TI SN74LVC32373A

SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
FEATURES
•
•
•
•
•
•
Member of the Texas Instruments Widebus+™
Family
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 4.2 ns at 3.3 V
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
•
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
Supports Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This 32-bit transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVC32373A is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers,
and working registers. It can be used as four 8-bit latches, two 16-bit latches, or one 32-bit latch. When the
latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are
latched at the levels set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
LFBGA – GKE
LFBGA – ZKE (Pb-free)
Tape and reel
ORDERABLE PART NUMBER
SN74LVC32373AGKER
SN74LVC32373AZKER
TOP-SIDE MARKING
NC373A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
GKE OR ZKE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
TERMINAL ASSIGNMENTS
2
1
2
A
1Q2
1Q1
B
1Q4
1Q3
C
1Q6
1Q5
D
1Q8
E
F
3
4
5
6
1OE
1LE
1D1
1D2
GND
GND
1D3
1D4
VCC
VCC
1D5
1D6
1Q7
GND
GND
1D7
1D8
2Q2
2Q1
GND
GND
2D1
2D2
2Q4
2Q3
VCC
VCC
2D3
2D4
G
2Q6
2Q5
GND
GND
2D5
2D6
H
2Q7
2Q8
2OE
2LE
2D8
2D7
J
3Q2
3Q1
3OE
3LE
3D1
3D2
K
3Q4
3Q3
GND
GND
3D3
3D4
L
3Q6
3Q5
VCC
VCC
3D5
3D6
M
3Q8
3Q7
GND
GND
3D7
3D8
N
4Q2
4Q1
GND
GND
4D1
4D2
P
4Q4
4Q3
VCC
VCC
4D3
4D4
R
4Q6
4Q5
GND
GND
4D5
4D6
T
4Q7
4Q8
4OE
4LE
4D8
4D7
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
FUNCTION TABLE
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1LE
A3
2OE
A4
2LE
C1
1D1
A5
A2
1D
H3
H4
C1
1Q1
2D1
E5
To Seven Other Channels
3OE
3LE
4OE
J4
4LE
C1
3D1
1D
To Seven Other Channels
2Q1
To Seven Other Channels
J3
J5
E2
1D
J2
T3
T4
C1
3Q1
4D1
N5
1D
N2
4Q1
To Seven Other Channels
3
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
impedance (4)
GKE/ZKE package
–65
V
40
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
MIN
MAX
1.65
3.6
1.5
Low-level input voltage
VI
1.7
VCC = 2.7 V to 3.6 V
2
VO
Output voltage
0.35 × VCC
0.7
VCC = 2.7 V to 3.6 V
0.8
0
5.5
High or low state
0
VCC
3-state
0
5.5
VCC = 1.65 V
IOH
High-level output current
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
4
V
V
V
–4
VCC = 2.3 V
–8
VCC = 2.7 V
–12
VCC = 3 V
–24
VCC = 1.65 V
IOL
V
VCC = 2.3 V to 2.7 V
Input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VIL
UNIT
mA
4
VCC = 2.3 V
8
VCC = 2.7 V
12
VCC = 3 V
24
–40
mA
10
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
1.65 V to 3.6 V
1.65 V
1.2
IOH = –8 mA
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = –24 mA
3V
2.2
IOL = 100 µA
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.7
IOL = 12 mA
2.7 V
0.4
3V
0.55
IOL = 24 mA
II
VI = 0 to 5.5 V
UNIT
V
V
3.6 V
±5
µA
Ioff
VI or VO = 5.5 V
0
±10
µA
IOZ
VO = 0 to 5.5 V
3.6 V
±10
µA
ICC
∆ICC
(1)
(2)
MAX
VCC – 0.2
IOH = –4 mA
IOH = –12 mA
VOL
MIN TYP (1)
VCC
VI = VCC or GND
IO = 0
3.6 V ≤ VI ≤ 5.5 V (2)
One input at VCC – 0.6 V,
40
3.6 V
Other inputs at VCC or GND
40
2.7 V to 3.6 V
500
µA
µA
Ci
VI = VCC or GND
3.3 V
5
pF
Co
VO = VCC or GND
3.3 V
6.5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
This applies in the disabled state only.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN MAX
VCC = 2.7 V
MIN MAX
MIN
MAX
VCC = 3.3 V
± 0.3 V
UNIT
MIN MAX
tw
Pulse duration, LE high
3.3
3.3
3.3
3.3
ns
tsu
Setup time, data before LE↓
1.6
1.2
1.7
1.7
ns
th
Hold time, data after LE↓
1
1.1
1.2
1.2
ns
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
D
LE
TO
(OUTPUT)
Q
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.5
6.4
1
4.2
1
4.9
1.6
4.2
1.5
7.1
1
4.8
1
5.3
2.1
4.6
UNIT
ns
ten
OE
Q
1.5
6.7
1
4.7
1
5.7
1.3
4.7
ns
tdis
OE
Q
1.5
8.4
1
5
1
6.3
2.5
5.9
ns
5
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
6
Power dissipation capacitance
per latch
Outputs enabled
Outputs disabled
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
32
35
39
4
4
6
UNIT
pF
SN74LVC32373A
32-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCES575 – JUNE 2004 – REVISED AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH - V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVC32373AGKER
ACTIVE
LFBGA
GKE
96
1000
SN74LVC32373AZKER
ACTIVE
LFBGA
ZKE
96
1000 Green (RoHS &
no Sb/Br)
TBD
Lead/Ball Finish
MSL Peak Temp (3)
SNPB
Level-3-220C-168 HR
SNAGCU
Level-3-250C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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