.6 V 40 50 3.6 V 0V -40 -50 3.6 V 3.6 V 40 50 V mA mA mA mA mA Ci Control inputs VI = 3.3 V or GND 3.3 V 3.3 V 4 4 pF Cio A or B ports VO = 3.3 V or GND 3.3 V 3.3 V 5 5 pF (1) (2) (3) (4) VCCO is the VCC associated with the output port. VCCI is the VCC associated with the input port. All typical values are at TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 5 SN74AVCB164245-Q1 SCES809A – MARCH 2010 – REVISED MAY 2010 www.ti.com Switching Characteristics TA = -40°C to 85°C, VCCA = 1.5 V ± 0.1 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.7 6.7 1.9 6.3 1.8 5.5 1.7 5.8 A 1.8 6.8 2.2 7.4 2.1 7.6 2.1 7.3 A 2.5 8.4 2.4 7.4 2.1 5.2 1.9 4.2 B 2.1 9 2.9 9.8 3.2 10 3 9.8 A 2.2 6.9 2.3 6.1 1.3 3.6 1.3 3 B 2.1 7.1 2.3 6.4 1.7 5.1 1.6 4.8 ns ns ns Switching Characteristics TA = -40°C to 125°C, VCCA = 1.5 V ± 0.1 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.7 12.7 1.9 12.3 1.8 11.5 1.7 11.8 A 1.8 12.8 2.2 13.4 2.1 13.6 2.1 13.3 A 2.5 14.4 2.4 13.4 2.1 11.2 1.9 10.2 B 2.1 15 2.9 15.8 3.2 16 3 15.8 A 2.2 12.9 2.3 12.1 1.3 9.6 1.3 9 B 2.1 13.1 2.3 12.4 1.7 11.1 1.6 10.8 ns ns ns Switching Characteristics TA = -40°C to 85°C, VCCA = 1.8 V ± 0.15 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.7 6.7 1.8 6 1.7 4.7 1.6 4.3 A 1.4 5.5 1.8 6 1.8 5.8 1.8 5.5 A 2.6 8.5 2.5 7.5 2.2 5.3 1.9 4.2 B 1.8 7.6 2.6 7.7 2.6 7.6 2.6 7.4 A 2.3 7 2.3 6.1 1.3 3.6 1.3 3 B 1.8 7 2.5 6.3 1.8 4.7 1.7 4.4 ns ns ns Switching Characteristics TA = -40°C to 125°C, VCCA = 1.8 V ± 0.15 V (see Figure 2) PARAMETER tpd 6 FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.7 12.7 1.8 12 1.7 10.7 1.6 10.3 A 1.4 11.5 1.8 12 1.8 11.8 1.8 11.5 A 2.6 14.5 2.5 13.5 2.2 11.3 1.9 10.2 B 1.8 13.6 2.6 13.7 2.6 13.6 2.6 13.4 A 2.3 13 2.3 12.1 1.3 9.6 1.3 9 B 1.8 13 2.5 12.3 1.8 10.7 1.7 10.4 Submit Documentation Feedback ns ns ns Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 SN74AVCB164245-Q1 www.ti.com SCES809A – MARCH 2010 – REVISED MAY 2010 Switching Characteristics TA = -40°C to 85°C, VCCA = 2.5 V ± 0.2 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX B 1.6 6 1.8 5.6 1.5 4 1.4 3.4 A 1.3 4.6 1.7 4.4 1.5 4 1.4 3.7 A 3.1 8.5 2.5 7.5 2.2 5.3 1.9 4.2 B 1.7 5.7 2.2 5.5 2.2 5.3 2.2 5.1 A 2.4 7 3 6.1 1.4 3.6 1.2 3 B 1.2 5.8 1.9 5 1.4 3.6 1.3 3.3 ns ns ns Switching Characteristics TA = -40°C to 125°C, VCCA = 2.5 V ± 0.2 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B B A ten OE tdis OE VCCB = 1.5 V ± 0.1 V MIN VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V UNIT MAX MIN MAX MIN MAX MIN MAX 1.6 12 1.8 11.6 1.5 10 1.4 9.4 1.3 10.6 1.7 10.4 1.5 10 1.4 9.7 A 3.1 14.5 2.5 13.5 2.2 11.3 1.9 10.2 B 1.7 11.7 2.2 11.5 2.2 11.3 2.2 11.1 A 2.4 13 3 12.1 1.4 9.6 1.2 9 B 1.2 11.8 1.9 11 1.4 9.6 1.3 9.3 ns ns ns Switching Characteristics TA = -40°C to 85°C, VCCA = 3.3 V ± 0.3 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN MAX MIN MAX B 1.5 5.9 1.7 5.4 1.5 3.7 1.4 3.1 A 1.3 4.5 1.6 3.8 1.5 3.3 1.4 3.1 A 2.6 8.3 2.5 7.4 2.2 5.2 1.9 4.1 B 1.6 4.9 2 4.5 2 4.3 1.9 4.1 A 2.3 7 3 6 1.3 3.5 1.2 3.5 B 1.3 6.9 2.1 5.5 1.6 3.8 1.5 3.5 UNIT ns ns ns Switching Characteristics TA = -40°C to 125°C, VCCA = 3.3 V ± 0.3 V (see Figure 2) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A B ten OE tdis OE VCCB = 1.5 V ± 0.1 V VCCB = 1.8 V ± 0.15 V VCCB = 2.5 V ± 0.2 V VCCB = 3.3 V ± 0.3 V MIN MAX MIN MAX MIN MAX MIN MAX B 1.5 11.9 1.7 11.4 1.5 9.7 1.4 9.1 A 1.3 10.5 1.6 9.8 1.5 9.3 1.4 9.1 A 2.6 14.3 2.5 13.4 2.2 11.2 1.9 10.1 B 1.6 10.9 2 10.5 2 10.3 1.9 10.1 A 2.3 13 3 12 1.3 9.5 1.2 9.5 B 1.3 12.9 2.1 11.5 1.6 9.8 1.5 9.5 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 UNIT ns ns ns 7 SN74AVCB164245-Q1 SCES809A – MARCH 2010 – REVISED MAY 2010 www.ti.com Operating Characteristics VCCA and VCCB = 3.3 V, TA = 25°C PARAMETER CpdA (VCCA) CpdB (VCCB) TEST CONDITIONS TYP Power dissipation capacitance per transceiver, A-port input, B-port output Outputs enabled Power dissipation capacitance per transceiver, B-port input, A-port output Outputs enabled Outputs disabled 7 Power dissipation capacitance per transceiver, A-port input, B-port output Outputs enabled 20 Outputs disabled Outputs disabled Outputs enabled Power dissipation capacitance per transceiver, B-port input, A-port output UNIT 14 CL = 0, CL = 0, 7 f = 10 MHz 20 7 f = 10 MHz 14 Outputs disabled pF pF 7 Output Description The DOC™ circuitry is implemented, which, during the transition, initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical VOL vs IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC™) Circuitry Technology and Applications, literature number SCEA009. 3.2 TA = 25°C Process = Nominal − Output Voltage − V 2.8 2.4 VCC = 3.3 V 2.0 1.6 VCC = 2.5 V 1.2 OH VCC = 1.8 V 0.8 V VOL − Output Voltage − V 2.8 TA = 25°C Process = Nominal 2.4 2.0 1.6 1.2 0.8 VCC = 3.3 V 0.4 0.4 0 17 34 51 68 85 102 119 IOL − Output Current − mA 136 153 170 VCC = 2.5 V VCC = 1.8 V −160 −144 −128 −112 −96 −80 −64 −48 IOH − Output Current − mA −32 −16 0 Figure 1. Typical Output Voltage vs Output Current 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 SN74AVCB164245-Q1 www.ti.com SCES809A – MARCH 2010 – REVISED MAY 2010 PARAMETER MEASUREMENT INFORMATION 2 × VCCO S1 RL From Output Under Test Open GND CL (see Note A) TEST S1 t pd t PLZ/t PZL t PHZ/t PZH Open 2 × VCCO GND RL tw LOAD CIRCUIT VCCI VCCI/2 Input VCCO CL RL VTP 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 15 pF 30 pF 30 pF 30 pF 500 Ω 500 Ω 500 Ω 500 Ω 0.1 V 0.15 V 0.15 V 0.3 V VCCI/2 0V VOLTAGE WAVEFORMS PULSE DURATION VCCB Output Control (low-level enabling) VCCB /2 VCCB/2 0V t PLZ t PZL VCCI Input VCCI/2 VCCI/2 0V t PLH Output t PHL VOH VCCO/2 VOL VCCO/2 VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCCO Output Waveform 1 S1 at 2 × VCCO (see Note B) VCCO/2 VOL + VTP VOL t PHZ t PZH Output Waveform 2 S1 at GND (see Note B) VCCO/2 VOH − VTP VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. VCCI is the VCC associated with the input port. I. VCCO is the VCC associated with the output port. Figure 2. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): SN74AVCB164245-Q1 9 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 PACKAGING INFORMATION Orderable Device CAVCB164245QDGGRQ1 Status (1) Package Type Package Drawing ACTIVE TSSOP DGG Pins Package Qty 48 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74AVCB164245-Q1 : • Catalog: SN74AVCB164245 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CAVCB164245QDGGRQ1 TSSOP DGG 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.8 1.8 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CAVCB164245QDGGRQ1 TSSOP DGG 48 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated