SKY66013-11 DataSheet - Skyworks Solutions, Inc.

DATA SHEET
SKY66013-11: 700 to 800 MHz, +19 dBm Linear Power
Amplifier
Applications
Description
 Residential femtocells
The SKY66013-11 linear Power Amplifier (PA) is a fully matched
surface mount module developed for WCDMA applications
operating from 700 to 800 MHz. The device meets the stringent
spectral linearity requirements of WCDMA femtocell applications
with high power-added efficiency. An integrated directional
coupler eliminates the need for any external coupler.
 WCDMA, Bands 12, 13, 14, 17
 Small cells
Features
The GaAs MMIC contains all active amplifier circuitry, which
includes input and interstage matching circuits. An output match
into a 50 Ω load, realized off-chip within the module package,
optimizes efficiency and power performance.
 Small signal gain: 27.5 dB
 ACLR at POUT = +19 dBm: –51 dBc
 PA on/off control
The SKY66013-11 is manufactured with Skyworks InGaP GaAs
HBT process, which provides for all positive voltage DC supply
operation and maintains high efficiency and good linearity. The
primary bias to the device can be supplied directly from any
suitable power supply with an output of 4.2 V. Power down is
achieved by setting the VEN pin to 0 V. No external supply side
switch is needed since typical “off” leakage is a few microamps
with full primary voltage supplied from the main power supply.
 I/O impedance internally matched to 50 Ω
 Single DC supply: 3.3 V to 4.6 V
 Minimal number of external components required
 Small footprint MCM (10-pin, 3 x 3 mm) package
(MSL3, 260 C per JEDEC J-STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
VCC1
1
10
VCC2
RF_IN
2
9
RF_OUT
GND
3
8
CPL_IN
GND
4
7
GND
VEN
5
6
CPL_OUT
The SKY66013-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip
Module (MCM), which allows for a highly manufacturable low-cost
solution.
The 10-pin MCM package and pinout are shown in Figure 1. A
functional block diagram of the SKY66013-11 is shown in
Figure 2. Signal pin assignments and functional pin descriptions
are provided in Table 1.
S2992
Figure 1. SKY66013-11 Pinout – 10-Pin MCM
(Top View)
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DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER
MMIC
VEN
VCC1
Power Stage
Bias
Driver Stage
Bias
RF_IN
Input
Match
DA
Inter-Stage
Match
Output
Match
PA
RF_OUT
VCC2
CPL_OUT
CPL_IN
S2993
Figure 2. SKY66013-11 Linear PA Block Diagram
Table 1. SKY66013-11 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
VCC1
Input stage supply voltage
6
CPL_OUT
RF coupler output
2
RF_IN
RF input port
7
GND
Ground
3
GND
Ground
8
CPL_IN
RF coupler input
4
GND
Ground
9
RF_OUT
RF output port
5
VEN
Enable
10
VCC2
Output stage supply voltage
Technical Description
Electrical and Mechanical Specifications
The SKY66013-11 PA contains all of the needed RF matching and
DC biasing circuits. The device is a two-stage, HBT InGaP device
optimized for high linearity and power efficiency. These features
make the device suitable for wideband digital applications where
PA linearity and power consumption are of critical importance
(e.g., small cell and infrastructure applications).
The absolute maximum ratings of the SKY66013-11 are provided
in Table 2. The recommended operating conditions are specified
in Table 3 and electrical specifications are provided in Table 4.
The device is designed for standard WCDMA modulated signals.
Under these stringent test conditions, the device exhibits excellent
spectral purity and power efficiency.
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DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER
Table 2. SKY66013-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Supply voltage (VCC1, VCC2)
VCC
Total supply current
ICC
Logic control input voltage (VEN)
VCTL
Minimum
Maximum
Units
0
+4.6
V
700
mA
3.1
V
–0.5
Case operating temperature (Note 2)
TC
–40
+85
C
Storage temperature
TSTG
–55
+150
C
Junction temperature
TJ
+150
C
Thermal resistance
ΘJC
60
C/W
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: Case operating temperature (Tc) refers to the temperature of the bottom ground pad.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY66013-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
Frequency range
f
729
768
MHz
Supply voltage (VCC1, VCC2) (Note 1)
VCC
4.0
4.2
4.6
V
Logic control input voltage:
Logic high
Logic low
VIH
VIL
1.35
0
1.80
3.10
0.5
V
V
PA enable current
IEN
<1
mA
Case operating temperature
TC
–20
+25
+85
C
Note 1: Voltage levels measured at the pads of the package. The Evaluation Board supply voltage levels may be different. Refer to the Evaluation Board schematic diagram in this Data Sheet.
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DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER
Table 4. SKY66013-11 Electrical Specifications (Note 1)
(VCC1 = VCC2 = +4.2 V, TC = +25 C, f = 746 MHz, Characteristic Impedance [ZO] = 50 Ω, VEN = “1,” Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
25.5
Max
Units
Small signal gain
|S21|
CW, PIN = –20 dBm
27.5
dB
Input return loss
|S11|
CW, PIN = –20 dBm
–17
dB
Quiescent current
ICQ
No RF
45
55
mA
Operating current
ICC
CW, POUT = +19 dBm
110
120
mA
Power-down current
IPD
VEN = “0”
1
5
μA
3 order output intercept point
OIP3
Δf = 5 MHz
+40
Adjacent channel leakage ratio
ACLR5
@5 MHz offset, WCDMA test model 1,
with 64 DPCH, POUT = +19 dBm
–51
rd
dBm
–45
dBc
Error Vector Magnitude
EVM
POUT = +19 dBm
2
3
%
Harmonic suppression
2fo
3fo
CW, POUT = +19 dBm
–43
–60
–38
–54
dBc
dBc
Stability (non-harmonic spurious)
VSWRSTABILITY
VSWR = 6:1 @ POUT = +19 dBm
–63
dBc
Maximum ruggedness input power
PIN_RUG
VSWR = 6:1
–7
dBm
Note 1: Performance is guaranteed only under the conditions listed in this Table. Both pins 6 and 8 (CPL_OUT and CPL_IN, respectively) should be terminated with 50 Ω.
Evaluation Board Description
The SKY66013-11 Evaluation Board is used to test the
performance of the SKY66013-11 PA. A schematic diagram of the
Evaluation Board is shown in Figure 3. An assembly drawing for
the Evaluation Board is shown in Figure 4 and the layer detail is
provided in Figure 5.
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
Package Dimensions
The SKY66013-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
The PCB layout footprint for the SKY66013-11 is provided in
Figure 6. Typical case markings are shown in Figure 7. Figure 8
shows the package dimensions for the 10-pin MCM, and Figure 9
provides the tape and reel dimensions.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
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DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER
1
VBATT
C13
10 μF
C12
DNI
J1
C3
DNI
C2
DNI
C1
DNI
RF Input
VCC1
VCC2
2
RF_IN
RF_OUT
9
3
GND
CPL_IN
8
4
GND
GND
7
VEN
CPL_OUT
5
VEN_DATA
C8
DNI
C4
DNI
10
C5
DNI
C6
1000 pF
C7
10 μF
VCC
C11
DNI
J2
RF Output
J3
J4
6
RF Coupler
Input
RF Coupler
Output
P1
5
6
7
8
9
10 11 12
×
“Key” pin
4
VEN_DATA
3
VCC
VCC_SNS
2
VBATT
VBATT_SNS
1
S3156
Figure 3. SKY66013-11 Evaluation Board Schematic
P1
J1
J2
J4
J3
S3155
Figure 4. SKY66013-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Ground
Layer 4: Bottom (Ground) Layer
S3157
Figure 5. SKY66013-11 Evaluation Board Layer Detail
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DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER
3.3
Stencil aperture size for
center ground pad should
be 80% to 100% (by area)
of the solder mask opening.
4X 0.075
0.6
4X 1.325
0.75
0.075
0.075
Package Outline
Package Outline
4X 0.075
0.5
0.35
4X 0.675
Stencil Aperture
Top View
Stencil and
Metallization
0.15
Solder Mask
Opening
SMT Pad Detail
Scale: 2X
5X This Rotation
5X Rotated 180°
3.3
2X 1.35
Pin 1
(0.6)
Thermal via array Ø0.3 mm on 0.6 mm pitch.
Additional vias in common ground pad
will improve thermal and electrical performance.
NOTE: Thermal vias should be tented with solder
mask, 30-35 μm copper plating recommended.
3.45
Pin 10
1.5
The shaded area represents the merger
of the center ground + 1 individual I/O
pad. All I/O ground pads should have at least
one via connecting to internal ground planes
for optimum electrical performance.
(0.9)
0
0.25 Typ
4X 0.6
2.8
4X 1.2
0
Package Outline
Metallization
Top View
Package Outline
Solder Mask Opening
Top View
All dimensions are in millimeters
S2995
Figure 6. PCB Layout Footprint for the SKY66013-11 3 x 3 mm MCM
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DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER
Pin 1 Identifier
Brand line 1: Part number and version
Brand line 2: Lot number
Brand line 3: Year, week, country code
3
Pin 1
Indicator
B
C
0
10 x 1.4
Figure 7. Typical Case Markings
(Top View)
Pin 1 Indicator
Pin 10
Pin 1
4X 1.375
10X SMT Pad
0.15 M A B C
A
3
0
4 x 0.6
B
4X 1.2
C
A
0.15 A B C
Solder Mask Opening
See Detail D
0.2 A B C
0.9 ± 0.1
0.1
0.35 ± 0.1
(0.1)
Solder Mask Edge
0.5 ± 0.05
0.35 ± 0.1
(0.1)
0.075 ± 0.05
Solder Mask Edge
0.35 ± 0.05
0.35 ± 0.05
Metal Pad Edge
Metal Pad Edge
Detail A
Pad
Scale: 2X
3X This Rotation
3X Rotated 180°
0.35 ± 0.1
(0.1)
Solder Mask Edge
(0.125)
Detail B
Pad
Scale: 2X
1X This Rotation
1X Rotated 180°
0.2 X 0.2
Pin 1 Indicator
0.075 ± 0.05
0.35 ± 0.05
Metal Pad Edge
2.8
(0.125)
Detail C
Pad
Scale: 2X
1X This Rotation
1X Rotated 180°
1.5
Detail D
Pad
Dimensioning and Tolerancing in accordance with ASME Y14.5M–1994
All dimensions are in millimeters.
Figure 8. SKY66013-11 10-Pin MCM Package Dimensions
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S2991
DATA SHEET • SKY66013-11 LINEAR POWER AMPLIFIER
B
A
3.20 ± 0.10 (Bo)
1.75 ± 0.10
4.00 ± 0.10
A
5° Max.
1.15 ± 0.10 (Ko)
B
8.00 ± 0.20
2.00 ± 0.05
3.50 ± 0.05
ø1.50 + 0.10/–0
0.25 ± 0.05 (T)
Pin #1 Indicator
(See Notes 6 and 7)
4.00 ± 0.10
B
5° Max.
Notes:
1. Carrier tape: black conductive polycarbonate or polystyrene.
2. Cover tape material: transparent conductive material.
3. 10 sprocket hole pitch cumulative tolerance: ±0.20 mm.
4. Ao and Bo measured on plane 0.30 mm from bottom pocket.
5. All measurements are in millimeters.
6. Pin 1 orientation is in top left corner for the following 3 x 3 mm products:
SKY13420
SKY13435
SKY77729
7. Pin 1 orientation is in top right for all other 3 x 3 mm MCMs and
RFLGA products.
3.20 ± 0.10 (Ao)
A
S3581
Figure 9. SKY66013-11 Tape and Reel Dimensions
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DATA SHEET • SKY66013-11: LINEAR POWER AMPLIFIER
Ordering Information
Model Name
SKY66013-11: 729 to 768 MHz, +19 dBm Linear PA
Manufacturing Part Number
SKY66013-11
Evaluation Board Part Number
EN40-D605
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