ETC FAN5059M

www.fairchildsemi.com
FAN5059
High Performance Programmable Synchronous
DC-DC Controller for Multi-Voltage Platforms
Features
Applications
• Programmable output for Vcore from 1.3V to 3.5V using
an integrated 5-bit DAC
• Controls adjustable linears for Vagp (selectable 1.5V/3.3V),
Vclock (2.5V), and Vtt (1.5V) or Vnorthbridge (1.8V)
• Meets VRM specification with as few as 5 capacitors
• Meets 1.550V +40/-70mV over initial tolerance,
temperature and transients
•
•
•
•
•
•
•
•
•
•
•
Remote sense
Programmable Active Droop™ (Voltage Positioning)
Drives N-Channel MOSFETs
Overcurrent protection using MOSFET sensing
85% efficiency typical at full load
Integrated Power Good and Enable/Soft Start functions
24 pin SOIC package
Power supply for Pentium® III Camino Platform
Power supply for Pentium III Whitney Platform
VRM for Pentium III processor
Programmable multi-output power supply
Description
The FAN5059 is a synchronous mode DC-DC controller IC
which provides a highly accurate, programmable set of output
voltages for multi-voltage platforms such as the Intel Camino,
and provides a complete solution for the Intel Whitney and other
high-performance processors. The FAN5059 features remote
voltage sensing, independently adjustable current limit, and a
proprietary Programmable Active Droop™ for optimal converter
transient response. The FAN5059 uses a 5-bit D/A converter
to program the output voltage from 1.3V to 3.5V. The
FAN5059 uses a high level of integration to deliver load
Block Diagram
+5V
VCCA 21
+3.3V
9
+1.5V
+
-
RD
PWRGD,
OCL
10
VCCP
11
19
+
REF
OCL
+
-
REF
+12V
PWRGD,
OCL
12
+2.5V
+
OSC
RS
20
24 VCCP
1 HIDRV
+
15
14
+
-
V
+
Digital
Control
+
2
VCC
23 LODRV
PWRGD, OCL
13
+5V
18
22
3.3/1.5V
GNDP
5-Bit
DAC
8 7 65 4
VID0 VID2 VID4
VID1 VID3
1.24V
Reference
Power
Good
3
GNDA
17
PWRGD
16
ENABLE/SS
Pentium is a registered trademark of Intel Corporation. Programmable Active Droop is a trademark of Fairchild Semiconductor.
Rev. 1.0.0
FAN5059
PRODUCT SPECIFICATION
currents in excess of 16A from a 5V source with minimal
external circuitry. Synchronous-mode operation offers optimum efficiency over the entire specified output voltage range.
An on-board precision low TC reference achieves tight tolerance voltage regulation without expensive external components, while Programmable Active Droop™ permits exact
tailoring of voltage for the most demanding load transients. The
FAN5059 includes linear regulator controllers for Vtt termination (1.5V), Vclock (2.5V), and Vnorthbridge (1.8V) or Vagp
(selectable 1.5V/3.3V), each adjustable with an external divider.
The FAN5059 also offers integrated functions including Power
Good, Output Enable/Soft Start and current limiting, and is
available in a 24 pin SOIC package.
Pin Assignments
HIDRV
SW
GNDA
VID4
VID3
VID2
VID1
VID0
VTTGATE
VTTFB
VCKGATE
VCKFB
1
2
3
4
5
6
7
8
9
10
11
12
FAN5059
24
23
22
21
20
19
18
17
16
15
14
13
VCCP
LODRV
GNDP
VCCA
VFB
DROOP
ILIM
PWRGD
SS/ENABLE
TYPEDET
VAGPGATE
VAGPFB
Pin Definitions
Pin
Number Pin Name
2
Pin Function Description
1
HIDRV
High Side FET Driver. Connect this pin through a resistor to the gate of an N-channel
MOSFET. The trace from this pin to the MOSFET gate should be <0.5".
2
SW
High side Driver Source and Low side Driver Drain Switching Node. Together with
DROOP and ILIM pins allows FET sensing for Vcc current.
3
GNDA
Analog Ground. Return path for low power analog circuitry. This pin should be
connected to a low impedance system ground plane to minimize ground loops.
4-8
VID0-4
Voltage Identification Code Inputs. These open collector/TTL compatible inputs will
program the output voltage over the ranges specified in Table 2. Pull-up resistors are
internal to the controller.
9
VTTGATE
Gate Driver for VTT Transistor. For 1.5V output.
10
VTTFB
Voltage Feedback for VTT.
11
VCKGATE
Gate Driver for VCK Transistor. For 2.5V output.
12
VCKFB
Voltage Feedback for VCK.
13
VAGPFB
Voltage Feedback for VAGP.
14
VAGPGATE
Gate Driver for VAGP Transistor. For 3.3/1.5V output.
15
TYPEDET
Type Detect. Sets 3.3V or 1.5V for AGP.
16
ENABLE/SS
Output Enable. A logic LOW on this pin will disable all outputs. An internal current source
allows for open collector control. This pin also doubles as soft start for all outputs.
17
PWRGD
Power Good Flag. An open collector output that will be logic LOW if any output voltage
is more than ±12% outside of the nominal output voltage setpoint.
18
ILIM
Vcc Current Feedback. Pin 18 is used in conjunction with pin 2 as the input for the Vcc
current feedback control loop. Layout of these traces is critical to system performance.
See Application Information for details.
19
DROOP
Droop set. Use this pin to set magnitude of active droop.
20
VFB
Vcc Voltage Feedback. Pin 20 is used as the input for the Vcc voltage feedback control
loop. See Application Information for details regarding correct layout.
21
VCCA
Analog VCC. Connect to system 5V supply and decouple with a 0.1µF ceramic capacitor.
22
GNDP
Power Ground. Return pin for high currents flowing in pin 24 (VCCP).
23
LODRV
Vcc Low Side FET Driver. Connect this pin through a resistor to the gate of an N-channel
MOSFET for synchronous operation. The trace from this pin to the MOSFET gate should
be <0.5".
24
VCCP
Power VCC. For all FET drivers. Connect to system 12V supply through a 33Ω, and
decouple with a 1µF ceramic capacitor.
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Absolute Maximum Ratings
Supply Voltage VCCA to GND
13.5V
Supply Voltage VCCP to GND
15V
Voltage Identification Code Inputs, VID0-VID4
VCCA
All Other Pins
13.5V
Junction Temperature, TJ
150°C
Storage Temperature
-65 to 150°C
Lead Soldering Temperature, 10 seconds
300°C
Thermal Resistance Junction-to-ambient, ΘJA1
75°C/W
Note:
1. Component mounted on demo board in free air.
Recommended Operating Conditions
Parameter
Conditions
Min.
Typ.
Max.
Units
Supply Voltage VCCA
4.5
5
5.25
V
Input Logic HIGH
2.0
0.8
V
70
°C
13.2
V
V
Input Logic LOW
Ambient Operating Temperature
0
Output Driver Supply, VCCP
10.8
12
Electrical Specifications
(VCCA = 5V, VCCP = 12V, VOUT = 2.0V, and TA = +25°C using circuit in Figure 1 unless otherwise noted.)
The • denotes specifications which apply over the full operating temperature range.
Parameter
Conditions
Min.
Typ.
Max.
Units
3.5
V
VCC Regulator
Output Voltage
See Table 1
•
1.3
Output Current
18
A
Initial Voltage Setpoint
ILOAD = 0.8A,VOUT = 2.400V
VOUT = 2.000V
VOUT = 1.550V
Output Temperature Drift
TA = 0 to 70°C,VOUT = 2.000V
VOUT = 1.550V
•
•
+8
+6
mV
mV
Line Regulation
VIN = 4.75V to 5.25V
•
-4
mV/V
Internal Droop Impedance
ILOAD = 0.8A to 12.5A
2.397
2.000
1.550
13.0
Maximum Droop
2.424
2.020
1.565
14.4
2.454
2.040
1.580
15.8
60
V
V
V
KΩ
mV
Output Ripple
20MHz BW, ILOAD = 18A
Total Output Variation,
Steady State1
VOUT = 2.000V
VOUT = 1.550V3
•
•
1.940
1.480
2.070
1.590
V
Total Output Variation,
Transient2
ILOAD = 0.8A to 18A, VOUT = 2.000V
VOUT = 1.550V3
•
•
1.900
1.480
2.100
1.590
V
•
45
60
µA
Short Circuit Detect Current
11
50
mVpk
Efficiency
ILOAD = 18A, VOUT = 2.0V
85
%
Output Driver Rise & Fall Time
See Figure 3
50
nsec
Output Driver Deadtime
See Figure 3
50
nsec
REV. 1.0.0 7/13/00
3
FAN5059
PRODUCT SPECIFICATION
Electrical Specifications (Continued)
(VCCA = 5V, VCCP = 12V, VOUT = 2.0V, and TA = +25°C using circuit in Figure 1 unless otherwise noted.)
The • denotes specifications which apply over the full operating temperature range.
Parameter
Conditions
Min.
Duty Cycle
Typ.
0
Max.
Units
100
%
5V UVLO
•
3.74
4
4.26
V
12V UVLO
•
7.65
8.5
9.35
V
Soft Start Current
•
5
10
17
µA
•
1.455
1.5
1.545
V
VTT Linear Regulator
Output Voltage
ILOAD ≤ 2A
Under Voltage Trip Level
Over Current
80
%VO
VCLK Linear Regulator
Output Voltage
ILOAD ≤ 2A
Under Voltage Trip Level
Over Current
•
2.375
2.5
2.625
80
V
%VO
VAGP Linear Regulator
Output Voltage
ILOAD ≤ 2A, TYPEDET=0V
•
1.425
1.5
1.575
V
Output Voltage
ILOAD ≤ 2A, TYPEDET=OPEN
•
3.135
3.3
3.465
V
Under Voltage Trip Level
Over Current
80
%VO
Common Functions
Oscillator Frequency
PWRGD Threshold
Logic HIGH, All Outputs
Logic LOW, Any Output
Linear Regulator Under Voltage Over Current
Delay Time
•
255
•
•
88
84
310
30
345
kHz
112
116
%VOUT
µsec
Notes:
1. Steady State Voltage Regulation includes Initial Voltage Setpoint, Droop, Output Ripple and Output Temperature Drift and is
measured at the converter’s VFB sense point.
2. As measured at the converter’s VFB sense point. For motherboard applications, the PCB layout should exhibit no more than
0.5mΩ trace resistance between the converter’s output capacitors and the CPU. Remote sensing should be used for optimal
performance.
3. Using the VFB pin for remote sensing of the converter’s output at the load, the converter will be in compliance with Intel’s VRM 8.4
specification of +50, –80mV. If Intel specifications on maximum plane resistance from the converter’s output capacitors to the CPU
are met, the specification of +40, –70mV at the capacitors will also be met.
4
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Table 1. Output Voltage Programming Codes
VID4
VID3
VID2
VID1
VID0
Nominal VOUT
0
1
1
1
1
1.30V
0
1
1
1
0
1.35V
0
1
1
0
1
1.40V
0
1
1
0
0
1.45V
0
1
0
1
1
1.50V
0
1
0
1
0
1.55V
0
1
0
0
1
1.60V
0
1
0
0
0
1.65V
0
0
1
1
1
1.70V
0
0
1
1
0
1.75V
0
0
1
0
1
1.80V
0
0
1
0
0
1.85V
0
0
0
1
1
1.90V
0
0
0
1
0
1.95V
0
0
0
0
1
2.00V
0
0
0
0
0
2.05V
1
1
1
1
1
2.0V
1
1
1
1
0
2.1V
1
1
1
0
1
2.2V
1
1
1
0
0
2.3V
1
1
0
1
1
2.4V
1
1
0
1
0
2.5V
1
1
0
0
1
2.6V
1
1
0
0
0
2.7V
1
0
1
1
1
2.8V
1
0
1
1
0
2.9V
1
0
1
0
1
3.0V
1
0
1
0
0
3.1V
1
0
0
1
1
3.2V
1
0
0
1
0
3.3V
1
0
0
0
1
3.4V
1
0
0
0
0
3.5V
Note:
1. 0 = processor pin is tied to GND.
1 = processor pin is open.
REV. 1.0.0 7/13/00
5
FAN5059
PRODUCT SPECIFICATION
Typical Operating Characteristics
(VCCA = 5V, VCCP = 12V, and TA = +25°C using circuits in Figure 1, unless otherwise noted.)
Droop, VCPU = 2.0V, RD = 8K Ω
VCPU Efficiency vs. Output Current
2.04
2.03
VOUT = 2.000V
86
84
82
80
2.02
2.01
2.00
VOUT = 1.550V
VOUT (V)
Efficiency (%)
88
78
76
74
1.99
1.98
1.97
1.96
72
70
1.95
1.94
68
66
64
0
3
6
9
12
15
18
Output Current (A)
0
3
6
9
12
Output Current (A)
15
18
CPU Output Voltage vs. Output Current
3.5
3.0
VOUT (V)
2.5
2.0
1.5
1.0
0.5
0
0
5
10
15
20
25
Output Current (A)
Output Programming, VID4 = 1
2.1
3.5
1.9
3.0
1.7
2.5
VCPU(V)
VCPU(V)
Output Programming, VID4 = 0
1.5
1.3
1.5
1.1
1.0
1.30 1.40
1.50
1.60
1.70
DAC Setpoint
6
2.0
1.80
1.90
2.00
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2. 3.3 3.4 3.5
DAC Setpoint
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Typical Operating Characteristics (continued)
Transient Response, 12.5A to 0.5A
VCPU (50mV/div)
VCPU (20mV/div)
Output Ripple, 2.0V @ 18A
1.590V
1.550V
1.480V
Time (100µs/div)
Time (1µs/div)
Switching Waveforms, 18A Load
VCPU (50mV/div)
5V/div
Transient Response, 0.5A to 12.5A
HIDRV
pin
1.550V
5V/div
1.590V
LODRV
pin
1.480V
Time (1µs/div)
Time (100µs/div)
Output Startup from Enable
VCPU (1V/div)
VIN (2V/div)
VCPU (1V/div) ENABLE (2V/div)
Output Startup, System Power-up
Time (10ms/div)
REV. 1.0.0 7/13/00
Time (10ms/div)
7
FAN5059
PRODUCT SPECIFICATION
Typical Operating Characteristics (continued)
Linear Regulator Noise
AC COUPLED VOUT (10mV/div)
2.042
2.040
VCPU (V)
2.038
2.036
2.034
2.030
2.028
2.026
0
25
70
100
Time (100µs/div)
Temperature (°C)
Application Circuit
L1
(Optional)
+5V
CIN*
C1
R6
R7
R5
C2
R2
Q1
L2
1
2
3
VO
COUT*
Q2
R3
D1
3.3V IN
Q3
C10
C11
1.5V†
Q4
VID4
VID3
VID2
VID1
VID0
4
5
6
7
8
9
10
11
12
R1
24
23
22
U1
FAN5059
21
20
19
18
17
16
15
14
+12V
C5
C3
VCC
R4
PWRGD
ENABLE/SS
TYPEDET
13
C7
C8
C6
C4
Q5
3.3/1.5V
(AGP)†
2.5V†
C9
C12
* Refer to Appendix for values of CIN, COUT,
R5 and R7.
† Adjustable with an external divider.
Figure 1. Typical Application Circuit
(Worst Case Analyzed! See Appendix for Details)
8
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Table 2. FAN5059 Application Bill of Materials
(Components based on Worst Case Analysis—See Appendix for Details)
Reference
Manufacturer Part #
Quantity
Description
Requirements/Comments
C1
AVX
TAJB475M010R5
1
4.7µF, 10V Capacitor
C2, C5
Panasonic
ECU-V1C105ZFX
2
1µF, 16V Capacitor
C3-4,C6
Panasonic
ECU-V1H104ZFX
3
100nF, 50V Capacitor
C7-9
Sanyo
6MV1000FA
3
1000µF, 6.3V Electrolytic
C10-12
Any
3
22µF, 6.3V Capacitor
Low ESR
CIN
Sanyo
10MV1200GX
*
1200µF, 10V Electrolytic
IRMS = 2A
COUT
Sanyo
6MV1500GX
*
1500µF, 6.3V Electrolytic
ESR ≤ 44mΩ
D1
Motorola
MBRD835L
1
8A Schottky Diode
L1
Any
Optional
2.5µH, 8A Inductor
DCR ~ 10mΩ
See Note 1.
L2
Any
1
1.3µH, 20A Inductor
DCR ~ 2mΩ
Q1
Fairchild
FDB6030L
1
N-Channel MOSFET
RDS(ON) = 20mΩ @
VGS = 4.5V See Note 2.
Q2
Fairchild
FDB7030BL
1
N-Channel MOSFET
RDS(ON) = 10mΩ @
VGS = 4.5V See Note 2.
Q3-5
Fairchild
FDB4030L
3
N-Channel MOSFET
R1
Any
1
33Ω
R2-3
Any
2
4.7Ω
R4
Any
1
10KΩ
R5
Any
1
*
R6
Any
1
10Ω
R7
Any
1
*
U1
Fairchild
FAN5059M
1
DC/DC Controller
Notes:
1. Inductor L1 is recommended to isolate the 5V input supply from noise generated by the MOSFET switching, and to comply
with Intel dI/dt requirements. L1 may be omitted if desired.
2. For 17.4A designs using the TO-220 MOSFETs, heatsinks with thermal resistance ΘSA < 20°C/W should be used. For designs
using the TO-263 MOSFETs, adequate copper area should be used. For details and a spreadsheet on MOSFET selections,
refer to Applications Bulletins AB-8 and AB-15.
*Refer to Appendix for values.
REV. 1.0.0 7/13/00
9
FAN5059
PRODUCT SPECIFICATION
L1
(Optional)
+5V
CIN*
C1
R6
R7
R5
C2
R8
R2
Q1
L2
1
2
3
VO
COUT*
Q2
R3
D1
3.3V IN
Q3
C10
C11
1.5V†
Q4
VID4
VID3
VID2
VID1
VID0
4
5
6
7
8
9
10
11
12
R1
24
23
22
U1
FAN5059
21
20
19
18
17
16
15
14
+12V
C5
C3
VCC
R4
PWRGD
ENABLE/SS
TYPEDET
13
C7
C8
C6
C4
Q5
3.3/1.5V
(AGP)†
2.5V†
C12
C9
*Refer to Table 4 for values of COUT and CIN.
† Adjustable with an external divider.
Figure 2. Application Circuit for Coppermine/Camino Motherboards
(Typical Design)
10
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Table 3. FAN5059 Application Bill of Materials for Intel Coppermine/Camino Motherboards
(Typical Design)
Reference
Manufacturer Part #
C1
AVX
TAJB475M010R5
Quantity
1
4.7µF, 10V Capacitor
Description
C2, C5
Panasonic
ECU-V1C105ZFX
2
1µF, 16V Capacitor
C3-4,C6
Panasonic
ECU-V1H104ZFX
3
100nF, 50V Capacitor
C7-9
Sanyo
6MV1000FA
3
1000µF, 6.3V Electrolytic
C10-12
Any
3
22µF, 6.3V Capacitor
Low ESR
CIN
Sanyo
10MV1200GX
3
1200µF, 10V Electrolytic
IRMS = 2A
COUT
Sanyo
6MV1500GX
12
1500µF, 6.3V Electrolytic
ESR ≤ 44mΩ
D1
Motorola
MBRD835L
1
8A Schottky Diode
L1
Any
Optional
2.5µH, 5A Inductor
DCR ~ 10mΩ
See Note 1.
L2
Any
1
1.3µH, 15A Inductor
DCR ~ 3mΩ
Q1
Fairchild
FDB6030L
1
N-Channel MOSFET
RDS(ON) = 20mΩ @
VGS = 4.5V See Note 2.
Q2
Fairchild
FDB7030BL
1
N-Channel MOSFET
RDS(ON) = 10mΩ @
VGS = 4.5V See Note 2.
Q3-5
Fairchild
FDB4030L
3
N-Channel MOSFET
R1
Any
1
33Ω
R2-3
Any
2
4.7Ω
R4
Any
1
10KΩ
R5, R7
Any
2
6.24KΩ
R6
Any
1
10Ω
R8
N/A
1
3.0mΩ
U1
Fairchild
FAN5059M
1
DC/DC Controller
Requirements/Comments
PCB Trace Resistor
Notes:
1. Inductor L1 is recommended to isolate the 5V input supply from noise generated by the MOSFET switching, and to comply
with Intel dI/dt requirements. L1 may be omitted if desired.
2. For 12.5A designs using the TO-220 MOSFETs, heatsinks with thermal resistance ΘSA < 20°C/W should be used. For
designs using the TO-263 MOSFETs, adequate copper area should be used. For details and a spreadsheet on MOSFET
selections, refer to Applications Bulletins AB-8 and AB-15.
REV. 1.0.0 7/13/00
11
FAN5059
PRODUCT SPECIFICATION
Test Parameters
High Current Output Drivers
tR
tF
5V
2V
HIDRV
to SW
5V
2V
t DT
2V
tDT
2V
LODRV
Figure 3. Ouput Drive Timing Diagram
The FAN5059 contains two identical high current output drivers that utilize high speed bipolar transistors in a push-pull
configuration. The drivers’ power and ground are separated
from the chip’s power and ground for switching noise immunity. The power supply pin, VCCP, is supplied from an external 12V source through a series 33Ω resistor. The resulting
voltage is sufficient to provide the gate to source drive to the
external MOSFETs required in order to achieve a low RDS,ON.
Internal Voltage Reference
The FAN5059 is a programmable synchronous DC-DC controller IC. When designed around the appropriate external
components, the FAN5059 can be configured to deliver more
than 16A of output current, as appropriate for the Katmai and
Coppermine and other processors. The FAN5059 functions
as a fixed frequency PWM step down regulator.
The reference included in the FAN5059 is a precision bandgap voltage reference. Its internal resistors are precisely
trimmed to provide a near zero temperature coefficient (TC).
Based on the reference is the output from an integrated 5-bit
DAC. The DAC monitors the 5 voltage identification pins,
VID0-4. When the VID4 pin is at logic HIGH, the DAC
scales the reference voltage from 2.0V to 3.5V in 100mV
increments. When VID4 is pulled LOW, the DAC scales the
reference from 1.30V to 2.05V in 50mV increments. All VID
codes are available, including those below 1.80V.
Main Control Loop
Power Good (PWRGD)
Refer to the FAN5059 Block Diagram on page 1. The
FAN5059 implements “summing mode control”, which is different from both classical voltage-mode and current-mode
control. It provides superior performance to either by allowing a large converter bandwidth over a wide range of output
loads.
The FAN5059 Power Good function is designed in accordance with the Pentium II and III DC-DC converter specifications and provides a continuous voltage monitor on the
VFB pin. The circuit compares the VFB signal to the VREF
voltage and outputs an active-low interrupt signal to the CPU
should the power supply voltage deviate more than ±16% of
its nominal setpoint. Power Good outputs an open collector
high when the output voltage is within ±12% of its nominal
setpoint. The Power Good flag provides no other control
function to the FAN5059.
Application Information
The FAN5059 Controller
The control loop of the regulator contains two main sections:
the analog control block and the digital control block. The
analog section consists of signal conditioning amplifiers feeding
into a comparator which provides the input to the digital control
block. The signal conditioning section accepts input from the
DROOP (current feedback) and VFB (voltage feedback) pins
and sets up two controlling signal paths. The first, the voltage
control path, amplifies the difference between the VFB signal
and the reference voltage from the DAC and presents the
output to one of the summing amplifier inputs. The second,
current control path, takes the difference between the DROOP
and SW pins when the high-side MOSFET is on, reproducing
the voltage across the MOSFET and thus the input current; it
presents the resulting signal to another input of the summing
amplifier. These two signals are then summed together. This
output is then presented to a comparator looking at the oscillator
ramp, which provides the main PWM control signal to the
digital control block.
The digital control block takes the analog comparator input
and the main clock signal from the oscillator to provide the
appropriate pulses to the HIDRV and LODRV output pins.
These two outputs control the external power MOSFETs.
There is an additional comparator in the analog control section
whose function is to set the point at which the FAN5059 current limit comparator disables the output drive signals to the
external power MOSFETs.
12
Output Enable/Soft Start (ENABLE/SS)
The FAN5059 will accept an open collector/TTL signal for
controlling the output voltage. The low state disables the output
voltage. When disabled, the PWRGD output is in the low state.
Even if an enable is not required in the circuit, this pin should
have attached a capacitor (typically 100nF) to softstart the
switching. A larger value may occasionally be required if the
converter has a very large capacitor at its output.
Over-Voltage Protection
The FAN5059 constantly monitors the output voltage for protection against over-voltage conditions. If the voltage at the
VFB pin exceeds the selected program voltage, an over-voltage condition is assumed and the FAN5059 disables the output drive signal to the external high-side MOSFET. The DCDC converter returns to normal operation after the output
voltage returns to normal levels.
Oscillator
The FAN5059 oscillator section uses a fixed frequency of
operation of 300KHz.
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Design Considerations and Component
Selection
Additional information on design and component selection
may be found in Fairchild’s Application Note 57.
MOSFET Selection
This application requires N-channel Logic Level Enhancement
Mode Field Effect Transistors. Desired characteristics are as
follows:
• Low Static Drain-Source On-Resistance, RDS,ON < 20mΩ
(lower is better)
• Low gate drive voltage, VGS = 4.5V rated
Some margin should be maintained away from both Lmin and
Lmax. Adding margin by increasing L almost always adds
expense since all the variables are predetermined by system
performance except for CO, which must be increased to
increase L. Adding margin by decreasing L can be done by
purchasing capacitors with lower ESR. The FAN5059
provides significant cost savings for the newer CPU systems
that typically run at high supply current.
FAN5059 Short Circuit Current Characteristics
The FAN5059 protects against output short circuit on the
core supply by turning off both the high-side and low-side
MOSFETs and resetting softstart. The short circuit limit is
set with the RS resistor, as given by the formula
• Power package with low Thermal Resistance
• Drain-Source voltage rating > 15V.
RS =
The on-resistance (RDS,ON) is the primary parameter for
MOSFET selection. The on-resistance determines the power
dissipation within the MOSFET and therefore significantly
affects the efficiency of the DC-DC Converter. For details
and a spreadsheet on MOSFET selection, refer to Applications Bulletin AB-8.
Inductor Selection
Choosing the value of the inductor is a tradeoff between
allowable ripple voltage and required transient response. The
system designer can choose any value within the allowed
minimum to maximum range in order to either minimize ripple
or maximize transient performance. The first order equation
(close approximation) for minimum inductance is:
Lmin =
(Vin – Vout)
x
Vout
Vin
f
ESR
x
ISC *RDS, on
IDetect
with IDetect ≈ 50µA, ISC is the desired current limit, and
RDS,on the high-side MOSFET’s on resistance. Remember to
make the RS large enough to include the effects of initial tolerance and temperature variation on the MOSFET’s RDS,on.
Alternately, use of a sense resistor in series with the source
of the MOSFET eliminates this source of inaccuracy in the
current limit. The value of RS should be less than 8.3KΩ. If a
greater value is necessary, a lower RDS,on MOSFET should
be used instead.
As an example, Figure 4 shows the typical characteristic of
the DC-DC converter circuit with an FDB6030L high-side
MOSFET (RDS = 20mΩ maximum at 25°C * 1.25 at 75°C =
25mΩ) and a 8.2KΩ RS.
Vripple
CPU Output Voltage vs. Output Current
The first order equation for maximum allowed inductance is:
3.5
3.0
2.5
VOUT (V)
where:
Vin = Input Power Supply
Vout = Output Voltage
f = DC/DC converter switching frequency
ESR = Equivalent series resistance of all output capacitors in
parallel
Vripple = Maximum peak to peak output ripple voltage budget.
2.0
1.5
1.0
0.5
0
Lmax = 2CO
(Vin – Vout) Dm Vtb
Ipp2
where:
Co = The total output capacitance
Ipp = Maximum to minimum load transient current
Vtb = The output voltage tolerance budget allocated to load
transient
Dm = Maximum duty cycle for the DC/DC converter (usually
95%).
REV. 1.0.0 7/13/00
0
5
10
15
20
25
Figure 4. FAN5059 Short Circuit Characteristic
The converter exhibits a normal load regulation characteristic
until the voltage across the MOSFET exceeds the internal
short circuit threshold of 50µA * 8.2KΩ = 410mV, which
occurs at 410mV/25mΩ = 16.4A. (Note that this current limit
level can be as high as 410mV/15mΩ = 27A, if the MOSFET
has typical RDS,on rather than maximum, and is at 25°C).
13
FAN5059
At this point, the internal comparator trips and signals the controller to discharge the softstart capacitor. This causes a drastic
reduction in the output voltage as the load regulation collapses
into the short circuit control mode. With a 40mΩ output short,
the voltage is reduced to 16.4A * 40mΩ = 650mV. The output
voltage does not return to its nominal value until the output
current is reduced to a value within the safe operating ranges
for the DC-DC converter.
If any of the linear regulator outputs are loaded heavily
enough that their output voltage drops below 80% of nominal
for >30µsec, all FAN5059 outputs, including the switcher, are
shut off and remain off until power is recycled.
PRODUCT SPECIFICATION
It is necessary to have some low ESR aluminum electrolytic
capacitors at the input to the converter. These capacitors
deliver current when the high side MOSFET switches on.
Figure 5 shows 3 x 1000µF, but the exact number required
will vary with the speed and type of the processor. For the
top speed Katmai and Coppermine, the capacitors should be
rated to take 9A and 6A of ripple current respectively.
Capacitor ripple current rating is a function of temperature,
and so the manufacturer should be contacted to find out the
ripple current rating at the expected operational temperature.
For details on the design of an input filter, refer to Applications Bulletin AB-15.
2.5µH
Schottky Diode Selection
The application circuit of Figure 1 shows a Schottky diode,
D1, which is used as a free-wheeling diode to assure that the
body-diode in Q2 does not conduct when the upper MOSFET
is turning off and the lower MOSFET is turning on. It is
undesirable for this diode to conduct because its high forward
voltage drop and long reverse recovery time degrades efficiency,
and so the Schottky provides a shunt path for the current.
Since this time duration is very short, the selection criterion
for the diode is that the forward voltage of the Schottky at
the output current should be less than the forward voltage of
the MOSFET’s body diode.
Output Filter Capacitors
The output bulk capacitors of a converter help determine its
output ripple voltage and its transient response. It has already
been seen in the section on selecting an inductor that the ESR
helps set the minimum inductance, and the capacitance value
helps set the maximum inductance. For most converters,
however, the number of capacitors required is determined by
the transient response and the output ripple voltage, and these
are determined by the ESR and not the capacitance value.
That is, in order to achieve the necessary ESR to meet the
transient and ripple requirements, the capacitance value
required is already very large.
The most commonly used choice for output bulk capacitors is
aluminum electrolytics, because of their low cost and low ESR.
The only type of aluminum capacitor used should be those that
have an ESR rated at 100kHz. Consult Application Bulletin
AB-14 for detailed information on output capacitor selection.
Vin
5V
1000µF, 10V
Electrolytic
0.1µF
Figure 5. Input Filter
Programmable Active Droop™
The FAN5059 includes Programmable Active Droop™: as
the output current increases, the output voltage drops, and
the amount of this drop is user adjustable. This is done in
order to allow maximum headroom for transient response of
the converter. The current is typically sensed by measuring
the voltage across the RDS,on of the high-side MOSFET during its on time, as shown in Figure 1.
To program the amount of droop, use the formula
RD
14.4KΩ *Imax *Rsense
VDroop *18
where Imax is the current at which the droop occurs, and Rsense
is the resistance of the current sensor, either the source resistor
or the high-side MOSFET’s on-resistance. For example, to
get 30mV of droop with a maximum output current of 12.5A
and a 10mΩ sense resistor, use RD = 14.4KΩ * 12.5A * 10mΩ/
(30mV * 18) = 3.33KΩ. Further details on use of the
Programmable Active Droop™ may be found in Applications
Bulletin AB-24.
Remote Sense
The output capacitance should also include a number of
small value ceramic capacitors placed as close as possible to
the processor; 0.1µF and 0.01µF are recommended values.
Input Filter
The DC-DC converter design may include an input inductor
between the system +5V supply and the converter input as
shown in Figure 5. This inductor serves to isolate the +5V
supply from the noise in the switching portion of the DC-DC
converter, and to limit the inrush current into the input capacitors during power up. A value of 2.5µH is recommended.
14
The FAN5059 offers remote sense of the output voltage to
minimize the output capacitor requirements of the converter.
It is highly recommended that the remote sense pin, Pin 20,
be tied directly to the processor power pins, so that the
effects of power plane impedance are eliminated. Further
details on use of the remote sense feature of the FAN5059
may be found in Applications Bulletin AB-24.
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Adjusting the Linear Regulators’ Output Voltages
Any or all of the linear regulators’ outputs may be adjusted
high to compensate for voltage drop along traces, as shown
in Figure 6.
VGATE
VOUT
R
VFB
10KΩ
Figure 6. Adjusting the Output Voltage of the Linear
Regulator
The resistor value should be chosen as
R = 10KΩ*
Vout
Vnom
–1
For example, to get the VTT voltage to be 1.55V instead of
1.50V, use R = 10KΩ * [(1.55/1.50) – 1] = 333Ω.
Using the FAN5059 for Vnorthbridge = 1.8V
In some motherboards, Intel requires that the AGP power can not
be greater than 2.2V while the chipset voltage (Vnorthbridge =
1.8V) is less than 1.0V. The FAN5059 can accomplish this by
using the VTT regulator to generate Vnorthbridge. Use the circuit
in Figure 6 with R = 2KΩ. Since the linear regulators on the
FAN5059 all rise proportionally to one another, when Vnorthbridge = 1.0V, Vagp = 1.8V, meeting the Intel requirement.
• Place the 0.1µF decoupling capacitors as close to the
FAN5059 pins as possible. Extra lead length on these
reduces their ability to suppress noise.
• Each VCC and GND pin should have its own via to the
appropriate plane. This helps provide isolation between pins.
• Place the MOSFETs, inductor, and Schottky as close
together as possible for the same reasons as in the first
bullet above. Place the input bulk capacitors as close to
the drains of the high side MOSFETs as possible. In
addition, placement of a 0.1µF decoupling cap right on
the drain of each high side MOSFET helps to suppress
some of the high frequency switching noise on the input
of the DC-DC converter.
• Place the output bulk capacitors as close to the CPU as
possible to optimize their ability to supply instantaneous
current to the load in the event of a current transient.
Additional space between the output capacitors and the
CPU will allow the parasitic resistance of the board traces
to degrade the DC-DC converter’s performance under
severe load transient conditions, causing higher voltage
deviation. For more detailed information regarding
capacitor placement, refer to Application Bulletin AB-5.
• A PC Board Layout Checklist is available from Fairchild
Applications. Ask for Application Bulletin AB-11.
Additional Information
For additional information contact Fairchild Semiconductor at
http://www.fairchildsemi.com/cf/tsg.htm or contact an authorized representative in your area.
PCB Layout Guidelines
• Placement of the MOSFETs relative to the FAN5059 is
critical. Place the MOSFETs such that the trace length of
the HIDRV and LODRV pins of the FAN5059 to the FET
gates is minimized. A long lead length on these pins will
cause high amounts of ringing due to the inductance of the
trace and the gate capacitance of the FET. This noise radiates
throughout the board, and, because it is switching at such
a high voltage and frequency, it is very difficult to suppress.
• In general, all of the noisy switching lines should be kept
away from the quiet analog section of the FAN5059. That
is, traces that connect to pins 1, 2, 23, and 24 (HIDRV, SW,
LODRV and VCCP) should be kept far away from the
traces that connect to pins 3, 20 and 21.
REV. 1.0.0 7/13/00
15
FAN5059
PRODUCT SPECIFICATION
The value of R7 must be ≤ 8.3KΩ. If a greater value is calculated, RD must be reduced.
Appendix
Worst-Case Formulae for the Calculation of
Cin, Cout , R5, R7 and Roffset (Circuits similar to
Figure 1 only)
The following formulae design the FAN5059 for worst-case
operation, including initial tolerance and temperature dependence
of all of the IC parameters (initial setpoint, reference tolerance
and tempco, internal droop impedance, current sensor gain),
the initial tolerance and temperature dependence of the MOSFET,
and the ESR of the capacitors. The following information
must be provided:
Number of capacitors needed for Cout = the greater of:
ESR * IO
X =
VT-
+ VS+ – .024 * Vnom
or
VS+, the value of the positive static voltage limit;
ESR * IO
Y=
|VS-|, the absolute value of the negative static voltage limit;
14400 * IO * RD
VT+ – VS+ +
18 * R5 * 1.1
VT+, the value of the positive transient voltage limit;
|VT-|, the absolute value of the negative transient voltage limit;
Vin, the input voltage (typically 5V);
Example: Suppose that the static limits are +89mV/-79mV,
transient limits are ±134mV, current I is 14.2A, and the
nominal voltage is 2.000V, using MOSFET current sensing.
We have VS+ = 0.089, |VS-| = 0.079, VT+ = |VT-| = 0.134, IO
= 14.2, Vnom = 2.000, and ∆RD = 1.67. We calculate:
Irms, the ripple current rating of the input capacitors, per cap
(2A for the Sanyo parts shown in this datasheet);
Since Y > X, we choose Y, and round up to find we need 7
capacitors for COUT.
RD, the resistance of the current sensor (usually the MOSFET);
A detailed explanation of this calculation may be found in
Applications Bulletin AB-24.
IO, the maximum output current;
Vnom, the nominal output voltage;
∆RD, the tolerance of the current sensor (usually about 67%
for MOSFET sensing, including temperature); and
ESR, the ESR of the output capacitors, per cap (44mΩ for
the Sanyo parts shown in this datasheet).
2.000
14.2 *
5
–
2.000
2
5
= 3.47 ⇒ 4 caps
Cin =
2
IO *
Vnom
–
Vin
2
Vnom
Vin
Roffset =
0.089 – .024 * 2.000
*1000 = 20.3Ω
1.01 * 2.000
Cin =
Irms
R7 =
Roffset =
VS+ – .024 * Vnom
14.2 * 0.010 * (1 + 0.67)
= 5.25KΩ
45 * 10-6
* 1KΩ
1.01 * Vnom
R5 =
14400 * 14.2 * 0.020 * (1 + 0.67) * 1.1
= 3.48KΩ
18 * (0.089 + 0.079 – .024 * 2.000)
R7 =
IO* RD * (1 + ∆RD)
45 * 10-6
14400 * IO* RD * (1 + ∆RD) *1.1
R5 =
18 * (VS+ + VS- – .024 * Vnom)
16
X=
0.044 * 14.2
= 3.57
0.134 + 0.089 – .024 * 2.00
0.044 * 14.2
= 6.14
Y =
0.134 – 0.089 +
14400 * 14.2 * 0.020
18 * 3640 * 1.1
REV. 1.0.0 7/13/00
PRODUCT SPECIFICATION
FAN5059
Mechanical Dimensions
24 Lead SOIC
Inches
Symbol
Notes:
Millimeters
Notes
Min.
Max.
Min.
Max.
A
A1
B
C
D
.093
.004
.013
.009
.599
.104
.012
2.35
0.10
0.33
0.23
15.20
2.65
0.30
E
e
H
h
L
N
α
ccc
.290
.299
.050 BSC
.394
.419
7.36
7.60
1.27 BSC
10.00
10.65
.010
.016
0.25
0.40
.020
.013
.614
.020
.050
24
2. "D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
3. "L" is the length of terminal for soldering to a substrate.
0.51
0.32
15.60
4. Terminal numbers are shown for reference only.
5
2
2
0.51
1.27
0°
8°
0°
8°
.004
—
0.10
24
5. "C" dimension does not include solder finish thickness.
6. Symbol "N" is the maximum number of terminals.
3
6
24
—
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
13
E
1
H
12
h x 45°
D
C
A1
A
e
B
SEATING
PLANE
–C–
α
L
LEAD COPLANARITY
ccc C
REV. 1.0.0 7/13/00
17
FAN5059
PRODUCT SPECIFICATION
Ordering Information
Product Number
Package
FAN5059M
24 pin SOIC
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
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