DATA SHEET CX77112: PA Module for CDMA PCS (1850–1910 MHz) Applications Description • Personal Communications Services (PCS) The CX77112 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount module developed for Personal Communications Service (PCS) and Wireless Local Loop (WLL) applications. This small and efficient Power Amplifier packs full 1850–1910 MHz bandwidth coverage into a single compact package. The CX77112 meets the stringent spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission, with high power added efficiency for power output of up to 29 dBm. A low current (VCONT) pin is provided to improve efficiency for the low RF power range of operation. • Wireless Local Loop (WLL) Features • Low voltage positive bias supply - 3.2 V to 4.2 V • Low VREF - 2.85 V, nominal • Good linearity • High efficiency • Large dynamic range • 10-pin package - 4 mm x 4 mm x 1.5 mm • Power down control The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the CX77112 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3 to 4 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. • Low power-state control • InGaP • IS95/CDMA2000 • Full U.S. PCS coverage VREF (4) VCC1 (1) Driver Stage Bias RF IN (2) Input Match VCONT (5) VCC2 (10) Power Stage Bias DA Inter Stage Match PA Output Match (8) RF OUT MMIC MODULE (3, 6, 7, 9) GND (3, 6, 7, 9) GND 101904_001 Figure 1. Functional Block Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 1 DATA SHEET • CX77112 PA MODULE FOR CDMA PCS (1850–1910 MHZ) Electrical Specifications The following tables list the electrical characteristics of the CX77112 Power Amplifier Module. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a truth table for the power ranges. Table 1. Absolute Maximum Ratings (1) Parameter Symbol Minimum Nominal Maximum Unit RF Input Power PIN — 1.0 6.0 dBm Supply Voltage VCC — 3.4 6.0 Volts Reference Voltage VREF — 2.85 3.1 Volts Case Operating Temperature TC –30 25 +110 °C Storage Temperature TSTG –55 — +125 °C (1) No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value. Table 2. Recommended Operating Conditions Parameter Symbol Minimum Nominal Maximum Unit Supply Voltage VCC 3.2 3.4 4.2 Volts Reference Voltage VREF 2.75 2.85 2.95 Volts Low Power Mode VCONT 2.0 2.5 3.0 Volts High Power Mode VCONT 0.0 0.5 1.0 Volts Control voltage Operating Frequency FO 1850.0 1880.0 1910.0 MHz Operating Temperature TO –30 +25 +85 °C Table 3. Power Range Truth Table VREF VCONT Range High Power Power Mode 2.85 V 0.5 V 16 dBm to 29 dBm Low Power 2.85 V 2.5 V ≤ 16 dBm Shut Down 0.00 V 0.0 V — Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D PA MODULE FOR CDMA PCS (1850–1910 MHZ) DATA SHEET • CX77112 Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1) Characteristics Gain conditions Symbol Quiescent current Typical Maximum 25.0 26.3 Unit VCONT = 2.5 V PO = 16 dB 24.0 GHIGH VCONT = 0.5 V PO = 29 dBm 27.0 28.5 30.0 PAELOW VCONT = 2.5 V PO = 16 dB 7.0 8.5 — PAEHIGH VCONT = 0.5 V PO = 29 dBm 37.0 40.0 — ICC_LOW PO = 16 dBm — 135 160 ICC_HIGH PO = 29 dBm — 580 625 IQ_LOW VCONT = 2.5 V 35 50 65 IQ_HIGH VCONT = 0.5 V 80 95 115 — — 6.0 10.0 mA Digital Mode Total Supply current Minimum GLOW Digital Mode Power Added Efficiency Condition dB % mA mA Reference current IREF Control current ICONT VCONT = 2.5 V — 140 250 µA IPD VCC = 3.4 V VREF = 0 V — 3.0 4.0 µA ACP1LOW VCONT = 2.5 V PO = 16 dB — –50 –48 ACP1HIGH VCONT = 0.5 V PO = 29 dBm — –51 –49 ACP3LOW VCONT = 2.5 V PO = 16 dB — –68 –60 ACP3HIGH VCONT = 0.5 V PO = 29 dBm — –60 –57 Second FO2 PO ≤ 29 dBm — –35 –32 Third FO3 PO ≤ 29 dBm — –55 –40 Noise Power in RX Band 1930-1990 MHz RxBN PO ≤ 29 dBm — –136 –135 dBm/Hz Noise Figure NF — — 5.5 6.0 dB Input Voltage Standing Wave Ratio VSWR — — — 2.0:1 — — — –65 dBc 10:1 — — VSWR Total Supply current in Power-down Mode 1.25 MHz offset Adjacent Channel Power (2)(3) 2.25 MHz offset Harmonic Suppression Stability (Spurious output) S 5:1 VSWR All phases Ruggedness – No damage (4) Ru PO ≤ 29 dBm dBc dBc (1) VCC = +3.4 V, VREF = +2.85 V, Freq = 1880 MHz, TC = 25 °C, unless otherwise specified (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (3) CDMA2000 is configured as DCHH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.45 dB. For CDMA2000, back off output power 0.5 dB is required. (4) All phases, time = 10 seconds. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 3 DATA SHEET • CX77112 PA MODULE FOR CDMA PCS (1850–1910 MHZ) Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1) Characteristics Gain conditions Symbol Maximum 29.0 VCONT = 2.5 V PO = 16 dBm 21.0 GHIGH VCONT = 0.5 V PO = 29 dBm 24.5 33.0 ACP1LOW VCONT = 2.5 V PO ≤ 16 dBm — –44 ACP1HIGH VCONT = 0.5 V PO ≤ 29 dBm — –43 ACP3LOW VCONT = 2.5 V PO ≤ 16 dBm — –56 ACP3HIGH VCONT = 0.5 V PO ≤ 29 dBm — –56 Second FO2 PO ≤ 29 dBm — –30 Third FO3 PO ≤ 29 dBm — –40 RxBN PO ≤ 29 dBm — –132.0 1.25 MHz offset (2)(3)(4) 2.25 MHz offset Harmonic Suppression Minimum GLOW Digital Mode Adjacent Channel Power Condition Noise Power in RX Band 1840-1895 MHz Unit dB dBc dBc dBm/Hz Noise Figure NF — — 7.0 dB Input Voltage Standing Wave Ratio (VSWR) VSWR — — 2.5:1 — Stability (Spurious output) S 5:1 VSWR All phases — –65.0 dBc Ruggedness – No damage (5) Ru PO ≤ 29 dBm 10:1 — VSWR (1) Per Table 2, unless otherwise specified. (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (3) CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, back off output power 0.5 dB is required. (4) Worst case ACPR is –43 dBc at +85 °C, VCC = 3.2 V. (5) All phases, time = 10 seconds. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D PA MODULE FOR CDMA PCS (1850–1910 MHZ) DATA SHEET • CX77112 Characterization Data Figure 2 through Figure 8 illustrate the digital signal characteristics of the CX77112. Shown are power sweep characteristics for key performance parameters over temperature and frequency, up to 28.5 dBm output power. The data was taken up to and including 16 dBm output power with the bias mode control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set to 0 volts. The following graphs illustrate the characteristics of a typical CX77112 Power Amplifier Module designed for operation in the PCS frequency band (1850–1910 MHz). This amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. 32 31 VREF = 2.85 V, VCC = 3.4 V 30 29 Gain (dB) 28 27 26 25 24 23 VCONT > 2.5 V VCONT < 0.5 V 22 21 20 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_009 Figure 2. Digital Mode Gain vs. Output Power Legend 1850 @ –30 ˚C 1880 @ –30 ˚C 1850 @ +25 ˚C 1880 @ +25 ˚C 1850 @ +85 ˚C 1880 @ +85 ˚C 1910 @ –30 ˚C 1910 @ +25 ˚C 1910 @ +85 ˚C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 5 DATA SHEET • CX77112 PA MODULE FOR CDMA PCS (1850–1910 MHZ) 600 550 VREF = 2.85 V, VCC = 3.4 V 500 Total Current (mA) 450 400 VCONT > 2.5 V VCONT < 0.5 V 350 300 250 200 150 100 50 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_010 Figure 3. Primary Bias Current vs. Output Power 45 40 Power Added Efficiency (%) VREF = 2.85 V, VCC = 3.4 V 35 30 VCONT > 2.5 V VCONT < 0.5 V 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_011 Figure 4. Power Added Efficiency vs. Output Power Legend 1850 @ –30 ˚C 1880 @ –30 ˚C 1850 @ +25 ˚C 1880 @ +25 ˚C 1850 @ +85 ˚C 1880 @ +85 ˚C 1910 @ –30 ˚C 1910 @ +25 ˚C 1910 @ +85 ˚C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D PA MODULE FOR CDMA PCS (1850–1910 MHZ) DATA SHEET • CX77112 Adjacent Channel Power Ratio (–dBc) 70 68 VREF = 2.85 V, VCC = 3.4 V, 1.25 MHz Offset 66 64 62 60 VCONT > 2.5 V VCONT < 0.5 V 58 56 54 52 50 48 46 44 42 40 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_012 Figure 5. Adjacent Channel Power for 1.25 MHz Offset vs. Output Power Adjacent Channel Power Ratio (–dBc) 84 82 VREF = 2.85 V, VCC = 3.4 V, 2.25 MHz Offset 80 78 VCONT > 2.5 V VCONT < 0.5 V 76 74 72 70 68 66 64 62 60 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_0013 Figure 6. Adjacent Channel Power for 2.25 MHz Offset vs. Output Power Legend 1850 @ –30 ˚C 1880 @ –30 ˚C 1850 @ +25 ˚C 1880 @ +25 ˚C 1850 @ +85 ˚C 1880 @ +85 ˚C 1910 @ –30 ˚C 1910 @ +25 ˚C 1910 @ +85 ˚C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 7 DATA SHEET • CX77112 PA MODULE FOR CDMA PCS (1850–1910 MHZ) 46 VREF = 2.85 V, VCC = 3.4 V 2nd Harmonic Rejection (–dBc) 44 VCONT > 2.5 V VCONT < 0.5 V 42 40 38 36 34 32 30 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_014 Figure 7. Second Harmonic Rejection vs. Output Power 70 3rd Harmonic Rejection (–dBc) VREF = 2.85 V, VCC = 3.4 V 68 66 VCONT > 2.5 V VCONT < 0.5 V 64 62 60 58 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm) 101904_015 Figure 8. Third Harmonic Rejection vs. Output Power Legend 1850 @ –30 ˚C 1880 @ –30 ˚C 1850 @ +25 ˚C 1880 @ +25 ˚C 1850 @ +85 ˚C 1880 @ +85 ˚C 1910 @ –30 ˚C 1910 @ +25 ˚C 1910 @ +85 ˚C Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D PA MODULE FOR CDMA PCS (1850–1910 MHZ) DATA SHEET • CX77112 Evaluation Board Description The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the CX77112, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 9 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range. VCC1 VCC2 1 RF IN VCC1 VCC2 10 C2 A 330 pF A C1 220 pF 2 RFIN GND C3 1000 pF C4 10 µF 9 RF OUT 3 GND RFOUT 8 VCONT 4 5 VCONT GND VREF GND 7 6 VREF C5 1000 pF A Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds. 101904_002 Figure 9. Evaluation Board Schematic P1 RF IN PCS 4X4 J1 C1 VCC1 RF IN GND VREF GND 1 VCC1 C3 GND C4 VCC2 GND GND GND RF OUT VREF J2 GND U1 C5 VCONT VCONT II VCC2 GND C2 EN14-D1225-002 12/11/01 RF OUT P2 101904_004 Figure 10. Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 9 DATA SHEET • CX77112 PA MODULE FOR CDMA PCS (1850–1910 MHZ) Package Dimensions and Pin Descriptions The CX77112 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package. The pin numbering convention, as indicated in Figure 12, starts with pin 1 in the upper left and increments counter-clockwise around the package. Table 6 describes each pin function. Figure 13 illustrates typical case markings. PIN 1 INDICATOR 2X 0.575 4 (0.465) 0.1 METAL PAD EDGES 0.05 A B C MOLD B C MCM SUBSTRATE 0.1 4 2X 0.4 SOLDER MASK EDGES 0.1 A B C DETAIL A A PAD SCALE: 2X 1X THIS ROTATION 1X ROTATED 90˚ CW 1X ROTATED 90˚ CCW 1X ROTATED 180˚ 1.5 ±0.1 0.025 A 0.1 A B C 0.08 TOP VIEW SIDE VIEW 2X 0.4 METAL PAD EDGES 0.55 (/ 0.3) SOLDER MASK OPENING (/ 0.15) METAL PAD – PIN 1 (1.225) 2X 0.925 0.05 A B C 4X 0.85 4X 1.7 0.1 (1.275) 0.575 SOLDER MASK EDGES B 0.1 A B C DETAIL 2X 1.825 B PAD SCALE: 2X 3X THIS ROTATION 3X ROTATED 180˚ 4X R0.2 A SOLDER MASK OPENING 0.15 A B C NOTES: unless otherwise specified 1. 2. 3. 4. ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M–1994. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT. PADS ARE METAL DEFINED; THE CENTER PAD IS SOLDER MASK DEFINED. BOTTOM VIEW 101904_003 Figure 11. CX77112 Package Drawing Table 6. CX77112 Pin Configuration and Descriptions PIN Number Function 1 VCC1 (1) Description 2 RF IN RF Input 3 GND Ground 4 VCONT Control voltage 5 VREF Reference voltage 6 GND Ground 7 GND Ground 8 RF OUT RF Output 9 GND Ground 10 VCC2 (1) Connect to battery or DC supply GND PAD GND (2) Ground pad on underside of package 1 10 2 9 3 8 4 7 Connect to battery or DC supply (1) All supply pins may be connected together at the supply. (2) Package underside is GND. GROUND PAD 5 6 101904_005 Figure 12. CX77112 Pin Configuration Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 November 25, 2003 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 101904D PA MODULE FOR CDMA PCS (1850–1910 MHZ) Manufacturing Part Number Pin 1 Identifier CX77112-NN Lot Number Year Manufactured DATA SHEET • CX77112 Revision Number EXXXXX.XX YYWW MEX Week Package Sealed Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards that fail devices only after “the pin fails the electrical specification limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria to fail devices as soon as the pin begins to show any degradation on a curve tracer. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Country Code 101904_006 Figure 13. Typical Case Markings VCC1 10 > + 2000 V < – 2000 V 2 9 GND 3 8 4 7 GND 6 GND RF IN Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The CX77112 is capable of withstanding an MSL3/240 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 240 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 °C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD–020B. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568. Electrostatic Discharge Sensitivity The CX77112 is a Class 2 device. Figure 14 lists the Electrostatic Discharge (ESD) immunity level for each pin of the CX77112 product. ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. The numbers in Figure 14 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. VCC2 1 > + 2000 V < – 2000 V VCONT > + 2000 V < – 2000 V VREF > + 2000 V < – 2000 V 5 GROUND PAD > + 2000 V < – 2000 V GND RF OUT > + 2000 V < – 2000 V 101904_008 Figure 14. CX77112 ESD Sensitivity Areas (Top View) To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 2 ESD handling precautions listed in Table 7. Table 7. Precautions for Handling GaAs IC-based Products to Avoid Induced Damage Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Facility Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 Ω to GND) Protective Workstation Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Protective Packaging & Transportation Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 101904D • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 25, 2003 11 Skyworks Ordering Information Model Number Manufacturing Part Number CX77112 CX77112 Product Revision Package Operating Temperature 4x4LM–10 –30 °C to +85 °C Revision History Revision Level Date Description A June 17, 2003 Initial Release B July 14, 2003 Revise: Table 2, 3, 4, 5 C August 22, 2003 Revise: Table 1 D November 25, 2003 Revise: Table 5 References Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel, Document Number 101568. JEDEC Standard J-STD-020B © 2001–2003, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks’ Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks™ products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and “Breakthrough Simplicity”™. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.