TI V62/09605-01YE

SN74LVCH16T245-EP
www.ti.com........................................................................................................................................................................................... SCES726 – NOVEMBER 2008
16-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
FEATURES
1
•
•
•
•
•
•
•
•
Control Inputs VIH/VIL Levels Are Referenced to
VCCA Voltage
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
Overvoltage-Tolerant Inputs/Outputs Allow
Mixed-Voltage-Mode Data Communications
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.65-V to
5.5-V Power-Supply Range
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
•
•
•
(1)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Ranges (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
DGG OR DGV PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCCB
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCCB
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCCA
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCCA
2A5
2A6
GND
2A7
2A8
2OE
Additional temperature ranges are available – contact factory
DESCRIPTION/ORDERING INFORMATION
This 16-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional
translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
The SN74LVCH16T245 is designed so that the control pins (1DIR, 2DIR, 1OE, and 2OE) are supplied by VCCA.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
SN74LVCH16T245-EP
SCES726 – NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
The SN74LVCH16T245 is designed for asynchronous communication between two data buses. The logic levels
of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the
A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A
bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs
are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW
level applied to prevent excess ICC and ICCZ.
Active bus-hold circuitry holds unused or undriven data inputs at a valid logic state. Use of pullup or pulldown
resistors with the bus-hold circuitry is not recommended.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
The VCC isolation feature ensures that if either VCC input is at GND, then all outputs are in the high-impedance
state. The bus-hold circuitry on the powered-up side always stays active.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–55°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
Top-Side Marking
TSSOP – DGG
Tape and reel
CLVCH16T245MDGGREP
8UT245MEP
TVSOP – DGV
Tape and reel
CLVCH16T245MDGVREP
LDHT245MEP
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
GQL OR ZQL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
SN74LVCH16T245-EP
www.ti.com........................................................................................................................................................................................... SCES726 – NOVEMBER 2008
TERMINAL ASSIGNMENTS (1)
1
(1)
2
3
4
5
6
A
1DIR
NC
NC
NC
NC
1OE
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
VCCB
VCCA
1A3
1A4
D
1B6
1B5
GND
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
GND
2A4
2A3
H
2B5
2B6
VCCB
VCCA
2A6
2A5
J
2B7
2B8
GND
GND
2A8
2A7
K
2DIR
NC
NC
NC
NC
2OE
NC – No internal connection
FUNCTION TABLE (1)
(EACH 16-BIT SECTION)
CONTROL INPUTS
OE
(1)
OUTPUT CIRCUITS
OPERATION
DIR
A PORT
B PORT
L
L
Enabled
Hi-Z
B data to A bus
L
H
Hi-Z
Enabled
A data to B bus
H
X
Hi-Z
Hi-Z
Isolation
Input circuits of the data I/Os are always active.
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
To Seven Other Channels
24
2OE
36
13
1B1
2B1
To Seven Other Channels
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
3
SN74LVCH16T245-EP
SCES726 – NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
Supply voltage range
VI
Input voltage range (2)
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
MIN
MAX
–0.5
6.5
I/O ports (A port)
–0.5
6.5
I/O ports (B port)
–0.5
6.5
Control inputs
–0.5
6.5
A port
–0.5
6.5
B port
–0.5
6.5
A port
–0.5 VCCA + 0.5
B port
–0.5 VCCB + 0.5
UNIT
V
V
V
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through each VCCA, VCCB, and GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
4
±100
DGV package
–65
V
mA
58
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 6.5 V maximum if the output current rating is observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
SN74LVCH16T245-EP
www.ti.com........................................................................................................................................................................................... SCES726 – NOVEMBER 2008
Recommended Operating Conditions (1) (2) (3)
VCCI
VCCA
VCCB
VCCO
Supply voltage
1.65 V to 1.95 V
VIH
High-level
input voltage
MAX
1.65
5.5
1.65
5.5
1.7
3 V to 3.6 V
VCCI × 0.7
1.65 V to 1.95 V
VIL
Data inputs (4)
VCCI × 0.35
2.3 V to 2.7 V
0.7
3 V to 3.6 V
0.8
4.5 V to 5.5 V
High-level
input voltage
Control inputs
(referenced to VCCA) (5)
VCCA × 0.65
2.3 V to 2.7 V
1.7
3 V to 3.6 V
V
2
4.5 V to 5.5 V
VCCA × 0.7
1.65 V to 1.95 V
VCCA × 0.35
2.3 V to 2.7 V
0.7
3 V to 3.6 V
0.8
VIL
Low-level
input voltage
Control inputs
(referenced to VCCA) (5)
VI
Input voltage
Control inputs
0
5.5
Active state
0
VCCO
3-State
0
5.5
4.5 V to 5.5 V
VI/O
IOH
Input/output voltage
High-level output current
Δt/
Δv
TA
(1)
(2)
(3)
(4)
(5)
Low-level output current
Input transition
rise or fall rate
Data inputs
V
VCCA × 0.3
1.65 V to 1.95 V
–4
2.3 V to 2.7 V
–8
3 V to 3.6 V
–24
4.5 V to 5.5 V
–32
1.65 V to 1.95 V
IOL
V
VCCI × 0.3
1.65 V to 1.95 V
VIH
V
V
2
4.5 V to 5.5 V
Low-level
input voltage
UNIT
VCCI × 0.65
2.3 V to 2.7 V
Data inputs (4)
MIN
V
mA
4
2.3 V to 2.7 V
8
3 V to 3.6 V
24
4.5 V to 5.5 V
32
1.65 V to 1.95 V
20
2.3 V to 2.7 V
20
3 V to 3.6 V
10
4.5 V to 5.5 V
5
Operating free-air temperature
V
–55
125
mA
ns/V
°C
VCCI is the VCC associated with the data input port.
VCCO is the VCC associated with the output port.
All unused control inputs of the device must be held at VCCA GND to ensure proper device operation and minimize power consumption.
Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V.
For VCCA values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
5
SN74LVCH16T245-EP
SCES726 – NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
Electrical Characteristics (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VOL
Control
inputs
II
IBHL (3)
IBHH (4)
VCCA
VCCB
IOH = –100 µA,
TEST CONDITIONS
VI = VIH
1.65 V to 4.5 V
1.65 V to 4.5 V
IOH = –4 mA,
VI = VIH
1.65 V
1.65 V
1.2
IOH = –8 mA,
VI = VIH
2.3 V
2.3 V
1.9
IOH = –24 mA,
VI = VIH
3V
3V
2.4
IOH = –32 mA,
VI = VIH
4.5 V
4.5 V
3.8
IOL = 100 µA,
VI = VIL
1.65 V to 4.5 V
1.65 V to 4.5 V
0.1
IOL = 4 mA,
VI = VIL
1.65 V
1.65 V
0.45
IOL = 8 mA,
VI = VIL
2.3 V
2.3 V
0.3
IOL = 24 mA,
VI = VIL
3V
3V
0.55
IOL = 32 mA,
VI = VIL
4.5 V
4.5 V
0.55
1.65 V to 5.5 V
1.65 V to 5.5 V
VI = 0.58 V
1.65 V
1.65 V
15
VI = 0.7 V
2.3 V
2.3 V
45
VI = 0.8 V
3V
3V
75
VI = VCCA or GND
Ioff
A or B
port
IOZ
B port
A port
ICCA
±1
4.5 V
100
1.65 V
–15
VI = 1.7 V
2.3 V
2.3 V
–45
3V
3V
–75
VI or VO = 0 to 5.5 V
VO = VCCO or
GND,
VI = VCCI or GND
OE = VIH
OE = don't
care
VI = VCCI or GND, IO = 0
4.5 V
4.5 V
–100
1.95 V
1.95 V
200
2.7 V
2.7 V
300
3.6 V
3.6 V
500
5.5 V
5.5 V
900
1.95 V
1.95 V
–200
2.7 V
2.7 V
–300
3.6 V
3.6 V
–500
µA
µA
5.5 V
5.5 V
0V
0 to 5.5 V
±0.5
±1.5
–900
±20
0 to 5.5 V
0V
±0.5
±1.5
±20
1.65 V to 5.5 V
1.65 V to 5.5 V
±1
±4
0V
5.5 V
±1
±4
±1
±4
5.5 V
0V
1.65 V to 5.5 V
1.65 V to 5.5 V
20
5V
0V
20
0V
5V
–4
1.65 V to 5.5 V
1.65 V to 5.5 V
20
5V
0V
–4
0V
5V
20
ICCA + ICCB
VI = VCCI or GND, IO = 0
1.65 V to 5.5 V
1.65 V to 5.5 V
30
(5)
(6)
6
µA
µA
VI = VCCI or GND, IO = 0
(4)
V
µA
ICCB
(1)
(2)
(3)
UNIT
V
±3
4.5 V
VI = 0 to VCC
B port
±0.5
1.65 V
VI = 0 to VCC
A port
MIN MAX
VCCO – 0.1
VI = 1.07 V
VI = 3.15 V
IBHHO (6)
TYP MAX
VI = 0.1.35 V
VI = 2 V
IBHLO (5)
MIN
µA
µA
µA
µA
µA
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the input port.
The bus-hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND
and then raising it to VIL max.
The bus-hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to
VCC and then lowering it to VIH min.
An external driver must source at least IBHLO to switch this node from low to high.
An external driver must sink at least IBHHO to switch this node from high to low.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
SN74LVCH16T245-EP
www.ti.com........................................................................................................................................................................................... SCES726 – NOVEMBER 2008
Electrical Characteristics (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
3 V to 5.5 V
3 V to 5.5 V
ΔICCA
DIR
DIR at VCCA – 0.6 V,
B port = open,
A port at VCCA or GND
Ci
Control
inputs
VI = VCCA or GND
3.3 V
3.3 V
Cio
A or B
port
VO = VCCA/B or GND
3.3 V
3.3 V
MIN
TYP MAX
MIN MAX
UNIT
50
µA
4
5
pF
8.5
10
pF
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.7
25.9
1.3
13.2
1
11.4
0.4
11.1
ns
B
A
0.9
27.8
0.8
27.8
0.7
27.4
0.7
27.4
ns
OE
A
1.5
33.6
1.5
33.4
1.5
33.3
1.4
33.2
ns
OE
B
2.4
36.2
1.9
17.1
1.7
16
1.3
14.3
ns
OE
A
0.4
28
0.4
27.8
0.4
27.7
0.4
27.7
ns
OE
B
1.8
36
1.5
22
1.2
16.6
0.9
14.8
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
MIN
MAX
MIN MAX
B
1.5
25.4
1.2
B
A
1.2
13.3
OE
A
1.4
OE
B
OE
OE
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
13
0.8
10.2
0.6
8.8
ns
1
13.1
1
12.9
0.9
12.8
ns
13
1.4
13
1.4
13
1.4
13
ns
2.3
33.6
1.8
14
1.7
14.3
0.9
10.9
ns
A
1
14.9
1
14.9
1
14.9
1
14.9
ns
B
1.7
32.2
1.5
16.9
1.2
13.4
1
10.9
ns
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
7
SN74LVCH16T245-EP
SCES726 – NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
1.6
25.2
1.1
12.8
0.8
10.2
0.6
8.4
ns
B
A
0.8
11.2
0.8
10.2
0.7
10.1
0.6
10
ns
OE
A
1.6
12.2
1.6
12.2
1.6
12.2
1.6
12.2
ns
OE
B
2.1
33
1.7
14.3
1.5
12.8
0.8
10.3
ns
OE
A
0.8
11.8
0.8
12.1
0.8
12.1
0.8
12.1
ns
OE
B
1.8
3.7
1.4
16.4
1.1
12.5
0.8
10.4
ns
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPHZ
tPLZ
tPHZ
tPLZ
tPZH
tPZL
tPZH
tPZL
FROM
(INPUT)
TO
(OUTPUT)
A
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN MAX
VCC = 3.3 V
± 0.3 V
MIN MAX
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN MAX
B
1.5
25.4
1
12.8
0.7
10
0.4
8.2
ns
B
A
0.7
11
0.4
8.8
0.3
8.5
0.3
8.3
ns
OE
A
0.3
9.4
0.3
9.4
0.3
9.4
0.3
9.4
ns
OE
B
2
32.7
1.8
13.7
1.4
12
0.7
9.7
ns
OE
A
0.7
10.4
0.7
10.4
0.7
10.4
0.7
10.4
ns
OE
B
1.5
31.6
1.3
15.4
1
12.1
0.9
10
ns
Operating Characteristics
TA = 25=C
PARAMETER
CpdA (1)
CpdB (1)
(1)
8
TEST
CONDITIONS
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
B-port input, A-port output
VCCA =
VCCB = 1.8 V
VCCA =
VCCB = 2.5 V
VCCA =
VCCB = 3.3 V
VCCA =
VCCB = 5 V
TYP
TYP
TYP
TYP
2
2
2
3
18
19
19
22
18
19
20
22
2
2
2
2
UNIT
pF
Power dissipation capacitance per transceiver
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
SN74LVCH16T245-EP
www.ti.com........................................................................................................................................................................................... SCES726 – NOVEMBER 2008
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
RL
tw
LOAD CIRCUIT
VCCI
VCCI/2
Input
VCCO
CL
RL
VTP
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
15 pF
15 pF
15 pF
15 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.15 V
0.15 V
0.3 V
0.3 V
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
VCCA/2
0V
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VOH
VCCO/2
VOL
VCCO/2
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPZH
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VCCO/2
VOH − VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns,
dv/dt ≥1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVCH16T245-EP
9
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CLVCH16T245MDGGREP
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CLVCH16T245MDGVREP
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/09605-01XE
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/09605-01YE
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVCH16T245-EP :
• Catalog: SN74LVCH16T245
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CLVCH16T245MDGGRE
P
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CLVCH16T245MDGVREP TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CLVCH16T245MDGGREP
TSSOP
DGG
48
2000
346.0
346.0
41.0
CLVCH16T245MDGVREP
TVSOP
DGV
48
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated