DATA SHEET (Tentative) Part No. AN26031A Package Code No. ALGA005-W-0609ANA Publication date: May 2012 Ver. EB 1 AN26031A Contents Overview …………………………………………………………………………………………………………… 3 Features …………………………………………………….……………………………………………………… 3 Applications ……………………………………………….………………………………….……………………… 3 Package ………………………………………………….………………………………………………………… 3 Type …………………………………………………….…………………………………………………………… 3 Application Circuit Example (Block Diagram) …………………………………………………………………… 4 y 2.5 GHz Band Application ………………………………………………………………………………………… 4 y 3.5 GHz Band Application ………………………………………………………………………………………… 5 Pin Descriptions …………………………………….……………………………………………………………… 6 Absolute Maximum Ratings ……………………………………………………………………………………… 7 Operating Supply Voltage Range ………………………………………………………………………………… 7 Allowable Voltage Range ………………………………………………………………………………………… 8 Electrical Characteristics ………………………………………………………………………………………… 9 Electrical Characteristics (Reference values for design) ………………………………………………………. 11 Control Pin Mode Table …………………………………………………………………………………………… 12 Truth Table ………………………………………………………………………………………………………… 12 Technical Data ……………………………………………………………………………………………………… 13 y I/O block circuit diagrams and pin function descriptions ……………………………………………………… 13 y PD ⎯ Ta diagram ………………………………………………………………………………………………… 14 Usage Note ……………………………….…………………………………………………………………………… 15 Ver. EB 2 AN26031A AN26031A (Tentative) Single Band LNA-IC for 2.5 GHz Band Applications Overview y AN26031A is a single band LNA (Low Noise Amplifier)-IC for 2.5 GHz Band applications. y Realizing high performance by using 0.18 μm SiGeC Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz). y High/Low Gain-mode is changeable, controlled by integrated CMOS logic circuit. y Achieving miniaturization by using small size Wafer Level Chip Size Package (WLCSP). Features y Low voltage operation y Low current consumption y High gain y Low noise figure yLow distortion ySmall package +3.0 V typ. 7.5 mA typ. 7.5 μA typ. 18.5 dB typ. 0.8 dB typ. +2.5 dBm typ. (High-Gain mode) (Low-Gain mode) (High-Gain mode) (High-Gain mode) (High-Gain mode) Applications y 2.5 GHz Single Band LNA Package y5 pin Wafer level chip size package (WLCSP) Size : 0.86 × 0.56 mm2 (0.3 mm pitch) Type y Bi-CMOS IC Ver. EB 3 AN26031A Application Circuit Example (Block Diagram) y 2.5 GHz Band Application (Top View) RF output (2.5 GHz Band) 50 Ω VCC A3 B3 C2 A2 A1 B1 CNT (Gain cnt) C1 L1 50 Ω RF input (2.5 GHz Band) Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on the design of mass production set. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. Ver. EB 4 AN26031A Application Circuit Example (Block Diagram) (continued) y 3.5 GHz Band Application (Top View) RF output (3.5 GHz Band) 50 Ω L2 VCC A3 B3 C2 A2 A1 B1 CNT (Gain cnt) C1 L1 50 Ω RF input (3.5GHz Band) Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on the design of mass production set. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. Ver. EB 5 AN26031A Descriptions Pin No. Pin name Type Input Description A1 IN RF input A2 GND Ground GND A3 OUT Output RF output B1 CNT Input B3 VCC Power Supply High-Gain/Low-Gain switch VCC Ver. EB 6 AN26031A Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values. A No. Parameter Symbol Rating Unit Notes 1 Supply voltage VCC 3.7 V *1 2 Supply current ICC 18 mA — 3 Power dissipation PD 29 mW *2 4 Operating ambient temperature Topr –40 to +85 °C *3 5 Storage temperature Tstg –55 to +125 °C *3 Notes) *1 :The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 75°C for the independent (unmounted) IC package with a heat sink. When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. Operating supply voltage range Parameter Supply voltage range Symbol Range Unit Notes VCC 2.7 to 3.6 V * Note) * : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Ver. EB 7 AN26031A Allowable Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Voltage values, unless otherwise specified, are with respect to GND. y Do not apply external currents or voltages to any pin not specifically mentioned. y For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC. Pin No. Pin name Rating Unit Note — V *1 A1 IN A3 OUT – 0.3 to VCC V — B1 CNT – 0.3 to VCC V — Note) *1 : RF signal input pin. Do not apply DC current. Do not apply more than 0 dBm to RF input. Ver. EB 8 AN26031A Electrical Characteristics at VCC = 3.0 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Limits Conditions Min Typ Max Unit Note DC electrical characteristics DC-1 Supply current HG ICCH VCC current at High-Gain mode No input signal — 7.5 10 mA — DC-2 Supply current LG ICCL VCC current at Low-Gain mode No input signal — 7.5 15 μA — DC-3 Input voltage (High-Gain mode) VIH — 1.48 — 3.6 V — DC-4 Input voltage (Low-Gain mode) VIL — 0 — 0.6 V — DC-5 SW current (High) IIH Current at CNT pin VIH = VCC — 19 30 μA — Ver. EB 9 AN26031A Electrical Characteristics (continued) at VCC = 3.0 V Note) Ta = 25°C±2°C, fRX = 2.5 GHz, PRX = –30 dBm, CW unless otherwise specified. B No. Parameter Symbol Limits Conditions Min Typ Max Unit Note AC electrical characteristics A-1 Power Gain HG GHS High-Gain mode 16.6 18.5 20 dB — A-2 Power Gain LG GLS Low-Gain mode –8.8 –7 –5.2 dB — A-3 IIP3 –10 MHz offset HG –2 2.5 — dBm — IIP3H1S High-Gain mode f1 = fRX – 10 MHz f2 = fRX – 20 MHz Input 2 signals (f1, f2) Ver. EB 10 AN26031A Electrical Characteristics (Reference values for design) at VCC = 3.0 V Notes) Ta = 25°C±2°C, fRX = 2.3 GHz, 2.5 GHz, 2.7 GHz, PRX = –30 dBm, CW unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. B No. Parameter Symbol Conditions Reference values Min Typ Max Unit Note AC electrical characteristics C-1 Power Gain HG GHa High-Gain mode 16.1 18.5 20.5 dB — C-2 Power Gain LG GLa Low-Gain mode PRX = –20 dBm –9 –7 –5 dB — C-3 Noise Figure HG NFHa High-Gain mode — 0.95 1.45 dB *1 C-4 Noise Figure LG NFLa Low-Gain mode — 7 9.5 dB *1 C-5 IIP3 –10 MHz offset HG IIP3H1a High-Gain mode f1 = fRXa – 10 MHz f2 = fRXa – 20 MHz Input 2 signals (f1, f2) –2.5 2.5 — dBm — C-6 IIP3 +10 MHz offset HG IIP3H2a High-Gain mode f1 = fRXa + 10 MHz f2 = fRXa + 20 MHz Input 2 signals (f1, f2) –2.5 2.0 — dBm — C-7 Input P1dB HG IP1dBHa High-Gain mode –12 –8.5 — dBm — C-8 IIP3 +100 kHz offset LG Low-Gain mode f1 = fRXa f2 = fRXa + 100 kHz Input 2 signals (f1, f2) 10 24.5 — dBm — C-9 Input P1dB LG IP1dBLa Low-Gain mode 0 8 — dBm — C-10 Reverse Isolation HG ISOHa High-Gain mode 26 31 — dB — C-11 Reverse Isolation LG ISOLa Low-Gain mode 4.5 7 — dB — C-12 Input Return Loss HG S11Ha High-Gain mode 10 16 — dB — C-13 Input Return Loss LG S11La Low-Gain mode 7 8.5 — dB — C-14 Output Return Loss HG S22Ha High-Gain mode 10 19 — dB — C-15 Output Return Loss LG S22La Low-Gain mode 9.5 14.5 — dB — IIP3La Note) *1 : Connector & substrate loss (0.14 dB) included. Ver. EB 11 AN26031A Control Pin Mode Table Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage retention ranges. Pin voltage Pin No. Description B1 High-Gain/Low-Gain Switching (Gain Control) Low High Low-Gain High-Gain Remarks — Truth Table Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage retention ranges. CNT LNA Mode High High-Gain High-Gain Low Low-Gain Low-Gain Ver. EB 12 AN26031A Technical Data yI/O block circuit diagram and pin function descriptions Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Pin No. Waveform and voltage Impedance Internal circuit Description VCC A1 0.8 V A1 — LNA input — GND — LNA output GND A2 0.0 V — VCC A3 — A3 GND B1 B1 — 160 kΩ High-Gain/Low-Gain SW input Less than 0.60 V : Low-Gain mode More than 1.48 V : High-Gain mode GND B3 B3 3.3 V — Voltage supply GND Ver. EB 13 AN26031A Technical Data (continued) y PD ⎯ Ta diagram Ver. EB 14 AN26031A Usage Notes y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [2.5 GHz Band Applications]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book for any special application. 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that IC is not exposed to light. 10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. Ver. EB 15 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202