Preliminary XTL1025 • Surface Mount Seam-Weld Package • Good Frequency Stability over Temperature • Excellent Reliability • Complies with Directive 2002/95/EC (RoHS) 27.13480 MHz Crystal Unit P b The XTL1025 is a surface mount 5.0 x 3.2 mm crystal unit for use in wireless telecommunications devices, especially where an ultra-miniature package is needed for mobility. SM5032-4 Case Electrical Characteristics Characteristic Sym Notes Minimum Typical Nominal Frequency 27.134380 Mode of Oscillation Fundamental Maximum Units MHz Storage Temperature Range, Crystal Only -50 +125 °C Storage Temperature Range, in Tape and Reel -40 +85 °C Operating Temperature Range -20 +70 °C Frequency Stability over Operating Temperature Range ±30 ppm (referenced to the value at 25°C) FL Frequency Make Tolerance Equivalent Series Resistance Shunt Capacitance ±30 ppm @ 25°C ±3°C ESR 40 Ω CO 2.0 pF 100 µW Nominal Drive Level 10 CL Load Capacitance 12.0 Insulation Resistance at 100 VDC 500 Weight Stanard Shipping Quantity on 330 mm (13”) Reel Lid Symbolization (in addition to Lot and/or Date Codes) pF MΩ 0.037 ±0.005 g 3000 units 1025 YWWS C r y s ta l E q u iv a le n t C ir c u it 1 C E S R 3 O CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. US and international patents may apply. The design, manufacturing process, and specifications of this device are subject to change without notice. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 1 of 4 XTL1025 - 1/25/10 SM5032-4 Case 4-Terminal Surface-Mount Seam Weld Case 5.0 x 3.2 mm Nominal Footprint T o p V ie w 3 .2 ± 0 .1 5 .0 ± 0 .1 D o t in d ic a te s P in 3 lo c a tio n S id e V ie w Electrical Connections Pin Connection 1 2 3 4 I/O GND (lid) I/O GND (lid) 0 .8 ± 0 .1 B o tto m 1 .2 ± 0 .1 V ie w 2 .4 ± 0 .2 0 .8 ± 0 .1 1 2 4 3 1.2 ±0.1 1 .4 ± 0 .2 1.2 ±0.1 1.7 ±0.1 P in s 2 a n d 4 a r e c o n n e c te d to th e lid D im e n s io n s a r e in m m 2.2 ±0.1 Dot indicates Pin 4 Footprint (mm) Pin 3 Package Orientation in Carrier Tape www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 2 of 4 XTL1025 - 1/25/10 Reel Dimensions Tape Dimensions Notes: 1. Unless otherwise specified, tolerance on dimensions is ±0.1 mm 2. Material is black conductive polystyrene 3. 10 pitch cumulative tolerance is ±0.2 mm www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 3 of 4 XTL1025 - 1/25/10 Typical Reflow Profile R a m p u p 3 0 0 P re h e a t R e flo w C o o l D o w n T e m p e ra tu re (d e g C ) 2 5 0 2 0 0 1 5 0 1 0 0 5 0 0 0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0 T im e (s e c o n d s ) Notes: 1. Maximum peak temperature: 265 degrees C for 8 to 12 seconds 2. Typical reflow temperature: 217 ±5 degrees C for 90 to 100 seconds www.RFM.com E-mail: [email protected] ©2009-2010 by RF Monolithics, Inc. Page 4 of 4 XTL1025 - 1/25/10