WF128K32-XXX5 HI-RELIABILITY PRODUCT 128KX32 5V FLASH MODULE, SMD 5962-94716 FEATURES ■ Access Times of 50*, 60, 70, 90, 120, 150ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) ■ 5 Volt Programming. 5V ± 10% Supply ■ Low Power CMOS, 1mA Standby Typical ■ Embedded Erase and Program Algorithms • 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502) • 68 lead, Hermetic CQFP, 22.4mm (0.880 inch) square. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint. – G2 (Package 500), 5.08mm (0.200 inch) high – G2U (Package 510), 3.56mm (0.140 inch) high ■ TTL Compatible Inputs and CMOS Outputs ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Page Program Operation and Internal Program Control Time ■ Weight WF128K32-XG2X5 - 8 grams typical WF128K32-XG2UX5 - 8 grams typical WF128K32-XH1X5 - 13 grams typical WF128K32-XG4TX5 - 20 grams typical ■ Sector Architecture • 8 equal size sectors of 16KBytes each • Any combination of sectors can be concurrently erased. Also supports full chip erase ■ 100,000 Erase/Program Cycles Typical, 0°C to +70°C Note: For programming information refer to Flash Programming 1M5 Application Note. ■ Organized as 128Kx32 FIG. 1 * The access time of 50ns is available in Industrial and Commercial temperature ranges only. PIN CONFIGURATION FOR WF128K32N-XH1X5 TOP VIEW 1 12 23 PIN DESCRIPTION 34 45 56 I/O0-31 Data Inputs/Outputs I/O8 WE2 I/O15 I/O24 VCC I/O31 A0-16 Address Inputs I/O9 CS2 I/O14 I/O25 CS4 I/O30 WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply I/O10 GND I/O13 I/O26 WE4 I/O29 A14 I/O11 I/O12 A7 I/O27 I/O28 A16 A10 OE A12 A4 A1 A11 A9 NC NC A5 A2 A0 A15 WE1 A13 A6 A3 VCC NC I/O7 WE3 A8 GND Ground NC Not Connected BLOCK DIAGRAM WE1 CS 1 I/O23 WE2 CS2 WE3 CS 3 WE 4CS4 OE A0-16 I/O0 CS1 I/O6 I/O16 CS3 I/O22 I/O1 NC I/O5 I/O17 GND I/O21 I/O2 I/O3 I/O4 I/O18 I/O19 I/O20 128K x 8 11 22 33 44 55 8 8 128K x 8 8 128K x 8 8 66 I/O0-7 June 2000 Rev. 2 128K x 8 1 I/O8-15 I/O16-23 I/O24-31 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 FIG. 2 PIN CONFIGURATION FOR WF128K32-XG4TX5 PIN DESCRIPTION NC A0 A1 A2 A3 A4 A5 CS1 GND CS3 WE A6 A7 A8 A9 A10 VCC TOP VIEW I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE Write Enable 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM CS 3 CS 2 CS 1 CS 4 WE OE A0-16 128K x 8 128K x 8 128K x 8 128K x 8 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 VCC A11 A12 A13 A14 A15 A16 CS2 OE CS4 NC NC NC NC NC NC NC FIG. 3 I/O8-15 I/O0-7 8 I/O16-23 PIN CONFIGURATION FOR WF128K32-XG2X5 (Dual Cavity) AND WF128K32-XG2UX5 (Single Cavity) TOP VIEW I/O24-31 PIN DESCRIPTION NC A0 A1 A2 A3 A4 A5 CS3 GND CS4 WE1 A6 A7 A8 A9 A10 VCC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 8 8 8 I/O0-31 Data Inputs/Outputs 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 A0-16 Address Inputs WE1-4 Write Enables 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 CS1-4 Chip Selects OE Output Enable 0.940" VCC Power Supply The White 68 lead G2/G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2/G2U has the TCE and lead inspection advantage of the CQFP form. GND Ground NC Not Connected WE1 CS 1 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 BLOCK DIAGRAM WE2 CS2 WE3 CS 3 WE 4CS4 A0-16 NC NC NC WE4 WE2 WE3 OE CS2 NC A16 CS1 A15 A14 A13 A12 A11 VCC OE 128K x 8 8 I/O0-7 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 2 128K x 8 8 I/O8-15 128K x 8 8 I/O16-23 128K x 8 8 I/O24-31 WF128K32-XXX5 ABSOLUTE MAXIMUM RATINGS (1) RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit Operating Temperature -55 to +125 °C Supply Voltage V CC 4.5 5.5 V Supply Voltage Range (VCC) -2.0 to +7.0 V Input High Voltage V IH 2.0 V CC + 0.3 V Signal voltage range (any pin except A9) (2) -2.0 to +7.0 V Input Low Voltage V IL -0.5 +0.8 V Storage Temperature Range -65 to +150 °C Operating Temp. (Mil.) TA -55 +125 °C +300 °C A9 Voltage for Sector Protect VID 11.5 12.5 V Parameter Parameter Unit Lead Temperature (soldering, 10 seconds) Data Retention Mil Temp 10 years Endurance (write/erase cycles) Mil Temp 10,000 cycles min. A9 Voltage for sector protect (VID) (3) -2.0 to +14.0 CAPACITANCE (T A = +25°C) V NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is V CC + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns. Parameter Symbol Conditions OE capacitance COE VIN = 0 V, f = 1.0 MHz WE1-4 capacitance HIP (PGA) CQFP G4T CQFP G2 CQFP G2U CWE VIN = 0 V, f = 1.0 MHz Max 50 Unit pF pF 20 50 20 15 CS1-4 capacitance CCS VIN = 0 V, f = 1.0 MHz 20 pF Data I/O capacitance CI/O VI/O = 0 V, f = 1.0 MHz 20 pF Address input capacitance CAD VIN = 0 V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS - CMOS COMPATIBLE (VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C) Parameter Symbol Conditions Unit Min Input Leakage Current Output Leakage Current Max µA ILI VCC = 5.5, VIN = GND to VCC 10 ILOx32 VCC = 5.5, VIN = GND to VCC 10 µA VCC Active Current for Read (1) ICC1 CS = VIL, OE = VIH 140 mA VCC Active Current for Program or Erase (2) ICC2 CS = VIL, OE = VIH 200 mA VCC Standby Current ICC3 VCC = 5.5, CS = VIH, f = 5MHz 6.5 mA VCC Static Current ICC4 VCC = 5.5, CS = VIH 0.6 mA Output Low Voltage VOL IOL = 8.0 mA, VCC = 4.5 Output High Voltage VOH1 IOH = -2.5 mA, VCC = 4.5 0.85 x VCC 0.45 V V Output High Voltage VOH2 IOH = -100 µA, VCC = 4.5 VCC -0.4 V Low VCC Lock Out Voltage VLKO 3.2 V NOTES: 1. The I CC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH. 2. I CC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: V IL = 0.3V, VIH = V CC - 0.3V 3 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS CONTROLLED (VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C) Parameter Symbol -50 Min -60 Max Min -70 Max -90 Min Max Min -120 Max Min -150 Max Min Unit Max Write Cycle Time t AVAV t WC 50 60 70 90 120 150 ns WE Setup Time t WLEL t WS 0 0 0 0 0 0 ns CS Pulse Width t ELEH t CP 25 30 35 45 50 50 ns Address Setup Time t AVEL t AS 0 0 0 0 0 0 ns Data Setup Time t DVEH t DS 25 30 30 45 50 50 ns Data Hold Time t EHDX t DH 0 0 0 0 0 0 ns Address Hold Time t ELAX t AH 40 45 45 45 50 50 ns WE Hold from WE High t EHWH t WH 0 0 0 0 0 0 ns CS Pulse Width High tEHEL tCPH 20 20 20 20 20 20 ns Duration of Programming Operation t WHWH1 14 Duration of Erase Operation t WHWH2 2.2 Read Recovery before Write t GHEL 0 Chip Programming Time 14 60 2.2 14 60 2.2 0 12.5 14 60 2.2 0 12.5 14 60 0 12.5 FIG. 4 60 2.2 0 12.5 µs 14 2.2 60 0 12.5 ns 12.5 AC TEST CONDITIONS AC TEST CIRCUIT Parameter I OL Current Source VZ D.U.T. ≈ 1.5V (Bipolar Supply) C eff = 50 pf I OH Current Source White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 4 Typ sec Unit Input Pulse Levels VIL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V NOTES: V Z is programmable from -2V to +7V. I OL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. V Z is typically the midpoint of VOH and V OL. I OL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. sec WF128K32-XXX5 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE CONTROLLED (VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C) Parameter Symbol -50 Min -60 Max Min -70 Max Min -90 Max Min -120 Max Min -150 Max Min Unit Max Write Cycle Time t AVAV t WC 50 60 70 90 120 150 Chip Select Setup Time t ELWL t CS 0 0 0 0 0 0 ns Write Enable Pulse Width t WLWH t WP 25 30 35 45 50 50 ns Address Setup Time t AVWL t AS 0 0 0 0 0 0 ns Data Setup Time t DVWH t DS 25 30 30 45 50 50 ns Data Hold Time t WHDX t DH 0 0 0 0 0 0 ns Address Hold Time t WLAX t AH 40 45 45 45 50 50 ns Chip Select Hold Time t WHEH t CH 0 0 0 0 0 0 ns Write Enable Pulse Width High t WHWL t WPH 20 20 20 20 20 20 ns Duration of Byte Programming Operation (min) t WHWH1 14 Sector Erase Time t WHWH2 2.2 t GHWL 0 Read Recovery Time Before Write VCC Setup Time t VCS 14 60 14 2.2 60 0 50 60 0 50 Chip Programming Time 14 2.2 60 0 50 12.5 14 2.2 12.5 µs 14 2.2 60 0 50 12.5 ns 2.2 60 0 50 ns µs 50 12.5 sec 12.5 12.5 sec Output Enable Setup Time tOES 0 0 0 0 0 0 ns Output Enable Hold Time (1) tOEH 10 10 10 10 10 10 ns 1. For Toggle and Data Polling. AC CHARACTERISTICS – READ ONLY OPERATIONS (VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C) Parameter Symbol -50 Min -60 Max Min 50 -70 Max 60 Min -90 Max Min 90 120 -150 Max Min Unit Max Read Cycle Time t AVAV t RC Address Access Time t AVQV t ACC 50 60 70 90 120 150 ns Chip Select Access Time t ELQV t CE 50 60 70 90 120 150 ns OE to Output Valid t GLQV t OE 25 30 35 40 50 55 ns Chip Select to Output High Z (1) t EHQZ t DF 20 20 20 25 30 35 ns OE High to Output High Z (1) t GHQZ t DF 20 20 20 25 30 35 ns Output Hold from Address, CS or OE Change, whichever is first t AXQX t OH 0 0 70 -120 Min Max 0 0 0 150 0 ns ns 1. Guaranteed by design, not tested. 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 FIG. 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 6 Outputs WE OE CS Addresses High Z tACC tCE tOE Addresses Stable tRC Output Valid tOH tDF High Z AC WAVEFORMS FOR READ OPERATIONS WF128K32-XXX5 FIG. 6 A0H 5.0 V Data tDS tCS WE OE 7 tDH tWPH tWP tGHWL tWC CS NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7 is the output of the complement of the data written to the device (for each chip). 4. DOUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. Addresses 5555H tAS PA PD tAH tWHWH1 Data Polling D7 PA DOUT tOE tCE tRC tDF tOH WRITE/ERASE/PROGRAM OPERATION, WE CONTROLLED White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 FIG. 7 NOTES: 1. SA is the sector address for Sector Erase. White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com AAH tDS tDH tWPH VCC tVCS 8 Data WE OE CS Addresses tGHWL tCS tWP tAS 55H 2AAAH 5555H tAH 5555H 80H 5555H AAH 2AAAH 55H SA 10H/30H AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS WF128K32-XXX5 FIG. 8 Data WE OE CS D7 D0-D6 t CH tOEH tCE t OE tWHWH 1 or 2 D7 D0-D6 = Invalid t OE D7 = Valid Data D0-D7 Valid Data t OH t DF High Z AC WAVEFORMS FOR DATA POLLING DURING EMBEDDED ALGORITHM OPERATIONS 9 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 FIG. 9 tDH tCPH A0H NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7 is the output of the complement of the data written to the device (for each chip). 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 10 5.0 V tDS Data CS OE tWS tWC WE Addresses 5555H tGHEL tCP tAS PA PD tAH tWHWH1 Data Polling D7 PA DOUT WRITE/ERASE/PROGRAM OPERATION, CS CONTROLLED WF128K32-XXX5 PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 27.3 (1.075) ± 0.25 (0.010) SQ PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 4.34 (0.171) MAX 3.81 (0.150) ± 0.13 (0.005) 1.42 (0.056) ± 0.13 (0.005) 0.76 (0.030) ± 0.13 (0.005) 2.54 (0.100) TYP 1.27 (0.050) TYP DIA 15.24 (0.600) TYP 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T) 39.6 (1.56) ± 0.38 (0.015) SQ PIN 1 IDENTIFIER 3.56 (0.140) MAX Pin 1 12.7 (0.500) ± 0.5 (0.020) 4 PLACES 5.1 (0.200) ± 0.25 (0.010) 4 PLACES 0.38 (0.015) ± 0.08 (0.003) 68 PLACES 1.27 (0.050) TYP 0.25 (0.010) ± 0.05 (0.002) 38 (1.50) TYP 4 PLACES ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 PACKAGE 500: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2) 25.1 (0.990) ± 0.25 (0.010) SQ 5.1 (0.200) MAX 22.4 (0.880) ± 0.25 (0.010) SQ 0.25 (0.010) ± 0.1 (0.002) 0.25 (0.010) REF Pin 1 R 0.25 (0.010) 24.0 (0.946) ± 0.25 (0.010) 0.25 (0.010) ± 0.127 (0.005) 1° / 7° 1.0 (0.040) ± 0.127 (0.005) 23.87 (0.940) REF DETAIL A 1.27 (0.050) TYP SEE DETAIL "A" 0.38 (0.015) ± 0.05 (0.002) 20.3 (0.800) REF The White 68 lead G2 CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2 has the TCE and lead inspection advantage of the CQFP form. 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 12 WF128K32-XXX5 PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) 25.15 (0.990) ± 0.25 (0.010) SQ 3.51 (0.140) MAX 22.36 (0.880) ± 0.25 (0.010) SQ 0.25 (0.010) ± 0.10 (0.002) 0.25 (0.010) REF Pin 1 R 0.25 (0.010) 24.0 (0.946) ± 0.25 (0.010) 0.53 (0.021) ± 0.18 (0.007) 1° / 7° 1.01 (0.040) ± 0.13 (0.005) 23.87 (0.940) REF DETAIL A 1.27 (0.050) TYP SEE DETAIL "A" 0.38 (0.015) ± 0.05 (0.002) 20.3 (0.800) REF The White 68 lead G2U CQFP fills the same fit and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 13 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WF128K32-XXX5 ORDERING INFORMATION W F 128K32 X - XXX X X 5 X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads VPP PROGRAMMING VOLTAGE 5 = 5V DEVICE GRADE: Q = MIL - STD 833 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to + 70°C PACKAGE TYPE: H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400) G2 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 500) G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510) G4T = 40mm Ceramic Low Profile, CQFP (Package 502) ACCESS TIME (ns) IMPROVEMENT MARK N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade ORGANIZATION, 128K x 32 User configurable as 256K x 16 or 512K x 8 Flash WHITE ELECTRONIC DESIGNS CORP. White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com 14 WF128K32-XXX5 DEVICE TYPE SPEED PACKAGE SMD NO. 128K x 32 Flash 150ns 66 pin HIP (H1) 5962-94716 01H8X 128K x 32 Flash 120ns 66 pin HIP (H1) 5962-94716 02H8X 128K x 32 Flash 90ns 66 pin HIP (H1) 5962-94716 03H8X 128K x 32 Flash 70ns 66 pin HIP (H1) 5962-94716 04H8X 128K x 32 Flash 60ns 66 pin HIP (H1) 5962-94716 05H8X 128K x 32 Flash 150ns 68 lead CQFP/J (G2) 5962-94716 01HMX 128K x 32 Flash 120ns 68 lead CQFP/J (G2) 5962-94716 02HMX 128K x 32 Flash 90ns 68 lead CQFP/J (G2) 5962-94716 03HMX 128K x 32 Flash 70ns 68 lead CQFP/J (G2) 5962-94716 04HMX 128K x 32 Flash 60ns 68 lead CQFP/J (G2) 5962-94716 05HMX 128K x 32 Flash 150ns 68 lead CQFP/J (G2U) 5962-94716 01HNX 128K x 32 Flash 120ns 68 lead CQFP/J (G2U) 5962-94716 02HNX 128K x 32 Flash 90ns 68 lead CQFP/J (G2U) 5962-94716 03HNX 128K x 32 Flash 70ns 68 lead CQFP/J (G2U) 5962-94716 04HNX 128K x 32 Flash 60ns 68 lead CQFP/J (G2U) 5962-94716 05HNX 128K x 32 Flash 150ns 68 lead CQFP Low Profile (G4T) 5962-94716 01H4X 128K x 32 Flash 120ns 68 lead CQFP Low Profile (G4T) 5962-94716 02H4X 128K x 32 Flash 90ns 68 lead CQFP Low Profile (G4T) 5962-94716 03H4X 128K x 32 Flash 70ns 68 lead CQFP Low Profile (G4T) 5962-94716 04H4X 128K x 32 Flash 60ns 68 lead CQFP Low Profile (G4T) 5962-94716 05H4X 15 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com