WS512K32-XXX White Electronic Designs 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES ! Access Times of 15*, 17, 20, 25, 35, 45, 55ns ! TTL Compatible Inputs and Outputs ! Packaging ! 5 Volt Power Supply • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). ! Low Power CMOS ! • 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1 Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ! Weight • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square (Package 510) 3.56mm (0.140") height. • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880") square, 5.08mm (0.200") high (Package 528). ! Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 ! Commercial, Industrial and Military Temperature Ranges WS512K32N-XH1X - 13 grams typical WS512K32-XG2UX - 8 grams typical WS512K32-XG4TX1 - 20 grams typical WS512K32-XG2LX - 8 grams typical *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. Note 1: Package Not Recommended For New Design FIG. 1 PIN CONFIGURATION FOR WS512K32N-XH1X TOP VIEW PIN DESCRIPTION I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM December 2003, Rev 13 1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX White Electronic Designs FIG. 2 PIN CONFIGURATION FOR WS512K32-XG4TX1 TOP VIEW PIN DESCRIPTION I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM Note 1: Package Not Recommended For New Design FIG. 3 PIN CONFIGURATION FOR WS512K32-XG2UX and WS512K32-XG2LX TOP VIEW PIN DESCRIPTION I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 2 WS512K32-XXX White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature TRUTH TABLE Symbol Min Max Unit CS OE WE Mode Data I/O Power TA -55 +125 °C °C H L L L X L H X X H H L Standby Read Out Disable Write High Z Data Out High Z Data In Standby Active Active Active TSTG -65 +150 Signal Voltage Relative to GND VG -0.5 Vcc+0.5 V Junction Temperature TJ 150 °C 7.0 V Storage Temperature Supply Voltage -0.5 VCC CAPACITANCE (TA = +25°C) RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Supply Voltage VCC 4.5 5.5 V Input High Voltage VIH 2.2 V CC + 0.3 V Input Low Voltage VIL -0.5 +0.8 V Operating Temp (Mil) TA -55 +125 °C Parameter Symbol Conditions COE VIN = 0 V, f = 1.0 MHz WE1-4 capacitance HIP (PGA) CQFP G4T CQFP G2U/G2L CWE VIN = 0 V, f = 1.0 MHz CS1-4 capacitance CCS VIN = 0 V, f = 1.0 MHz 20 pF Data I/O capacitance CI/O VI/O = 0 V, f = 1.0 MHz 20 pF Address input capacitance CAD VIN = 0 V, f = 1.0 MHz 50 pF OE capacitance Max Unit 50 pF pF 20 50 20 This parameter is guaranteed by design but not tested. DC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C) Parameter Symbol Conditions Units Min Max 10 Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC Output Leakage Current ILO CS = VIH, OE = VIH, VOUT = GND to VCC 10 µA I CC x 32 CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 660 mA Standby Current ISB CS = VIH , OE = VIH , f = 5MHz, Vcc = 5.5 80 mA Output Low Voltage VOL IOL = 8mA for 15 - 35ns, IOL = 2.1mA for 45 - 55ns, Vcc = 4.5 0.4 V Output High Voltage VOH IOH = -4.0mA for 15 - 35ns, IOH = -1.0mA for 45 - 55ns, Vcc = 4.5 Operating Supply Current x 32 Mode µA 2.4 V NOTE: DC test conditions: VIH = V CC -0.3V, VIL = 0.3V DATA RETENTION CHARACTERISTICS (TA = -55°C TO +125°C) Parameter Symbol Conditions Units Min Max 2.0 V DR CS ≥ V CC − 0.2V 5.5 V Data Retention Current I CCDR1 V CC = 3V 28 mA Low Power Data Retention Current (WS512K32L-XXX) I CCDR2 V CC = 3V 16 mA Data Retention Supply Voltage 3 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX White Electronic Designs AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C) Parameter Read Cycle Min Read Cycle Time tRC Address Access Time tAA Output Hold from Address Change tOH Chip Select Access Time -15* Symbol -17 Max 15 Min -20 Max Min 17 Max 20 15 Min 0 -35 Min -45 Max 35 20 0 Max 25 17 0 -25 Max 45 25 0 Min -55 35 0 Min Units Max 55 ns 45 0 55 0 ns ns tACS 15 17 20 25 35 45 55 ns Output Enable to Output Valid tOE 8 9 10 12 25 25 25 ns Chip Select to Output in Low Z tCLZ 1 2 2 2 2 4 4 4 Output Enable to Output in Low Z tOLZ 1 0 0 0 0 0 0 0 Chip Disable to Output in High Z tCHZ 1 12 12 12 12 15 20 20 ns Output Disable to Output in High Z tOHZ 1 12 12 12 12 15 20 20 ns ns ns *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C) Parameter Symbol Write Cycle -15* Min -17 Max Min -20 Max Min -25 Max Min Max -35 Min Max -45 Min -55 Max Units Min Max Write Cycle Time tW C 15 17 20 25 35 45 55 ns Chip Select to End of Write tC W 13 15 15 17 25 35 50 ns Address Valid to End of Write tAW 13 15 15 17 25 35 50 ns Data Valid to End of Write tD W 10 11 12 13 20 25 25 ns Write Pulse Width tWP 13 15 15 17 25 35 40 ns Address Setup Time t AS 2 2 2 2 2 2 2 ns Address Hold Time t AH 0 0 0 0 0 5 5 ns Output Active from End of Write tO W1 2 2 3 4 4 5 5 Write Enable to Output in High Z t WHZ 1 Data Hold Time t DH 8 0 9 11 0 0 13 0 15 0 20 0 ns 20 0 ns ns *15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. 1. This parameter is guaranteed by design but not tested. 2. The Address Setup Time of minimum 2ns is for the G2U, G1U and H1 packages. tAS minimum for the G4T package is 0ns. FIG. 4 AC TEST CIRCUIT AC TEST CONDITIONS Parameter Typ Unit Input Pulse Levels VIL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 ý. VZ is typically the midpoint of VOH and VOL . IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 4 White Electronic Designs WS512K32-XXX FIG. 5 TIMING WAVEFORM - READ CYCLE FIG. 6 WRITE CYCLE - WE CONTROLLED FIG. 7 WRITE CYCLE - CS CONTROLLED WS32K32-XHX 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs WS512K32-XXX PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1 ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 6 WS512K32-XXX White Electronic Designs PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L) 25.15 (0.990) – 0.25 (0.010) MAX 5.10 (0.200) MAX 22.36 (0.880) – 0.25 (0.010) MAX 0.25 (0.010) – 0.10 (0.002) 0.23 (0.009) REF 24.0 (0.946) – 0.25 (0.010) R 0.127 (0.005) 1.37 (0.054) MIN 0.004 2O / 9O 0.89 (0.035) – 1.14 (0.045) 1.27 (0.050) TYP 0.38 (0.015) – 0.05 (0.002) 20.31 (0.800) REF 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 7 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com WS512K32-XXX White Electronic Designs ORDERING INFORMATION W S 512K 32 X - XXX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to 85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H1 = Ceramic Hex-In-line Package, HIP (Package 400) G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510) G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528) G4T1 = 40mm Low Profile CQFP (Package 502) ACCESS TIME (ns) IMPROVEMENT MARK: Blank = Standard Power N = No Connect at pin 21 and 39 in HIP for Upgrades L = Low Power Data Retention ORGANIZATION, 512Kx32 User configurable as 1Mx16 or 2Mx8 SRAM WHITE ELECTRONIC DESIGNS CORP. Note 1: Package Not Recommended For New Design White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 8 WS512K32-XXX White Electronic Designs DEVICE TYPE SPEED PACKAGE SMD NO. 512K x 32 SRAM Module 55ns 66 pin HIP (H1) 5962-94611 05HTX 512K x 32 SRAM Module 45ns 66 pin HIP (H1) 5962-94611 06HTX 512K x 32 SRAM Module 35ns 66 pin HIP (H1) 5962-94611 07HTX 512K x 32 SRAM Module 25ns 66 pin HIP (H1) 5962-94611 08HTX 512K x 32 SRAM Module 20ns 66 pin HIP (H1) 5962-94611 09HTX 512K x 32 SRAM Module 17ns 66 pin HIP (H1) 5962-94611 10HTX 512K x 32 SRAM Module 55ns 68 lead CQFP Low Profile (G4T)1 5962-94611 05HYX 512K x 32 SRAM Module 45ns 68 lead CQFP Low Profile (G4T)1 5962-94611 06HYX 512K x 32 SRAM Module 35ns 68 lead CQFP Low Profile (G4T)1 5962-94611 07HYX 512K x 32 SRAM Module 25ns 68 lead CQFP Low Profile (G4T)1 5962-94611 08HYX 512K x 32 SRAM Module 20ns 68 lead CQFP Low Profile (G4T)1 5962-94611 09HYX 512K x 32 SRAM Module 17ns 68 lead CQFP Low Profile (G4T) 1 5962-94611 10HYX 512K x 32 SRAM Module 55ns 68 lead CQFP (G2U) 5962-94611 05HMX 512K x 32 SRAM Module 45ns 68 lead CQFP (G2U) 5962-94611 06HMX 512K x 32 SRAM Module 35ns 68 lead CQFP (G2U) 5962-94611 07HMX 512K x 32 SRAM Module 25ns 68 lead CQFP (G2U) 5962-94611 08HMX 512K x 32 SRAM Module 20ns 68 lead CQFP (G2U) 5962-94611 09HMX 512K x 32 SRAM Module 17ns 68 lead CQFP (G2U) 5962-94611 10HMX 512K x 32 SRAM Module 55ns 68 lead CQFP (G2L) 5962-94611 05HAX 512K x 32 SRAM Module 45ns 68 lead CQFP (G2L) 5962-94611 06HAX 512K x 32 SRAM Module 35ns 68 lead CQFP (G2L) 5962-94611 07HAX 512K x 32 SRAM Module 25ns 68 lead CQFP (G2L) 5962-94611 08HAX 512K x 32 SRAM Module 20ns 68 lead CQFP (G2L) 5962-94611 09HAX 512K x 32 SRAM Module 17ns 68 lead CQFP (G2L) 5962-94611 10HAX Note 1: Package Not Recommended For New Design 9 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs WS512K32-XXX Document Title 512K x 32 SRAM Multi-Chip Package Revision History Rev # History Release Date Status Initial October 1996 Preliminary Change (Pg. 1, 3) January 1997 1.1 Change Operation Supply Current from 520mA To 540mA 1.2 Change Data Retention Current from 12mA to 28mA. Preliminary Change (Pg. 1, 2, 8, 10, 11) 1.1 Delete G2 Package November 1997 Preliminary Change (Pg. 1, 9) 1.1 Add SMD Case Outline M for G2T February 1998 Preliminary Change (Pg. 1, 3, 8) 1.1 Remove Low Capacitance package option April 1998 Preliminary Change (Pg. 1, 6, 8) 1.1 Add H1 package December 1998 Preliminary Change (Pg. 1, 4, 6, 9, 10) 1.1 Remove H2 package 1.2 Change logo to WEDC logo March 1999 Preliminary Rev 2 Change (Pg. 1, 3, 4, 8) May 1999 1.1 Change status from Preliminary to Final 1.2 Make package descriptions consistent 1.3 Add 15ns as available in Commercial and Industrial Temperatures only. Final Rev 4 Change (Pg. 1, 3) June 1999 1.1 Change Standby Current (Isb) from 60mA to 80mA Maximum Final Rev 5 Change (Pg. 1, 2, 3, 4, 7, 8) 1.1 Add G1U package Final Rev 6 Change (Pg. 1, 8) February 2000 1.1 Change G1U lead foot length from 0.64mm to 0.84mm Ref White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 November 1999 10 Final White Electronic Designs WS512K32-XXX Rev 7 Change (Pg. 1, 3, 9) October 2000 Final 1.1 Change Operating Supply Current from 540mA to 660mA Maximum 1.2 Add Low Power Data Retention Current of 16mA to Data Retention Characteristics table 1.3 Add Low Power Data Retention (L) option to Ordering Information Rev 8 Change (Pg. 1, 2, 6, 7, 9, 10) October 2001 Final 1.1 Change G2T and G4T package status to Not Recommended For New Design Rev 9 Change (Pg. 1, 2, 3, 8, 9, 10) 1.1 Add G1T package 1.2 Remove ‘Hi-Reliability Product’ Title November 2001 Final Rev 10 Change (Pg. 1, 2, 3, 4, 7, 8, 9, 10, 11) 1.1 Remove G2T package 1.2 Add G2U package 1.3 Remove ‘Package to be Developed’ note for G4T August 2002 Final Rev 11 Change (Pg. 1,2,4,8,10,11,13) February 2002 1.1 Change G1U package status to Not Recommended For New Designs Final Rev 12 Change (Pg. 1,2,3,7,8,10,11,13) 1.1 Add G2L package May 2003 Final Rev 13 Change (Pg. 1,2,3,7,8,10,11,13) 1.1 Remove all reference to G1U package 1.2 Remove all reference to G1T package December 2003 Final 11 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com