ETC CX77112

DATA SHEET
CX77112: PA Module for CDMA PCS (1850–1910 MHz)
Applications
Description
• Personal Communications Services
(PCS)
The CX77112 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount
module developed for Personal Communications Service (PCS) and Wireless Local Loop
(WLL) applications. This small and efficient Power Amplifier packs full 1850–1910 MHz
bandwidth coverage into a single compact package. The CX77112 meets the stringent
spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission,
with high power added efficiency for power output of up to 29 dBm. A low current (VCONT)
pin is provided to improve efficiency for the low RF power range of operation.
• Wireless Local Loop (WLL)
Features
• Low voltage positive bias supply
- 3.2 V to 4.2 V
• Low VREF
- 2.85 V, nominal
• Good linearity
• High efficiency
• Large dynamic range
• 10-pin package
- 4 mm x 4 mm x 1.5 mm
• Power down control
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains
all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input
and interstage matching circuits. Output match is realized off-chip within the module
package to optimize efficiency and power performance into a 50 Ω load. This device is
manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that
provides for all positive voltage DC supply operation while maintaining high efficiency and
good linearity. Primary bias to the CX77112 is supplied directly from a three-cell Ni-Cd, a
single-cell Li-Ion, or other suitable battery with an output in the 3 to 4 volt range. Power
down is accomplished by setting the voltage on the low current reference pin to zero volts.
No external supply side switch is needed as typical “off” leakage is a few microamperes
with full primary voltage supplied from the battery.
• Low power-state control
• InGaP
• IS95/CDMA2000
• Full U.S. PCS coverage
VREF
(4)
VCC1
(1)
Driver
Stage Bias
RF IN (2)
Input
Match
VCONT
(5)
VCC2
(10)
Power
Stage Bias
DA
Inter
Stage
Match
PA
Output
Match
(8) RF OUT
MMIC
MODULE
(3, 6, 7, 9)
GND
(3, 6, 7, 9)
GND
101904_001
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
1
DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the
CX77112 Power Amplifier Module. Table 1 lists the absolute
maximum ratings, while Table 2 shows the recommended
operating conditions to achieve the performance characteristics
listed in Table 4. Table 3 presents a truth table for the power
ranges.
Table 1. Absolute Maximum Ratings (1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
PIN
—
1.0
6.0
dBm
Supply Voltage
VCC
—
3.4
6.0
Volts
Reference Voltage
VREF
—
2.85
3.1
Volts
Case Operating Temperature
TC
–30
25
+110
°C
Storage Temperature
TSTG
–55
—
+125
°C
(1)
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
Supply Voltage
VCC
3.2
3.4
4.2
Volts
Reference Voltage
VREF
2.75
2.85
2.95
Volts
Low Power Mode
VCONT
2.0
2.5
3.0
Volts
High Power Mode
VCONT
0.0
0.5
1.0
Volts
Control voltage
Operating Frequency
FO
1850.0
1880.0
1910.0
MHz
Operating Temperature
TO
–30
+25
+85
°C
Table 3. Power Range Truth Table
VREF
VCONT
Range
High Power
Power Mode
2.85 V
0.5 V
16 dBm to 29 dBm
Low Power
2.85 V
2.5 V
≤ 16 dBm
Shut Down
0.00 V
0.0 V
—
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics
Gain conditions
Symbol
Quiescent current
Typical
Maximum
25.0
26.3
Unit
VCONT = 2.5 V
PO = 16 dB
24.0
GHIGH
VCONT = 0.5 V
PO = 29 dBm
27.0
28.5
30.0
PAELOW
VCONT = 2.5 V
PO = 16 dB
7.0
8.5
—
PAEHIGH
VCONT = 0.5 V
PO = 29 dBm
37.0
40.0
—
ICC_LOW
PO = 16 dBm
—
135
160
ICC_HIGH
PO = 29 dBm
—
580
625
IQ_LOW
VCONT = 2.5 V
35
50
65
IQ_HIGH
VCONT = 0.5 V
80
95
115
—
—
6.0
10.0
mA
Digital Mode
Total Supply current
Minimum
GLOW
Digital Mode
Power Added Efficiency
Condition
dB
%
mA
mA
Reference current
IREF
Control current
ICONT
VCONT = 2.5 V
—
140
250
µA
IPD
VCC = 3.4 V
VREF = 0 V
—
3.0
4.0
µA
ACP1LOW
VCONT = 2.5 V
PO = 16 dB
—
–50
–48
ACP1HIGH
VCONT = 0.5 V
PO = 29 dBm
—
–51
–49
ACP3LOW
VCONT = 2.5 V
PO = 16 dB
—
–68
–60
ACP3HIGH
VCONT = 0.5 V
PO = 29 dBm
—
–60
–57
Second
FO2
PO ≤ 29 dBm
—
–35
–32
Third
FO3
PO ≤ 29 dBm
—
–55
–40
Noise Power in RX Band 1930-1990 MHz
RxBN
PO ≤ 29 dBm
—
–136
–135
dBm/Hz
Noise Figure
NF
—
—
5.5
6.0
dB
Input Voltage Standing Wave Ratio
VSWR
—
—
—
2.0:1
—
—
—
–65
dBc
10:1
—
—
VSWR
Total Supply current in Power-down Mode
1.25 MHz offset
Adjacent Channel Power
(2)(3)
2.25 MHz offset
Harmonic Suppression
Stability (Spurious output)
S
5:1 VSWR
All phases
Ruggedness – No damage (4)
Ru
PO ≤ 29 dBm
dBc
dBc
(1)
VCC = +3.4 V, VREF = +2.85 V, Freq = 1880 MHz, TC = 25 °C, unless otherwise specified
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCHH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.45 dB. For CDMA2000, back off output power 0.5 dB is
required.
(4)
All phases, time = 10 seconds.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
3
DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics
Gain conditions
Symbol
Maximum
29.0
VCONT = 2.5 V
PO = 16 dBm
21.0
GHIGH
VCONT = 0.5 V
PO = 29 dBm
24.5
33.0
ACP1LOW
VCONT = 2.5 V
PO ≤ 16 dBm
—
–44
ACP1HIGH
VCONT = 0.5 V
PO ≤ 29 dBm
—
–43
ACP3LOW
VCONT = 2.5 V
PO ≤ 16 dBm
—
–56
ACP3HIGH
VCONT = 0.5 V
PO ≤ 29 dBm
—
–56
Second
FO2
PO ≤ 29 dBm
—
–30
Third
FO3
PO ≤ 29 dBm
—
–40
RxBN
PO ≤ 29 dBm
—
–132.0
1.25 MHz offset
(2)(3)(4)
2.25 MHz offset
Harmonic Suppression
Minimum
GLOW
Digital Mode
Adjacent Channel Power
Condition
Noise Power in RX Band 1840-1895 MHz
Unit
dB
dBc
dBc
dBm/Hz
Noise Figure
NF
—
—
7.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
2.5:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
–65.0
dBc
Ruggedness – No damage (5)
Ru
PO ≤ 29 dBm
10:1
—
VSWR
(1)
Per Table 2, unless otherwise specified.
(2)
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3)
CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, back off output power 0.5 dB is
required.
(4)
Worst case ACPR is –43 dBc at +85 °C, VCC = 3.2 V.
(5)
All phases, time = 10 seconds.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Characterization Data
Figure 2 through Figure 8 illustrate the digital signal
characteristics of the CX77112. Shown are power sweep
characteristics for key performance parameters over temperature
and frequency, up to 28.5 dBm output power. The data was taken
up to and including 16 dBm output power with the bias mode
control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output
power, the VCONT was set to 0 volts.
The following graphs illustrate the characteristics of a typical
CX77112 Power Amplifier Module designed for operation in the
PCS frequency band (1850–1910 MHz). This amplifier was
selected by characterizing a group of devices and choosing a part
with average electrical performance for both nominal and the full
range of recommended operating conditions, including worst case
limits.
32
31
VREF = 2.85 V, VCC = 3.4 V
30
29
Gain (dB)
28
27
26
25
24
23
VCONT > 2.5 V
VCONT < 0.5 V
22
21
20
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_009
Figure 2. Digital Mode Gain vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ –30 ˚C
1910 @ +25 ˚C
1910 @ +85 ˚C
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
5
DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
600
550
VREF = 2.85 V, VCC = 3.4 V
500
Total Current (mA)
450
400
VCONT > 2.5 V
VCONT < 0.5 V
350
300
250
200
150
100
50
0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_010
Figure 3. Primary Bias Current vs. Output Power
45
40
Power Added Efficiency (%)
VREF = 2.85 V, VCC = 3.4 V
35
30
VCONT > 2.5 V
VCONT < 0.5 V
25
20
15
10
5
0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_011
Figure 4. Power Added Efficiency vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ –30 ˚C
1910 @ +25 ˚C
1910 @ +85 ˚C
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Adjacent Channel Power Ratio (–dBc)
70
68
VREF = 2.85 V, VCC = 3.4 V, 1.25 MHz Offset
66
64
62
60
VCONT > 2.5 V
VCONT < 0.5 V
58
56
54
52
50
48
46
44
42
40
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_012
Figure 5. Adjacent Channel Power for 1.25 MHz Offset vs. Output Power
Adjacent Channel Power Ratio (–dBc)
84
82
VREF = 2.85 V, VCC = 3.4 V, 2.25 MHz Offset
80
78
VCONT > 2.5 V
VCONT < 0.5 V
76
74
72
70
68
66
64
62
60
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_0013
Figure 6. Adjacent Channel Power for 2.25 MHz Offset vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ –30 ˚C
1910 @ +25 ˚C
1910 @ +85 ˚C
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
7
DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
46
VREF = 2.85 V, VCC = 3.4 V
2nd Harmonic Rejection (–dBc)
44
VCONT > 2.5 V
VCONT < 0.5 V
42
40
38
36
34
32
30
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_014
Figure 7. Second Harmonic Rejection vs. Output Power
70
3rd Harmonic Rejection (–dBc)
VREF = 2.85 V, VCC = 3.4 V
68
66
VCONT > 2.5 V
VCONT < 0.5 V
64
62
60
58
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
101904_015
Figure 8. Third Harmonic Rejection vs. Output Power
Legend
1850 @ –30 ˚C
1880 @ –30 ˚C
1850 @ +25 ˚C
1880 @ +25 ˚C
1850 @ +85 ˚C
1880 @ +85 ˚C
1910 @ –30 ˚C
1910 @ +25 ˚C
1910 @ +85 ˚C
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
CX77112, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 9 shows the
basic schematic of the board for the 1850 MHz to 1910 MHz
range.
VCC1
VCC2
1
RF IN
VCC1
VCC2
10
C2 A
330 pF
A C1
220 pF
2
RFIN
GND
C3
1000 pF
C4
10 µF
9
RF OUT
3
GND
RFOUT
8
VCONT
4
5
VCONT
GND
VREF
GND
7
6
VREF
C5
1000 pF
A Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds.
101904_002
Figure 9. Evaluation Board Schematic
P1
RF IN
PCS 4X4
J1
C1
VCC1
RF IN
GND
VREF
GND
1
VCC1
C3
GND
C4
VCC2
GND
GND
GND
RF OUT
VREF
J2
GND
U1
C5
VCONT
VCONT
II
VCC2
GND
C2
EN14-D1225-002
12/11/01
RF OUT
P2
101904_004
Figure 10. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
9
DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Package Dimensions and Pin Descriptions
The CX77112 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 11 is a mechanical
drawing of the pad layout for this package. The pin numbering
convention, as indicated in Figure 12, starts with pin 1 in the
upper left and increments counter-clockwise around the package.
Table 6 describes each pin function. Figure 13 illustrates typical
case markings.
PIN 1 INDICATOR
2X 0.575
4
(0.465)
0.1
METAL PAD EDGES
0.05 A B C
MOLD
B
C
MCM SUBSTRATE
0.1
4
2X 0.4
SOLDER MASK EDGES
0.1 A B C
DETAIL
A
A
PAD
SCALE: 2X
1X THIS ROTATION
1X ROTATED 90˚ CW
1X ROTATED 90˚ CCW
1X ROTATED 180˚
1.5 ±0.1
0.025 A
0.1 A B C
0.08
TOP VIEW
SIDE VIEW
2X 0.4
METAL PAD EDGES
0.55
(/ 0.3)
SOLDER MASK OPENING
(/ 0.15)
METAL PAD – PIN 1
(1.225)
2X 0.925
0.05 A B C
4X 0.85
4X 1.7
0.1
(1.275)
0.575
SOLDER MASK EDGES
B
0.1 A B C
DETAIL
2X 1.825
B
PAD
SCALE: 2X
3X THIS ROTATION
3X ROTATED 180˚
4X R0.2
A
SOLDER MASK OPENING
0.15 A B C
NOTES: unless otherwise specified
1.
2.
3.
4.
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M–1994.
SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT.
PADS ARE METAL DEFINED; THE CENTER PAD IS SOLDER MASK DEFINED.
BOTTOM VIEW
101904_003
Figure 11. CX77112 Package Drawing
Table 6. CX77112 Pin Configuration and Descriptions
PIN Number
Function
1
VCC1
(1)
Description
2
RF IN
RF Input
3
GND
Ground
4
VCONT
Control voltage
5
VREF
Reference voltage
6
GND
Ground
7
GND
Ground
8
RF OUT
RF Output
9
GND
Ground
10
VCC2 (1)
Connect to battery or DC supply
GND PAD
GND (2)
Ground pad on underside of package
1
10
2
9
3
8
4
7
Connect to battery or DC supply
(1)
All supply pins may be connected together at the supply.
(2)
Package underside is GND.
GROUND PAD
5
6
101904_005
Figure 12. CX77112 Pin Configuration
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Manufacturing
Part Number
Pin 1
Identifier
CX77112-NN
Lot Number
Year
Manufactured
DATA SHEET • CX77112
Revision
Number
EXXXXX.XX
YYWW MEX
Week
Package
Sealed
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards that
fail devices only after “the pin fails the electrical specification
limits” or “the pin becomes completely non-functional”.
Skyworks employs most stringent criteria to fail devices as soon
as the pin begins to show any degradation on a curve tracer. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Country Code
101904_006
Figure 13. Typical Case Markings
VCC1
10
> + 2000 V
< – 2000 V
2
9
GND
3
8
4
7
GND
6
GND
RF IN
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77112 is capable of withstanding an MSL3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 240 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020B.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Application
Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77112 is a Class 2 device. Figure 14 lists the Electrostatic
Discharge (ESD) immunity level for each pin of the CX77112
product. ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. The
numbers in Figure 14 specify the ESD threshold level for each pin
where the I-V curve between the pin and ground starts to show
degradation.
VCC2
1
> + 2000 V
< – 2000 V
VCONT
> + 2000 V
< – 2000 V
VREF
> + 2000 V
< – 2000 V
5
GROUND PAD
> + 2000 V
< – 2000 V
GND
RF OUT
> + 2000 V
< – 2000 V
101904_008
Figure 14. CX77112 ESD Sensitivity Areas (Top View)
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class 2 ESD
handling precautions listed in Table 7.
Table 7. Precautions for Handling GaAs IC-based Products
to Avoid Induced Damage
Personnel Grounding
Wrist Straps
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Facility
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Static Sensors
Protective Packaging & Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003
11
Skyworks Ordering Information
Model Number
Manufacturing
Part Number
CX77112
CX77112
Product Revision
Package
Operating Temperature
4x4LM–10
–30 °C to +85 °C
Revision History
Revision
Level
Date
Description
A
June 17, 2003
Initial Release
B
July 14, 2003
Revise: Table 2, 3, 4, 5
C
August 22, 2003
Revise: Table 1
D
November 25, 2003
Revise: Table 5
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel, Document Number 101568.
JEDEC Standard J-STD-020B
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