Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification ATP Industrial Grade mSATA Embedded Module Specification Version 1.2 Your Ultimate Memory Solution! 1 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification Disclaimer ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. The information in this manual is subject to change without notice. ATP general policy does not recommend the use of its products in life support applications where in a failure or malfunction of the product may directly threaten life or injury. All parts of the ATP documentation are protected by copyright law and all rights are reserved. This documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without prior consent, in writing, from ATP Corporation. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by ATP. Revision History Date Version Dec. 15th, 2011 Jan. 12th, 2012 Aug. 6th, 2012 1.0 1.1 1.2 Changes compared to previous issue - First release - Updated SSD endurance data - Added Static Data Refresh feature Your Ultimate Memory Solution! 2 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification Table of Contents 1 INTRODUCTION ...................................................................................................... 5 1.1 1.2 2 Product Overview ..................................................................................................... 5 Main Features ............................................................................................................ 5 PRODUCT SPECIFICATION ................................................................................. 6 2.1 2.2 2.3 2.4 Product Image ........................................................................................................... 6 Product Capacities..................................................................................................... 6 Block Diagram .......................................................................................................... 7 Performance .............................................................................................................. 8 2.4.1 IOPS ..................................................................................................................................... 8 2.4.2 Read/Write Performance ...................................................................................................... 8 2.5 Electriacal Characteristics ......................................................................................... 8 2.5.1 Supply Voltage ..................................................................................................................... 8 2.5.2 System Power Requirement .................................................................................................. 9 2.6 Environment Specifications ...................................................................................... 9 2.6.1 Temperature and Humidity ................................................................................................... 9 2.6.2 Vibration and Shock ............................................................................................................. 9 2.6.3 Altitude ................................................................................................................................. 9 2.7 2.8 2.9 3 MTBF ...................................................................................................................... 10 Write/Erase Endurance ........................................................................................... 10 Certification ............................................................................................................ 11 SATA EMBEDDED MODULE PIN ASSIGNMENT .......................................... 12 3.1 3.2 Pin Location ............................................................................................................ 12 Pin Assignments...................................................................................................... 13 COMMAND SETS ................................................................................................... 15 4 4.1 4.2 4.3 ATA Command Set................................................................................................. 15 Identify Device Data ............................................................................................... 16 SMART Information ............................................................................................... 18 4.3.1 SMART subcommand sets ................................................................................................. 18 4.3.2 SMART Read Data ............................................................................................................ 18 4.3.3 ATP SMART Tool ............................................................................................................. 20 5 MECHANICAL INFORMATION ......................................................................... 21 5.1 5.2 6 Physical Dimension Specifications ......................................................................... 21 Mechanical Form Factor ......................................................................................... 21 APPENDIX ............................................................................................................... 21 Your Ultimate Memory Solution! 3 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification This Page Intentionally Left Blank Your Ultimate Memory Solution! 4 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 1 Introduction 1.1 Product Overview The ATP industrial grade mSATA Embedded Module is a high performance and high capacity mass storage solution. It provides outstanding performance and proven reliability for products operating. ATP industrial grade mSATA Embedded Module is perfect for thin devices, especially networking, thin clients and embedded appliance and also suit for enterprise storage systems with outstanding sequential read and write performance to relieve performance bottlenecks associated with traditional rotating media HDD storage. 1.2 Main Features Capacities: 4GB to 64GB SLC (Single Level Cell) NAND flash memory Operating temperature: -40℃ to 85℃ Maximum performance: Sequential read up to 258MB/s, sequential write up to 220MB/s JEDEC standard: MO-300A (mSATA) Slim form factor for design in thin devices, especially networking, thin clients and embedded appliance. Secure erase drive protection. Extensive application for storage Compliant with Serial ATA Revision 2.6. Support PIO mode 0~4, MDMA mode 0~2,UDMA mode 0~6 Compatible with SATA 1.5Gbps and SATA 3.0Gbps interface rates SMART function support by ATA CMD ATP SMART tool for Windows 2000/XP/Vista/7 and Linux. Support TRIM command (Windows 7 and up, latest Linux Kernel), Off-line TRIM utility available for Windows XP/2000/2003/Vista Enhanced endurance by Global wear-leveling Static data refresh feature PowerProtector, data integrity under power-cycling RoHS compliant CE , FCC certification Your Ultimate Memory Solution! 5 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 2 Product Specification 2.1 Product Image 2.2 Product Capacities Table 2-1 ATP P/N CAPACITY AF4GSSHI-OAAXP AF8GSSHI-OAAXP AF16GSSHI-OAAXP AF32GSSHI-OAAXP AF64GSSHI-OAAXP 4GB 8GB 16GB 32GB 64GB Notes: 1GB = 1,000,000,000 Byte Your Ultimate Memory Solution! 6 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 2.3 Block Diagram ATP industrial grade mSATA Embedded Module consists of below functional blocks. The advanced architecture is optimized to provide highest data reliability and transfer performance. Figure 2 ATP mSATA Embedded Module SATA II controller MiniPCIE Host Device High Performance Processor Core SRAM ROM Flash Controller DRAM Buffer Voltage Regulator (3.3V to 1.2V) Your Ultimate Memory Solution! 7 ECC Engine ATP Confidential &Proprietary SLC NAND Flash Memory Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 2.4 Performance 2.4.1 IOPS Table 2-2 Type Value 4K Random Read IOPS 4,700 IOPS Notes: IOPS: Input/Output Operations per Second 2.4.2 Read/Write Performance Table 2-3 Type Value Host Interface Speed SATA 1.5Gb/s and SATA 3.0 Gb/s Sequential Read: up to 258MB/s Sequential Write: up to 220MB/s Data Transfer Rate1 Notes: The performance may vary according to different product capacity. 2.5 Electrical Characteristics 2.5.1 Supply Voltage Table 2-4 Parameter Supply voltage Symbol Min Typ Max Unit VCC 3.15 3.3 3.45 V Your Ultimate Memory Solution! 8 ATP Confidential &Proprietary Remark Version 1.2 2.5.2 ATP Industrial Grade mSATA Embedded Module Specification System Power Requirement Table 2-5 Parameter Symbol Min Typ Max Unit Remark PW PR PS - 1.40 1.00 0.45 - W W W RMS value RMS value RMS value Sustained write power Sustained read power Idle power 2.6 Environment Specifications 2.6.1 Temperature and Humidity Table 2-6 Type Temperature Humidity Value Operating Non-Operating Operating Non-Operating -40oC to 85oC -45oC to 85oC 25oC，8% to 95%, noncondensing 40oC，8% to 93%, noncondensing 2.6.2 Vibration and Shock Table 2-7 Type Vibration Shock Value Operating Operating sine 16.4G, 10~2000Hz Half sine 1500G/0.5ms 2.6.3 Altitude Table 2-8 Type Altitude Value Operating Non-Operating 80,000 feet Max. 80,000 feet Max. Your Ultimate Memory Solution! 9 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 2.7 MTBF Table 2-9 Type Value 4GB: 1,080,000 hours 8GB: 1,060,000 hours 16GB: 1,030,000 hours 32GB: 1,000,000 hours 64GB: 1,000,000 hours MTBF (@ 25oC) 1 Notes: The Mean Time between Failures (MTBF) is calculated using a prediction methodology, Telcordia SR-332, which based on reliability data of the individual components in the mSATA. It assumes nominal voltage, with all other parameters within specified range. 2.8 Write/Erase Endurance Table 2-10 Type Endurance Technology SSD Endurance Value Enhanced global dynamic and static wear-leveling algorithm SLC flash block: 100,000 program/erase cycles 4GB: 40 terabyte random write 80 terabyte sequential write 8GB: 80 terabyte random write 160 terabyte sequential write 16GB: 160 terabyte random write 320 terabyte sequential write 32GB: 320 terabyte random write 640 terabyte sequential write 64GB: 640 terabyte random write 1,280 terabyte sequential write Note: Endurance for the mSATA module can be predicted based on the usage conditions applied to the device, the internal NAND component cycles, the write amplification factor, and the wear leveling efficiency of the drive. Your Ultimate Memory Solution! 10 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 2.9 Certification Table 2-11 Mark/Approval Documentation Compliant The CE marking (also known as CE mark) is a mandatory conformance mark on many products placed on the single market in the European Economic Area (EEA). The CE marking certifies that a product has met EU consumer safety, health or environmental requirements. CE stands for Conformité Européenne, "European conformity" in French. Yes FCC Part 15 Class B was used for Evolution of United States (US) Emission Standards for Commercial Electronic Products, The United States (US) covers all types of unintentional radiators under Subparts A and B (Sections 15.1 through 15.199) of FCC 47 CFR Part 15, usually called just FCC Part 15 Yes RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known as Directive 2002/95/EC, originated in the European Union and restricts the use of specific hazardous materials found in electrical and electronic products. All applicable products in the EU market after July 1, 2006 must pass RoHS compliance. For the complete directive, see Directive 2002/95/EC of the European Parliament. Yes Your Ultimate Memory Solution! 11 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 3 SATA Embedded Module Pin Assignment 3.1 Pin Location The following figure shows the pin location of the mSATA embedded module, the connector is with both signal and power segments Figure 3 Your Ultimate Memory Solution! 12 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 3.2 Pin Assignments There are total of 52 pins, the pin definitions are shown in Table 3-1 Table 3-1 Pin No. Function Description P1 Reserved No Connect P2 +3.3V 3.3V Source P3 Reserved No Connect P4 GND Return Current Path P5 Reserved No Connect P6 +1.5V Not used in ATP design P7 Reserved No Connect P8 Reserved No Connect P9 GND Return Current Path P10 Reserved No Connect P11 Reserved No Connect P12 Reserved No Connect P13 Reserved No Connect P14 Reserved No Connect P15 GND Return Current Path P16 Reserved No Connect P17 Reserved No Connect P18 GND Return Current Path P19 Reserved No Connect P20 Reserved No Connect P21 GND Return Current Path P22 Reserved No Connect P23 +B Host Receiver Differential Signal Pair P24 +3.3V 3.3V Source P25 -B Host Receiver Differential Signal Pair P26 GND Return Current Path P27 GND Return Current Path P28 +1.5V Not used in ATP design P29 GND Return Current Path P30 Two Wire Interface Two Wire interface Clock3 P31 +A Host Transmitter Differential Signal Pair P32 Two Wire Interface Two Wire interface Data3 P33 -A Host Transmitter Differential Signal Pair P34 GND Return Current Path P35 GND Return Current Path P36 Reserved No Connect P37 GND Return Current Path P38 Reserved No Connect Your Ultimate Memory Solution! 13 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification Pin No. Function Description P39 +3.3V 3.3V Source P40 GND Return Current Path P41 +3.3V 3.3V Source P42 Reserved No Connect P43 GND Return Current Path P44 Reserved No Connect P45 Vender Not used in ATP design 2 P46 Reserved No Connect P47 Vender Not used in ATP design 2 P48 +1.5V Not used in ATP design P49 DA/DSS Device Activity Signal / Disable Staggered Spin-up P50 GND Return Current Path P51 Presence Detection Shall be pulled to GND by device1 P52 +3.3V 3.3V Source Notes: 1. Presence detection pin provided for tamper proof functionality 2. No connect on the host side. 3. Pins 30 and 32 are intended for use as a two wire interface to read a memory device to determine device information (an example of this would be for use as SMB bus pins). These pins are not designed to be active in conjunction with the SATA signal differential pairs. Not used in ATP design. Your Ultimate Memory Solution! 14 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 4 Command Sets 4.1 ATA Command Set ATP industrial grade mSATA Embedded module support the commands show in the following table Table 4-1 Command Code Protocol 90h Device diagnostic General Feature Set Execute Drive Diagnostic Flush Cache E7h Non-data Identify Device ECh PIO data-in Read DMA C8h DMA Read Multiple C4h PIO data-in Read Sector(s) 20h PIO data-in Read Verify Sector(s) 40h or 41h Non-data Set Feature EFh Non-data Set Multiple Mode C6h Non-data Write DMA CAh DMA Write Multiple C5h PIO data-out Write Sector(s) 30h PIO data-out NOP 00h Non-data Read Buffer E4h PIO data-in Write Buffer E8h PIO data-out Check Power Mode E5h or 98h Non-data Idle E3h or 97h Non-data Idle Immediate E1h or 95h Non-data Sleep E6h or 99h Non-data Standby E2h or 96h Non-data Standby Immediate E0h or 94h Non-data Security Set Password F1h PIO data-out Security Unlock F2h PIO data-out Security Erase Prepare F3h Non-data Security Erase Unit F4h PIO data-out Security Freeze Lock F5h Non-data Security Disable Password F6h PIO data-out SMART Disable Operation B0h Non-data SMART Enable/Disable Autosave B0h Non-data SMART Enable Operations B0h Non-data SMART Return Status B0h Non-data SMART Execute Off-Line Immediate B0h Non-data Power Management Feature Set Security Mode Feature Set SMART Feature Set Your Ultimate Memory Solution! 15 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification Command Code Protocol SMART Read Data B0h PIO data-in Read Native Max Address F8h Non-data Set Max Address F9h Non-data Host Protected Area Feature Set Set Max Set Password F9h PIO data-out Set Max Lock F9h Non-data Set Max Freeze Lock F9h Non-data Set Max Unlock F9h PIO data-out 4.2 Identify Device Data Table 4-2 Word Default Value Total Address Bytes Data Field Type lnformation 0 044Ah 2 General Configuration 1 XXXXh 2 Default number of cylinders 2 0000h 2 Reserved 3 00XXh 2 Default number of heads 4 0000h 2 Obsolete 5 0240h 2 Obsolete 6 XXXXh 2 Default number of sectors per track 7-8 XXXXh 4 Number of sectors per card (Word 7 = MSW, Word 8 = LSW) 9 0000h 2 Obsolete 10-19 XXXXh 20 Serial number in ASCII (Right justified) 20 0002h 2 Obsolete 21 0002h 2 Obsolete 22 0000h 2 Obsolete 23-26 XXXXh 8 Firmware revision in ASCII. Big Endian Byte Order in Word 40 27-46 47 8001h 2 Model number in ASCII (Left justified) Big Endian Byte Order in Word Maximum number of sectors on Read/Write Multiple command 48 XXXXh 0000h 2 Reserved 49 0F00h 2 Capabilities 50 4000h 2 Capabilities 51 0200h 2 PIO data transfer cycle timing mode 52 0000h 2 Obsolete 53 0007h 2 Field validity 54 XXXXh 2 Current numbers of cylinders 55 XXXXh 2 Current numbers of heads 56 XXXXh 2 Current sectors per track 4 Current capacity in sectors (LBAs) (Word57=LSW, Word58=MSW) 2 Multiple sector setting 57-58 XXXXh 59 0100h Your Ultimate Memory Solution! 16 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification Word Default Value Address Total Bytes 60-61 Data Field Type lnformation XXXXh 4 Total number of sectors addressable in LBA Mode (Word60=LSW, Word61=MSW) 62 0000h 2 Reserved 63 0007h 2 Multiword DMA transfer 64 0003h 2 Advanced PIO modes supported 65 0078h 2 Minimum Multiword DMA transfer cycle time per word 66 0078h 2 Recommended Multiword DMA transfer cycle time 67 0078h 2 Minimum PIO transfer cycle time without flow control 68 0078h 2 Minimum PIO transfer cycle time with lORDY flow control 69~75 0000h 20 76 0060h 2 Reserved Serial ATA capabilities Support Serial ATA Gen1 Support Serial ATA Gen2 77~79 0000h 6 Reserved 80 0080h 2 Major version number (ATAPI-7) 81 0000h 2 Minor version number 82 742Bh 2 Command sets supported 0 83 5500h 2 Command sets supported 1 84 4002h 2 Command sets supported 2 85~87 XXXXh 6 Command set/feature enabled 88 007Fh 2 Ultra DMA supported and selected 89 0003h 2 Time required for Security erase unit completion 90 0000h 2 Time required for Enhanced security erase unit completion 91 0000h 2 Current Advanced power management value 92 FFFEh 2 Master Pasword Revision Code 93~127 0000h 70 Reserved 128 0001h 2 Security status 129~159 0000h 62 Vendor unique bytes 160 0000h 2 Power requirement description 161 0000h 2 Reserved 162 0000h 2 Key management schemes supported 163 0000h 2 CFA True lDE Timing Mode Capability and Setting 164 0000h 2 Reserved 165~175 0000h 22 Reserved 176~216 0000h 82 Reserved 217 0100h 2 Non-rotating media(SSD) 218~255 0000h 76 Reserved Your Ultimate Memory Solution! 17 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 4.3 SMART Information ATP industrial grade mSATA Embedded Module Support S.M.A.R.T. ATA feature set in IDE mode, not support in RAID mode and AHCI mode 4.3.1 SMART subcommand sets In order to select a subcommand the host must write the subcommand code to the device's Features Register before issuing the SMART Function Set command. The subcommands are listed below. Table 4-3 Command Command Code SMART READ DATA D0h SMART SAVE ATTRIBUTE THRESHOLD D1h SMART ENABLE/DISABLE AUTOSAVE D2h SMART SAVE ATTRIBUTE VALUES D3h SMART EXECUTE OFF-LINE IMMIDIATE D4h RESERVED D5h RESERVED D6h SMART ENABLE OPERATIONS D8h SMART DISABLE OPERATIONS D9h SMART RETURN STATUS DAh Note: If the reserved size is below a threshold, status can be read from the Cylinder Register using the Return Status command (DAh) 4.3.2 SMART Read Data (subcommand D0h) The following 512 bytes make up the device SMART data structure. Users can obtain the data using the “Read Data” command (D0h). Table 4-4 Byte F/V Description 0~1 X Revision code 2~361 X Vendor Specific 362 V Off-line data collection status Your Ultimate Memory Solution! 18 ATP Confidential &Proprietary Version 1.2 Byte ATP Industrial Grade mSATA Embedded Module Specification F/V Description 363 X Self-test execution status byte 364~365 V Total time in seconds to complete off-line data collection activity 366 X Vendor Specific 367 F Off-line data collection capability 368~369 F SMART capability 370 F Error logging capability：7-1 Reserved 0 -1 = Device error logging supported 371 X Vendor Specific 372 F Short self-test routine recommended polling time(in minutes) 373 F Extended self-test routine recommended polling time(in minutes) 374 F Conveyance self-test routine recommended polling time(in minutes) 375~385 R 386~395 F Firmware Version/Date Code 396~397 F Number of initial invalid block (396=MSB, 397=LSB) 398~399 V Number of run time bad block (398=MSB, 399=LSB) 400~406 F SMI2242 407~415 X Vendor specific 416 F Reserved 417 F Program/write the strong page only 418~419 V Number of spare block 420 F Reserved 421~423 V Average erase count 424~425 V Number of child pair 426~428 V Maximum erase count 429~431 V Minimum erase count 432~445 F Reserved 446~510 X Vendor specific 511 V Data structure checksum Reserved Notes: F=content (byte) is fixed and does not change V=content (byte) is variable and maybe change depending on the state of the device or the command executed by the device X= content (byte) is vendor specific and maybe fixed or variable R=content (byte) is reserved and shall be zero Your Ultimate Memory Solution! 19 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 4.3.3 ATP SMART Tool ATP provides SMART Tool for Windows 2000/XP/Vista/7 and Linux, it can monitor the state of mSATA Embedded module, the following picture shows SMART tool operation. This tool supports that users read spare and bad block information. Users can thus evaluate drive health at run time and receive an early warning before the drive life ends. Figure 4 Your Ultimate Memory Solution! 20 ATP Confidential &Proprietary Version 1.2 ATP Industrial Grade mSATA Embedded Module Specification 5 Mechanical Information 5.1 Physical Dimension Specifications Table 5-1 Type mSATA Embedded module Value Length Width Thickness 50.80 mm +/- 0.15mm 29.85mm +/- 0.1mm 3.40mm +/- 0.1mm 5.2 Mechanical Form Factor (Units in mm) Figure 5 6 Appendix Your Ultimate Memory Solution! 21 ATP Confidential &Proprietary