DATA SHEET SKY66002-11: 1900 to 2025 MHz, +19 dBm Linear Power Amplifier Applications Description Residential femtocells The SKY66002-11 linear Power Amplifier (PA) is a fully matched surface mount module developed for WCDMA applications operating from 1900 to 2025 MHz. The device meets the stringent spectral linearity requirements of WCDMA femtocell applications with high power-added efficiency. An integrated directional coupler eliminates the need for any external coupler. WCDMA, Band II Small cells Features The GaAs MMIC contains all active amplifier circuitry, which includes input and interstage matching circuits. An output match into a 50 Ω load, realized off-chip within the module package, optimizes efficiency and power performance. Small signal gain: 29 dB ACLR at POUT = +19 dBm: –50 dBc PA on/off control The SKY66002-11 is manufactured with Skyworks InGaP GaAs HBT process, which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. The primary bias to the device can be supplied directly from any suitable power supply with an output of 4.2 V. Power down is achieved by setting the VEN pin to 0 V. No external supply side switch is needed since typical “off” leakage is a few microamps with full primary voltage supplied from the main power supply. I/O impedance internally matched to 50 Ω Single DC supply: 3.3 V to 4.6 V Minimal number of external components required Small footprint MCM (10-pin, 3 x 3 mm) package (MSL3, 260 C per JEDEC J-STD-020) Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. VCC1 1 10 VCC2 RF_IN 2 9 RF_OUT GND 3 8 CPL_IN GND 4 7 GND VEN 5 6 CPL_OUT The SKY66002-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip Module (MCM), which allows for a highly manufacturable low-cost solution. The 10-pin MCM package and pinout are shown in Figure 1. A functional block diagram of the SKY66002-11 is shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. S2992 Figure 1. SKY66002-11 Pinout – 10-Pin MCM (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 1 DATA SHEET • SKY66002-11 LINEAR PA MMIC VEN VCC1 Driver Stage Bias RF_IN Input Match Power Stage Bias DA Inter-Stage Match Output Match PA RF_OUT VCC2 CPL_OUT CPL_IN S2993 Figure 2. SKY66002-11 Linear PA Block Diagram Table 1. SKY66002-11 Signal Descriptions Pin # Name Description Pin # Name Description 1 VCC1 Input stage supply voltage 6 CPL_OUT RF coupler output 2 RF_IN RF input port 7 GND Ground 3 GND Ground 8 CPL_IN RF coupler input 4 GND Ground 9 RF_OUT RF output port 5 VEN Enable 10 VCC2 Output stage supply voltage Technical Description Electrical and Mechanical Specifications The SKY66002-11 PA contains all of the needed RF matching and DC biasing circuits. The device is a two-stage, HBT InGaP device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications where PA linearity and power consumption are of critical importance (e.g., small cell and infrastructure applications). The absolute maximum ratings of the SKY66002-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Typical performance characteristics of the SKY66002-11 are illustrated in Figures 3 to 9. The device is designed for standard WCDMA modulated signals. Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D DATA SHEET • SKY66002-11 LINEAR PA Table 2. SKY66002-11 Absolute Maximum Ratings (Note 1) Parameter Symbol Supply voltage (VCC1, VCC2) VCC Total supply current ICC Logic control input voltage (VEN) VCTL Minimum Maximum Units 0 +4.6 V 700 mA 3.1 V –0.5 Case operating temperature (Note 2) TC –40 +85 C Storage temperature TSTG –55 +150 C Junction temperature TJ +150 C Thermal resistance ΘJC 60 C/W Electrostatic discharge: ESD 1000 1000 200 V V V Charged Device Model (CDM), Class 4 Human Body Model (HBM), Class 1C Machine Model (MM), Class B Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Note 2: Case operating temperature (Tc) refers to the temperature of the bottom ground pad. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SKY66002-11 Recommended Operating Conditions Parameter Symbol Minimum Typical 1900 Maximum Units Frequency range f 2025 MHz Supply voltage (VCC1, VCC2) (Note 1) VCC 4.0 4.2 4.6 V Logic control input voltage: Logic high Logic low VIH VIL 1.35 0 1.80 3.10 0.5 V V PA enable current IEN <1 mA Case operating temperature TC –20 +25 +85 C Note 1: Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this Data Sheet. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 3 DATA SHEET • SKY66002-11 LINEAR PA Table 4. SKY66002-11 Electrical Specifications (Note 1) (VCC1 = VCC2 = +4.2 V, TC = +25 C, f = 1960 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units Small signal gain |S21| CW, PIN = –20 dBm 27.5 29.0 dB Input return loss |S11| CW, PIN = –20 dBm 20 28 dB Quiescent current ICQ No RF 60 65 mA Operating current ICC CW, POUT = +19 dBm 133 150 mA Power-down current IPD VEN = “0” 0.5 1.0 μA Adjacent Channel Leakage Ratio ACLR5 @5 MHz offset, WCDMA test model 1, with 64 DPCH, POUT = +19 dBm –52.5 –47.0 dBc Error Vector Magnitude EVM POUT = +19 dBm 1.2 2.0 % Harmonic suppression 2fo 3fo CW, POUT = +19 dBm –45 –49 –41 –45 dBc dBc 3rd Order Output Intercept Point OIP3 +19 dBm/tone, frequency separation = 5 MHz Input coupling factor +38.0 +43.5 dBm CPLIN –20.5 dB Output coupling factor CPLOUT –22.0 dB Stability (non-harmonic spurious) VSWRSTABILITY VSWR = 6:1 –70 dBc Maximum ruggedness input power PIN_RUG VSWR = 6:1 –7 dBm Note 1: Performance is guaranteed only under the conditions listed in this Table. Both pins 6 and 8 (CPL_OUT and CPL_IN, respectively) should be terminated with 50 Ω. Typical Performance Characteristics –38 30.0 –42 29.5 1930 MHz 1960 MHz 1990 MHz 29.0 –46 Gain (dB) ACLR5 (dBc) (VCC1 = VCC2 = +4.2 V, TC = +25 C, f = 1960 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted) –50 –54 1930 MHz 1960 MHz 1990 MHz –58 –62 0 +2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 Output Power (dBm) Figure 3. ACLR5 vs Output Power Over Voltage 28.5 28.0 27.5 27.0 26.5 26.0 0 +2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 Output Power (dBm) Figure 4. Gain vs Output Power Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D 400 –40 350 –45 Second Harmonic (dBc) Supply Current (mA) DATA SHEET • SKY66002-11 LINEAR PA 300 250 200 150 1930 MHz 1960 MHz 1990 MHz 100 +2 +4 +6 –55 –60 1930 MHz 1960 MHz 1990 MHz –65 50 0 –50 –70 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 0 +2 +4 +6 Output Power (dBm) +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 Output Power (dBm) Figure 5. Supply Current vs Output Power Figure 6. Second Harmonic vs Output Power 0 –40 –5 Input Return Loss (dB) –10 –50 –55 –60 1930 MHz 1960 MHz 1990 MHz –65 –70 0 +2 +4 +6 –15 –20 –25 –30 –35 S11 (dB) S22 (dB) –40 –45 –50 1860 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 1900 1940 1980 2020 2060 Frequency (MHz) Output Power (dBm) Figure 7. Third Harmonic vs Output Power Figure 8. Input Return Loss vs Frequency 30.0 29.5 Small Signal Gain (dB) Third Harmonic (dBc) –45 29.0 28.5 28.0 27.5 27.0 1860 1900 1940 1980 2020 2060 Frequency (MHz) Figure 9. Small Signal Gain vs Frequency Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 5 DATA SHEET • SKY66002-11 LINEAR PA Evaluation Board Description The SKY66002-11 Evaluation Board is used to test the performance of the SKY66002-11 PA. A schematic diagram of the Evaluation Board is shown in Figure 10. An assembly drawing for the Evaluation Board is shown in Figure 11 and the layer detail is provided in Figure 12. shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. Package Dimensions The SKY66002-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. The PCB layout footprint for the SKY66002-11 is provided in Figure 13. Typical case markings are shown in Figure 14. Figure 15 shows the package dimensions for the 10-pin MCM, and Figure 16 provides the tape and reel dimensions. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the 1 VBATT C13 10 μF C12 DNI J1 C3 DNI C2 DNI C1 DNI RF Input C8 DNI VCC2 C4 DNI C5 DNI C6 1000 pF C7 10 μF VCC C11 DNI J2 2 RF_IN RF_OUT 9 3 GND CPL_IN 8 4 GND GND 7 VEN CPL_OUT 5 VEN_DATA VCC1 10 6 RF Output J3 J4 RF Coupler Input RF Coupler Output P1 5 6 7 8 9 × 10 11 12 KEY 4 VEN_DATA 3 VCC VCC_SNS 2 VBATT VBATT_SNS 1 S3156 Figure 10. SKY66002-11 Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D DATA SHEET • SKY66002-11 LINEAR PA P1 J1 J2 J4 J3 S3155 Figure 11. SKY66002-11 Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 7 DATA SHEET • SKY66002-11 LINEAR PA Layer 1: Top Metal Layer 2: Ground Layer 3: Ground Layer 4: Bottom (Ground) Layer S3157 Figure 12. SKY66002-11 Evaluation Board Layer Detail Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D DATA SHEET • SKY66002-11 LINEAR PA 3.3 Stencil aperture size for center ground pad should be 80% to 100% (by area) of the solder mask opening. 4X 0.075 0.6 4X 1.325 0.75 0.075 0.075 Package Outline Package Outline 4X 0.075 0.5 0.35 4X 0.675 Stencil Aperture Top View Stencil and Metallization 0.15 Solder Mask Opening SMT Pad Detail Scale: 2X 5X This Rotation 5X Rotated 180° 3.3 2X 1.35 Pin 1 (0.6) Thermal via array Ø0.3 mm on 0.6 mm pitch. Additional vias in common ground pad will improve thermal and electrical performance. NOTE: Thermal vias should be tented with solder mask, 30-35 μm copper plating recommended. 3.45 Pin 10 1.5 The shaded area represents the merger of the center ground + 1 individual I/O pad. All I/O ground pads should have at least one via connecting to internal ground planes for optimum electrical performance. (0.9) 0 0.25 Typ 4X 0.6 2.8 4X 1.2 0 Package Outline Metallizaton Top View Package Outline Solder Mask Opening Top View All dimensions are in millimeters S2995 Figure 13. PCB Layout Footprint for the SKY66002-11 3 x 3 mm MCM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 9 DATA SHEET • SKY66002-11 LINEAR PA Pin 1 Identifier Brand line 1: Part number and version Brand line 2: Lot number Brand line 3: Year, week, country code Figure 14. Typical Case Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D 3 Pin 1 Indicator B C 0 10 x 1.4 DATA SHEET • SKY66002-11 LINEAR PA Pin 1 Indicator Pin 10 Pin 1 4X 1.375 10X SMT Pad 0.15 M A B C A 3 0 4 x 0.6 B 4X 1.2 C A 0.15 A B C Solder Mask Opening See Detail D 0.2 A B C 0.9 ± 0.1 0.1 0.35 ± 0.1 (0.1) Solder Mask Edge 0.5 ± 0.05 0.35 ± 0.1 (0.1) 0.075 ± 0.05 Solder Mask Edge 0.35 ± 0.05 0.35 ± 0.05 Metal Pad Edge Metal Pad Edge Detail A Pad Scale: 2X 3X This Rotation 3X Rotated 180° 0.35 ± 0.1 (0.1) Solder Mask Edge (0.125) Detail B Pad Scale: 2X 1X This Rotation 1X Rotated 180° 0.2 X 0.2 Pin 1 Indicator 0.075 ± 0.05 0.35 ± 0.05 Metal Pad Edge 2.8 (0.125) Detail C Pad Scale: 2X 1X This Rotation 1X Rotated 180° 1.5 Detail D Pad Dimensioning and Tolerancing in accordance with ASME Y14.5M–1994 All dimensions are in millimeters. S2991 Figure 15. SKY66002-11 10-Pin MCM Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 11 DATA SHEET • SKY66002-11 LINEAR PA B A 3.20 ± 0.10 (Bo) 1.75 ± 0.10 4.00 ± 0.10 A 5° Max. 1.15 ± 0.10 (Ko) B Pin #1 Indicator (See Notes 6 and 7) 4.00 ± 0.10 B 5° Max. Notes: 1. Carrier tape: black conductive polycarbonate or polystyrene. 2. Cover tape material: transparent conductive material. 3. 10 sprocket hole pitch cumulative tolerance: ±0.20 mm. 4. Ao and Bo measured on plane 0.30 mm from bottom pocket. 5. All measurements are in millimeters. 6. Pin 1 orientation is in top left corner for the following 3 x 3 mm products: SKY13420 SKY13435 SKY77729 7. Pin 1 orientation is in top right for all other 3 x 3 mm MCMs and RFLGA products. 3.20 ± 0.10 (Ao) A Figure 16. SKY66002-11 Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 12 8.00 ± 0.20 2.00 ± 0.05 3.50 ± 0.05 ø1.50 + 0.10/–0 0.25 ± 0.05 (T) November 8, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202461D S3581 DATA SHEET • SKY66002-11 LINEAR PA Ordering Information Model Name SKY66002-11 Linear PA Manufacturing Part Number SKY66002-11 Evaluation Board Part Number EN40-D605 Copyright © 2012, 2013 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, Helios, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202461D • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 8, 2013 13