DATA SHEET SKY66013-11: 700 to 800 MHz, +19 dBm Linear Power Amplifier Applications Description Residential femtocells The SKY66013-11 linear Power Amplifier (PA) is a fully matched surface mount module developed for WCDMA applications operating from 700 to 800 MHz. The device meets the stringent spectral linearity requirements of WCDMA femtocell applications with high power-added efficiency. An integrated directional coupler eliminates the need for any external coupler. WCDMA, Bands 12, 13, 14, 17 Small cells Features The GaAs MMIC contains all active amplifier circuitry, which includes input and interstage matching circuits. An output match into a 50 Ω load, realized off-chip within the module package, optimizes efficiency and power performance. Small signal gain: 27.5 dB ACLR at POUT = +19 dBm: –51 dBc PA on/off control The SKY66013-11 is manufactured with Skyworks InGaP GaAs HBT process, which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. The primary bias to the device can be supplied directly from any suitable power supply with an output of 4.2 V. Power down is achieved by setting the VEN pin to 0 V. No external supply side switch is needed since typical “off” leakage is a few microamps with full primary voltage supplied from the main power supply. I/O impedance internally matched to 50 Ω Single DC supply: 3.3 V to 4.6 V Minimal number of external components required Small footprint MCM (10-pin, 3 x 3 mm) package (MSL3, 260 C per JEDEC J-STD-020) Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. VCC1 1 10 VCC2 RF_IN 2 9 RF_OUT GND 3 8 CPL_IN GND 4 7 GND VEN 5 6 CPL_OUT The SKY66013-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip Module (MCM), which allows for a highly manufacturable low-cost solution. The 10-pin MCM package and pinout are shown in Figure 1. A functional block diagram of the SKY66013-11 is shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. S2992 Figure 1. SKY66013-11 Pinout – 10-Pin MCM (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202854C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 6, 2014 1 DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER MMIC VEN VCC1 Power Stage Bias Driver Stage Bias RF_IN Input Match DA Inter-Stage Match Output Match PA RF_OUT VCC2 CPL_OUT CPL_IN S2993 Figure 2. SKY66013-11 Linear PA Block Diagram Table 1. SKY66013-11 Signal Descriptions Pin Name Description Pin Name Description 1 VCC1 Input stage supply voltage 6 CPL_OUT RF coupler output 2 RF_IN RF input port 7 GND Ground 3 GND Ground 8 CPL_IN RF coupler input 4 GND Ground 9 RF_OUT RF output port 5 VEN Enable 10 VCC2 Output stage supply voltage Technical Description Electrical and Mechanical Specifications The SKY66013-11 PA contains all of the needed RF matching and DC biasing circuits. The device is a two-stage, HBT InGaP device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications where PA linearity and power consumption are of critical importance (e.g., small cell and infrastructure applications). The absolute maximum ratings of the SKY66013-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. The device is designed for standard WCDMA modulated signals. Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 March 6, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202854C DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER Table 2. SKY66013-11 Absolute Maximum Ratings (Note 1) Parameter Symbol Supply voltage (VCC1, VCC2) VCC Total supply current ICC Logic control input voltage (VEN) VCTL Minimum Maximum Units 0 +4.6 V 700 mA 3.1 V –0.5 Case operating temperature (Note 2) TC –40 +85 C Storage temperature TSTG –55 +150 C Junction temperature TJ +150 C Thermal resistance ΘJC 60 C/W Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. Note 2: Case operating temperature (Tc) refers to the temperature of the bottom ground pad. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SKY66013-11 Recommended Operating Conditions Parameter Symbol Minimum Typical Maximum Units Frequency range f 729 768 MHz Supply voltage (VCC1, VCC2) (Note 1) VCC 4.0 4.2 4.6 V Logic control input voltage: Logic high Logic low VIH VIL 1.35 0 1.80 3.10 0.5 V V PA enable current IEN <1 mA Case operating temperature TC –20 +25 +85 C Note 1: Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this Data Sheet. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202854C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 6, 2014 3 DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER Table 4. SKY66013-11 Electrical Specifications (Note 1) (VCC1 = VCC2 = +4.2 V, TC = +25 C, f = 746 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical 25.5 Max Units Small signal gain |S21| CW, PIN = –20 dBm 27.5 dB Input return loss |S11| CW, PIN = –20 dBm –17 dB Quiescent current ICQ No RF 45 55 mA Operating current ICC CW, POUT = +19 dBm 110 120 mA Power-down current IPD VEN = “0” 1 5 μA 3 order output intercept point OIP3 Δf = 5 MHz +40 Adjacent channel leakage ratio ACLR5 @5 MHz offset, WCDMA test model 1, with 64 DPCH, POUT = +19 dBm –51 rd dBm –45 dBc Error Vector Magnitude EVM POUT = +19 dBm 2 3 % Harmonic suppression 2fo 3fo CW, POUT = +19 dBm –43 –60 –38 –54 dBc dBc Stability (non-harmonic spurious) VSWRSTABILITY VSWR = 6:1 @ POUT = +19 dBm –63 dBc Maximum ruggedness input power PIN_RUG VSWR = 6:1 –7 dBm Note 1: Performance is guaranteed only under the conditions listed in this Table. Both pins 6 and 8 (CPL_OUT and CPL_IN, respectively) should be terminated with 50 Ω. Evaluation Board Description The SKY66013-11 Evaluation Board is used to test the performance of the SKY66013-11 PA. A schematic diagram of the Evaluation Board is shown in Figure 3. An assembly drawing for the Evaluation Board is shown in Figure 4 and the layer detail is provided in Figure 5. shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. Package Dimensions The SKY66013-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. The PCB layout footprint for the SKY66013-11 is provided in Figure 6. Typical case markings are shown in Figure 7. Figure 8 shows the package dimensions for the 10-pin MCM, and Figure 9 provides the tape and reel dimensions. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 March 6, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202854C DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER 1 VBATT C13 10 μF C12 DNI J1 C3 DNI C2 DNI C1 DNI RF Input VCC1 VCC2 2 RF_IN RF_OUT 9 3 GND CPL_IN 8 4 GND GND 7 VEN CPL_OUT 5 VEN_DATA C8 DNI C4 DNI 10 C5 DNI C6 1000 pF C7 10 μF VCC C11 DNI J2 RF Output J3 J4 6 RF Coupler Input RF Coupler Output P1 5 6 7 8 9 10 11 12 × “Key” pin 4 VEN_DATA 3 VCC VCC_SNS 2 VBATT VBATT_SNS 1 S3156 Figure 3. SKY66013-11 Evaluation Board Schematic P1 J1 J2 J4 J3 S3155 Figure 4. SKY66013-11 Evaluation Board Assembly Diagram Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202854C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 6, 2014 5 DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER Layer 1: Top Metal Layer 2: Ground Layer 3: Ground Layer 4: Bottom (Ground) Layer S3157 Figure 5. SKY66013-11 Evaluation Board Layer Detail Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 March 6, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202854C DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER 3.3 Stencil aperture size for center ground pad should be 80% to 100% (by area) of the solder mask opening. 4X 0.075 0.6 4X 1.325 0.75 0.075 0.075 Package Outline Package Outline 4X 0.075 0.5 0.35 4X 0.675 Stencil Aperture Top View Stencil and Metallization 0.15 Solder Mask Opening SMT Pad Detail Scale: 2X 5X This Rotation 5X Rotated 180° 3.3 2X 1.35 Pin 1 (0.6) Thermal via array Ø0.3 mm on 0.6 mm pitch. Additional vias in common ground pad will improve thermal and electrical performance. NOTE: Thermal vias should be tented with solder mask, 30-35 μm copper plating recommended. 3.45 Pin 10 1.5 The shaded area represents the merger of the center ground + 1 individual I/O pad. All I/O ground pads should have at least one via connecting to internal ground planes for optimum electrical performance. (0.9) 0 0.25 Typ 4X 0.6 2.8 4X 1.2 0 Package Outline Metallization Top View Package Outline Solder Mask Opening Top View All dimensions are in millimeters S2995 Figure 6. PCB Layout Footprint for the SKY66013-11 3 x 3 mm MCM Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202854C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 6, 2014 7 DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER Pin 1 Identifier Brand line 1: Part number and version Brand line 2: Lot number Brand line 3: Year, week, country code 3 Pin 1 Indicator B C 0 10 x 1.4 Figure 7. Typical Case Markings (Top View) Pin 1 Indicator Pin 10 Pin 1 4X 1.375 10X SMT Pad 0.15 M A B C A 3 0 4 x 0.6 B 4X 1.2 C A 0.15 A B C Solder Mask Opening See Detail D 0.2 A B C 0.9 ± 0.1 0.1 0.35 ± 0.1 (0.1) Solder Mask Edge 0.5 ± 0.05 0.35 ± 0.1 (0.1) 0.075 ± 0.05 Solder Mask Edge 0.35 ± 0.05 0.35 ± 0.05 Metal Pad Edge Metal Pad Edge Detail A Pad Scale: 2X 3X This Rotation 3X Rotated 180° 0.35 ± 0.1 (0.1) Solder Mask Edge (0.125) Detail B Pad Scale: 2X 1X This Rotation 1X Rotated 180° 0.2 X 0.2 Pin 1 Indicator 0.075 ± 0.05 0.35 ± 0.05 Metal Pad Edge 2.8 (0.125) Detail C Pad Scale: 2X 1X This Rotation 1X Rotated 180° 1.5 Detail D Pad Dimensioning and Tolerancing in accordance with ASME Y14.5M–1994 All dimensions are in millimeters. Figure 8. SKY66013-11 10-Pin MCM Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 March 6, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202854C S2991 DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER B A 3.20 ± 0.10 (Bo) 1.75 ± 0.10 4.00 ± 0.10 A 5° Max. 1.15 ± 0.10 (Ko) B 8.00 ± 0.20 2.00 ± 0.05 3.50 ± 0.05 ø1.50 + 0.10/–0 0.25 ± 0.05 (T) Pin #1 Indicator (See Notes 6 and 7) 4.00 ± 0.10 B 5° Max. Notes: 1. Carrier tape: black conductive polycarbonate or polystyrene. 2. Cover tape material: transparent conductive material. 3. 10 sprocket hole pitch cumulative tolerance: ±0.20 mm. 4. Ao and Bo measured on plane 0.30 mm from bottom pocket. 5. All measurements are in millimeters. 6. Pin 1 orientation is in top left corner for the following 3 x 3 mm products: SKY13420 SKY13435 SKY77729 7. Pin 1 orientation is in top right for all other 3 x 3 mm MCMs and RFLGA products. 3.20 ± 0.10 (Ao) A S3581 Figure 9. SKY66013-11 Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202854C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 6, 2014 9 DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER Ordering Information Model Name SKY66013-11: 729 to 768 MHz, +19 dBm Linear PA Manufacturing Part Number SKY66013-11 Evaluation Board Part Number EN40-D605 Copyright © 2013-2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. 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