WS128K32-XXX White Electronic Designs 128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595 FEATURES ! Access Times of 15, 17, 20, 25, 35, 45, 55ns ! MIL-STD-883 Compliant Devices Available ! Packaging ! Commercial, Industrial and Military Temperature Ranges ! 5 Volt Power Supply ! Low Power CMOS • 66 pin, PGA Type, 1.075" square, Hermetic Ce ramic HIP (Package 400) ! TTL Compatible Inputs and Outputs ! Built in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ! Weight: WS128K32-XG1UX1 - 5 grams typical WS128K32-XG1TX - 5 grams typical WS128K32-XG2UX - 8 grams typical WS128K32-XG2LX - 8 grams typical WS128K32-XH1X - 13 grams typical WS128K32-XG4TX1 - 20 grams typical ! All devices are upgradeable to 512Kx32 1 • 68 lead, 40mm CQFP (G4T) , 3.56mm (0.140") (Package 502) • 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510) • 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.200") high, (Package 528). • 68 lead, 23.9mm Low Profile CQFP (G1U)1, 3.57mm (0.140"), (Package 519) • 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06 mm (0.160"), (Package 524) ! Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8 Note 1: Package Not Recommended For New Design FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X PIN DESCRIPTION TOP VIEW I/O0-31 Data Inputs/Outputs 13 6 14 7 3 0 15 11 4 1 16 12 5 2 A0-16 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM 9 October 2003 Rev. 14 1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS128K32-XXX White Electronic Designs FIG. 2 PIN CONFIGURATION FOR WS128K32-XG4TX1 PIN DESCRIPTION TOP VIEW I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM Note 1: Package Not Recommended For New Design FIG. 3 PIN CONFIGURATION FOR WS128K32-XG2UX, WS128K32-XG2LX, WS128K32-XG1TX AND WS128K32-XG1UX1 PIN DESCRIPTION TOP VIEW I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 2 WS128K32-XXX White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter TRUTH TABLE Symbol Min Max Unit CS OE WE Mode Data I/O Power TA -55 +125 °C °C H L L L X L X H X H L H Standby Read Write Out Disable High Z Data Out Data In High Z Standby Active Active Active Operating Temperature Storage Temperature TSTG -65 +150 Signal Voltage Relative to GND VG -0.5 Vcc+0.5 V Junction Temperature TJ 150 °C 7.0 V Supply Voltage -0.5 VCC CAPACITANCE (TA = +25°C) RECOMMENDED OPERATING CONDITIONS Parameter Parameter Symbol Min Max Unit Supply Voltage VCC 4.5 5.5 V Input High Voltage VIH 2.2 V CC + 0.3 V Input Low Voltage VIL -0.3 +0.8 V Operating Temp. (Mil.) TA -55 +125 °C Symbol Conditions Max OE capacitance COE VIN = 0V, f = 1.0 MHz 50 WE1-4 capacitance HIP (PGA) H1 CQFP G4T CQFP G2U/G2L CQFP G1U/G1T CWE VIN = 0V, f = 1.0 MHz Unit pF pF 20 50 20 20 CS1-4 capacitance CCS VIN = 0V, f = 1.0 MHz 20 pF Data I/O capacitance CI/O VI/O = 0V, f = 1.0 MHz 20 pF Address input capacitance CAD VIN = 0V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C TO +125°C) Parameter Sym Conditions Min -15 Max 10 -17 Min Max 10 -20 Min Max 10 Min -25 Max 10 Units Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC Output Leakage Current ILO CS = VIH, OE = VIH, VOUT = GND to VCC 10 10 10 10 µA Operating Supply Current ICC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 600 600 600 600 mA Standby Current ISB CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 80 80 80 60 mA Output Low Voltage VOL IOL = 8mA, VCC = 4.5 0.4 0.4 0.4 0.4 Output High Voltage VOH IOH = -4.0mA, VCC = 4.5 Parameter Sym 2.4 2.4 Conditions 2.4 -35 Min 2.4 -45 Max 10 Min V V -55 Max 10 µA Min Units Max 10 Input Leakage Current ILI VCC = 5.5, VIN = GND to V CC Output Leakage Current ILO CS = VIH, OE = VIH, VOUT = GND to VCC 10 10 10 µA Operating Supply Current I CC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 600 600 600 mA Standby Current ISB CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 60 60 60 mA Output Low Voltage VOL IOL = 2.1mA, VCC = 4.5 0.4 0.4 0.4 V IOH = -1.0mA, VCC = 4.5 Output High Voltage VOH NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V 2.4 2.4 2.4 µA V DATA RETENTION CHARACTERISTICS (FOR WS128K32L-XXX ONLY) (TA = -55°C TO +125°C), (TA = -40°C TO +85°C) Characteristic Data Retention Voltage Data Retention Quiescent Current Chip Disable to Data Retention Time (1) Operation Recovery Time (1) Sym VCC ICCDR TCDR TR Conditions VCC = 2.0V CS ≥ VCC -0.2V VIN ≥ VCC -0.2V Min 2 0 or VIN - 0.2V TRC Typ 1 - Max 2 - Units V mA ns - ns NOTE: Parameter guaranteed, but not tested. 3 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS128K32-XXX White Electronic Designs AC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C Parameter Symbol Read Cycle -15 Min -17 Max 15 Min -20 Max Min 17 +125°C) TO -25 Max 20 Min -35 Max -45 Max -55 Max Units Max t RC t AA Output Hold from Address Change t OH Chip Select Access Time t ACS 15 17 20 25 35 45 55 Output Enable to Output Valid t OE 10 10 12 15 20 25 30 Chip Select to Output in Low Z t CLZ 1 3 Output Enable to Output in Low Z t OLZ 1 0 Chip Disable to Output in High Z t CHZ 1 12 12 12 12 20 20 20 ns Output Disable to Output in High Z t OHZ 1 12 12 12 12 20 20 20 ns 0 20 0 25 0 3 0 3 0 55 35 0 3 0 45 Min Address Access Time 17 35 Min Read Cycle Time 15 25 Min 0 3 0 55 0 3 0 ns 45 3 0 ns ns ns ns ns 0 ns 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C Parameter Symbol Write Cycle -15 Min Max -17 Min TO -20 Max Min +125°C) -25 Max Min -35 Max Min -45 Max Min -55 Max Min Units Max Write Cycle Time t WC 15 17 20 25 35 45 Chip Select to End of Write t CW 14 14 15 20 25 30 WS128K32-XXX / 55 EDI8C32128C 45 Address Valid to End of Write t AW 14 15 15 20 25 30 45 Data Valid to End of Write t DW 10 10 12 15 20 25 25 ns Write Pulse Width t WP 14 14 15 20 25 30 45 ns Address Setup Time t AS 0 0 0 0 0 0 0 ns Address Hold Time t AH 0 0 0 0 0 0 0 ns Output Active from End of Write t OW 1 3 3 3 3 4 4 4 Write Enable to Output in High Z t WHZ 1 Data Hold Time t DH 10 0 10 12 0 0 15 0 20 0 25 0 ns ns ns 25 0 ns ns ns 1. This parameter is guaranteed by design but not tested. AC TEST CONDITIONS FIG. 4 AC TEST CIRCUIT Parameter Input Pulse Levels Input Rise and Fall Typ Unit VIL = 0, VIH = 3.0 V 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 4 White Electronic Designs WS128K32-XXX FIG. 5 TIMING WAVEFORM - READ CYCLE FIG. 6 WRITE CYCLE - WE CONTROLLED FIG. 7 WRITE CYCLE - CS CONTROLLED WS32K32-XHX 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs WS128K32-XXX PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1 ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Designs White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 6 WS128K32-XXX White Electronic Designs PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 519: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1U)1 00/80 ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Designs 7 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS128K32-XXX White Electronic Designs PACKAGE 524: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1T) 25.27 (0.995) ± 0.13 (0.005) SQ 4.06 (0.160) MAX 23.88 (0.940) ± 0.25 (0.010) SQ 0.25 (0.010) MAX 0.83 (0.033) ± 0.32 (0.013) 00/80 0.84 (0.033) REF DETAIL A SEE DETAIL "A" 1.27 (0.050) 0.38 (0.015) ± 0.05 (0.002) 20.3 (0.800) REF ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L) 25.15 (0.990) – 0.25 (0.010) MAX 5.10 (0.200) MAX 22.36 (0.880) – 0.25 (0.010) MAX 0.25 (0.010) – 0.10 (0.002) 0.23 (0.009) REF 24.0 (0.946) – 0.25 (0.010) R 0.127 (0.005) O 1.37 (0.054) MIN 0.004 O 2 /9 0.89 (0.035) – 1.14 (0.045) 1.27 (0.050) TYP 0.38 (0.015) – 0.05 (0.002) 20.31 (0.800) REF 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 8 WS128K32-XXX White Electronic Designs ORDERING INFORMATION W S 128K 32 X - XXX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H1= 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400) G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510) G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528) G1U1 = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519) G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524) G4T 1 = 40 mm Low Profile CQFP (Package 502) ACCESS TIME (ns) IMPROVEMENT MARK: N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades L = Low Power* ORGANIZATION, 128Kx32 User configurable as 256Kx16 or 512Kx8 SRAM WHITE ELECTRONIC DESIGNS CORPORATION Note 1: Package Not Recommended For New Designs * Low Power Data Retention only available in G2U, G2L, G1U, G1T PackageTypes 9 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS128K32-XXX White Electronic Designs DEVICE TYPE SPEED PACKAGE SMD NO. 128K x 32 SRAM Module 55ns 66 pin HIP (H1) 5962-93187 05H4X 128K x 32 SRAM Module 45ns 66 pin HIP (H1) 5962-93187 06H4X 128K x 32 SRAM Module 35ns 66 pin HIP (H1) 5962-93187 07H4X 128K x 32 SRAM Module 25ns 66 pin HIP (H1) 5962-93187 08H4X 128K x 32 SRAM Module 20ns 66 pin HIP (H1) 5962-93187 09H4X 128K x 32 SRAM Module 17ns 66 pin HIP (H1) 5962-93187 10H4X 128K x 32 SRAM Module 15ns 66 pin HIP (H1) 5962-93187 11H4X 128K x 32 SRAM Module 55ns 68 lead CQFP Low Profile (G4T)1 5962-95595 05HYX1 45ns 1 5962-95595 06HYX1 1 5962-95595 07HYX1 1 5962-95595 08HYX1 1 128K x 32 SRAM Module 128K x 32 SRAM Module 128K x 32 SRAM Module 68 lead CQFP Low Profile (G4T) 35ns 68 lead CQFP Low Profile (G4T) 25ns 68 lead CQFP Low Profile (G4T) 128K x 32 SRAM Module 20ns 68 lead CQFP Low Profile (G4T) 5962-95595 09HYX1 128K x 32 SRAM Module 17ns 68 lead CQFP Low Profile (G4T)1 5962-95595 10HYX1 128K x 32 SRAM Module 15ns 68 lead CQFP Low Profile (G4T)1 5962-95595 11HYX1 128K x 32 SRAM Module 55ns 68 lead CQFP/J (G2U) 5962-95595 05HMX 128K x 32 SRAM Module 45ns 68 lead CQFP/J (G2U) 5962-95595 06HMX 128K x 32 SRAM Module 35ns 68 lead CQFP/J (G2U) 5962-95595 07HMX 128K x 32 SRAM Module 25ns 68 lead CQFP/J (G2U) 5962-95595 08HMX 128K x 32 SRAM Module 20ns 68 lead CQFP/J (G2U) 5962-95595 09HMX 128K x 32 SRAM Module 17ns 68 lead CQFP/J (G2U) 5962-95595 10HMX 128K x 32 SRAM Module 15ns 68 lead CQFP/J (G2U) 5962-95595 11HMX 128K x 32 SRAM Module 55ns 68 lead CQFP/J(G1U)1 5962-95595 05H9X 1 5962-95595 06H9X 128K x 32 SRAM Module 45ns 68 lead CQFP/J (G1U) 128K x 32 SRAM Module 35ns 68 lead CQFP/J (G1U)1 5962-95595 07H9X 128K x 32 SRAM Module 25ns 68 lead CQFP/J (G1U)1 5962-95595 08H9X 128K x 32 SRAM Module 20ns 68 lead CQFP/J (G1U)1 5962-95595 09H9X 128K x 32 SRAM Module 17ns 68 lead CQFP/J (G1U)1 5962-95595 10H9X 128K x 32 SRAM Module 15ns 68 lead CQFP/J (G1U)1 5962-95595 11H9X 128K x 32 SRAM Module 55ns 68 lead CQFP/J (G2L) 5962-95595 05HAX 128K x 32 SRAM Module 45ns 68 lead CQFP/J(G2L) 5962-95595 06HAX 128K x 32 SRAM Module 35ns 68 lead CQFP/J(G2L) 5962-95595 07HAX 128K x 32 SRAM Module 25ns 68 lead CQFP/J(G2L) 5962-95595 08HAX 128K x 32 SRAM Module 20ns 68 lead CQFP/J(G2L) 5962-95595 09HAX 128K x 32 SRAM Module 17ns 68 lead CQFP/J(G2L) 5962-95595 10HAX 128K x 32 SRAM Module 15ns 68 lead CQFP/J(G2L) 5962-95595 11HAX Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 10 WS128K32-XXX White Electronic Designs DEVICE TYPE SPEED PACKAGE SMD NO. 128K x 32 SRAM Module 55ns 68 lead CQFP/J (G1T) 5962-95595 05HBX 128K x 32 SRAM Module 45ns 68 lead CQFP/J (G1T) 5962-95595 06HBX 128K x 32 SRAM Module 35ns 68 lead CQFP/J (G1T) 5962-95595 07HBX 128K x 32 SRAM Module 25ns 68 lead CQFP/J (G1T) 5962-95595 08HBX 128K x 32 SRAM Module 20ns 68 lead CQFP/J (G1T) 5962-95595 09HBX 128K x 32 SRAM Module 17ns 68 lead CQFP/J (G1T) 5962-95595 10HBX 128K x 32 SRAM Module 15ns 68 lead CQFP/J (G1T) 5962-95595 11HBX Note 1: Package Not Recommended For New Design 11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com