GMM7324110CNS/SG-6/7/8 4,194,304 WORDS x 32 BIT CMOS DYNAMIC RAM MODULE Description The GMM7324110CNS/SG is a 4M x 32 bits Dynamic RAM MODULE which is assembled 8 pieces of 4M x 4bit EDO DRAMs in 24(26) pin SOJ package on single sides the printed circuit board with decoupling capacitors. The GMM7324110CNS/SG is optimized for application to the systems which are required high density and large capacity such as main memory of the computers and an image memory systems, and to the others which are requested compact size. The GMM7324110CNS/SG provides common data inputs and Extended Data Outputs. GMM7324110CNS/SG (Single Side) Features * 72 pins Single In-Line Package - GMM7324110CNS : Solder plating - GMM7324110CNSG : Gold plating * Extended Data Out (EDO) Mode Capability * Single Power Supply * Fast Access Time & Cycle Time (Unit: ns) tRAC tCAC tRC tHPC GMM7324110CNS/SG-6 60 15 104 25 GMM7324110CNS/SG-7 70 18 124 30 GMM7324110CNS/SG-8 80 20 144 35 1 * Low Power Active : 4,840/4,400/3,960 mW (MAX) Standby : 44mW (CMOS level : MAX) * RAS Only Refresh, CAS before RAS Refresh, Hidden Refresh Capability * All inputs and outputs TTL Compatible * 2048 Refresh Cycles/32ms Pin Configuration (Top View) Pin Symbol Pin Symbol Pin Symbol Pin Symbol 36 37 72 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 VSS DQ0 DQ16 DQ1 DQ17 DQ2 DQ18 DQ3 DQ19 VCC NC A0 A1 A2 A3 A4 A5 A6 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 A10 DQ4 DQ20 DQ5 DQ21 DQ6 DQ22 DQ7 DQ23 A7 NC VCC A8 A9 NC RAS2 NC NC 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 NC NC VSS CAS0 CAS2 CAS3 CAS1 RAS0 NC NC WE NC DQ8 DQ24 DQ9 DQ25 DQ10 DQ26 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 DQ11 DQ27 DQ12 DQ28 VCC DQ29 DQ13 DQ30 DQ14 DQ31 DQ15 NC PD1 PD2 PD3 PD4 NC VSS 1 GMM7324110CNS/SG Block Diagram CAS0 CAS RAS0 RAS OE M0 WE A0-A10 CAS M1 RAS OE CAS1 WE A0-A10 CAS M2 RAS OE WE A0-A10 CAS M3 RAS OE CAS2 CAS RAS2 RAS OE WE A0-A10 M4 WE A0-A10 CAS M5 RAS OE CAS3 WE A0-A10 CAS M6 RAS OE WE A0-A10 CAS M7 RAS OE WE A0-A10 I/O1 I/O2 I/O3 I/O4 DQ 0 DQ 1 DQ 2 DQ 3 I/O1 I/O2 I/O3 I/O4 DQ 4 DQ 5 DQ 6 DQ 7 I/O1 I/O2 I/O3 I/O4 DQ 8 DQ 9 DQ 10 DQ 11 I/O1 I/O2 I/O3 I/O4 DQ 12 DQ 13 DQ 14 DQ 15 I/O1 I/O2 I/O3 I/O4 DQ 16 DQ 17 DQ 18 DQ 19 I/O1 I/O2 I/O3 I/O4 DQ 20 DQ 21 DQ 22 DQ 23 I/O1 I/O2 I/O3 I/O4 DQ 24 DQ 25 DQ 26 DQ 27 I/O1 I/O2 I/O3 I/O4 DQ 28 DQ 29 DQ 30 DQ 31 WE A0-A10 VCC M0-M7 *M0-M7 : 4M x 4 EDO DRAM M0-M7 *C0-C7 : 0.22uF Capacitor C0-C7 VSS 2 GMM7324110CNS/SG Pin Description Pin A0-A10 Function Address Inputs Pin Function PD1-PD4 Presence Detect Data Input/Output VCC Power (+5V) RAS0,RAS2 Row Address Strobe VSS Ground CAS0-CAS3 Column Address Strobe NC No Connection DQ0-DQ34 WE Read/Write Enable Presence Detect Pins (Optional) Pin 60ns 70ns 80ns PD1 VSS VSS VSS PD2 NC NC NC PD3 NC VSS NC PD4 NC NC VSS Absolute Maximum Ratings* Symbol Parameter Rating Unit 0 ~ 70 C TA Ambient Temperature under Bias TSTG Storage Temperature (Plastic) -55 ~ 125 C VIN/VOUT Voltage on any Pin Relative to VSS -1.0 ~ 7.0 V VCC Power Supply Voltage -1.0 ~ 7.0 V IOUT Short Circuit Output Current 50 mA PD Power Dissipation 8 W *Note: 1. Stress greater than above “ A bsolute Maximum Ratings?may cause permanent damage to the device. Recommended DC Operating Conditions (TA = 0 ~ 70C) Symbol Parameter Min Typ Max Unit Note VCC Supply Voltage 4.5 5.0 5.5 V 1 VIH Input High Voltage 2.4 - 6.5 V 1 VIL Input Low Voltage -1.0 - 0.8 V 1 *Note: 1. All voltages referenced to VSS. 3 GMM7324110CNS/SG DC Electrical Characteristics (VCC = 5V+/-10%, TA = 0 ~ 70C) Symbol Parameter Min Max Unit VOH Output Level Output “ H ?Level Voltage (IOUT = -5mA) 2.0 VCC V VOL Output Level Output “ L ?Level Voltage (IOUT = 4.2mA) 0 0.4 V ICC1 Operating Current Average Power Supply Operating Current (RAS, CAS, Address Cycling: tRC = tRC min) 60ns - 880 70ns - 800 80ns - 720 - 16 ICC2 ICC3 ICC4 ICC5 ICC6 ICC7 II(L) IO(L) Standby Current (TTL) Power Supply Standby Current (RAS, CAS = VIH) mA 60ns - 880 70ns - 800 80ns - 720 EDO Page Mode Current Average Power Supply Current EDO Page Mode (RAS = VIL , CAS, Address cycling: tHPC = tHPC min) 60ns - 880 70ns - 800 80ns - 720 - 8 60ns - 880 70ns - 800 80ns - 720 - 40 mA Input Leakage Current Any Input (0V<=VIN<=7V) All Other Pins Not Under Test = 0V -80 80 uA Output Leakage Current (DOUT is Disabled, 0V<=VOUT<=7V) -10 10 uA CAS before RAS Refresh Current (tRC = tRC min) Standby Current RAS = VIH CAS = VIL DOUT = Enable 1, 2 mA RAS Only Refresh Current Average Power Supply Current RAS Only Mode (RAS Cycling, CAS = VIH, tRC = tRC min) Standby Current (CMOS) Power Supply Standby Current (RAS, CAS>=VCC-0.2V) Note mA 2 mA 1, 3 mA mA 1 Note: 1. ICC depends on output load condition when the device is selected. ICC(max) is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less while CAS = VIH. 4 GMM7324110CNS/SG Capacitance (VCC = 5V+/-10%, TA = 25C, f = 1MHz) Symbol Parameter Min Max Unit Note CI1 Input Capacitance (A0~A10) - 60 pF 1 CI2 Input Capacitance (WE) - 70 pF 1, 2 C13 Input Capacitance (RAS0,RAS2) - 42 pF 1, 2 C14 Input Capacitance (CAS0~CAS3) - 25 pF 1, 2 CI/O I/O Capacitance (DQ0~DQ31) - 22 pF 1, 2 Note: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. CAS = VIH to disable DOUT. AC Electrical Characteristics (VCC = 5V+/-10%, TA = 0 ~ 70C, Notes 1, 15) The GMM7324110CNS/SG writes data only in early write cycle (twcs>=twcs(min)). Delayed write cycle is not available because of I/O common. Read, Write and Refresh Cycle (Common Parameters) Symbol Parameter GMM7324110 CNS/SG-6 GMM7324110 CNS/SG-7 GMM7324110 CNS/SG-8 Min Max Min Max Min Max 104 - 124 - 144 - ns 50 - 60 - ns Unit Note tRC Random Read or Write Cycle Time tRP RAS Precharge Time 40 - tRAS RAS Pulse Width 60 10,000 70 10,000 80 10,000 ns tCAS CAS Pulse Width 10 10,000 13 10,000 15 10,000 ns tASR Row Address Setup Time 0 - 0 - 0 - ns tRAH Row Address Hold Time 10 - 10 - 10 - ns tASC Column Address Setup Time 0 - 0 - 0 - ns tCAH Column Address Hold Time 10 - 13 - 15 - ns tRCD RAS to CAS Delay Time 20 45 20 52 20 60 ns 9 tRAD RAS to Column Address Delay Time 15 30 15 35 15 40 ns 10 tRSH RAS Hold Time 15 - 18 - 20 - ns tCSH CAS Hold Time 48 - 58 - 68 - ns tCRP CAS to RAS Precharge Time 5 - 5 - 5 - ns tT Transition Time (Rise and Fall) 2 50 2 50 2 50 ns tREF Refresh Period ( 2048 Cycles ) - 32 32 - 32 ms - 8 5 GMM7324110CNS/SG Read Cycle Symbol Parameter GMM7324110 CNS/SG-6 GMM7324110 CNS/SG-7 GMM7324110 CNS/SG-8 Min Max Min Max Min Max Unit Note tRAC Access Time from RAS - 60 - 70 - 80 ns 2, 3 tCAC Access Time from CAS - 15 - 18 - 20 ns 3, 4 tAA Access Time from Column Address - 30 - 35 - 40 ns 3, 5, 14 tRCS Read Command Setup Time 0 - 0 - 0 - ns tRCH Read Command Hold Time to CAS 0 - 0 - 0 - ns 6 tRRH Read Command Hold Time to RAS 0 - 0 - 0 - ns 6 tRAL Column Address to RAS Lead Time 30 - 35 - 40 - ns tCAL Column Address to CAS Lead Time 18 - 23 - 28 - ns tOFF tOFR Output Buffer Turn-off Time - 15 - 15 - 15 ns 7 Output Buffer Turn-off Time to RAS - 15 - 15 - 15 ns 7,16 tWEZ Output Buffer Turn-off Time to WE - 15 - 15 - 15 ns 7 tOH Output Data Hold Time 3 - 3 - 3 - ns tOHR Output Data Hold Time form RAS 3 - 3 - 3 - ns tRCHR Read Command Hold Time from 60 - 70 - 80 - ns 0 - 0 - 0 - ns RAS tCLZ CAS to Output in low-Z Write Cycle Symbol 6 Parameter GMM7324110 CNS/SG-6 GMM7324110 CNS/SG-7 GMM7324110 CNS/SG-8 Min Max Min Max Min Max Unit Note tWCS Write Command Setup Time 0 - 0 - 0 - ns tWCH Write Command Hold Time 10 - 13 - 15 - ns tWP Write Command Pulse Width 10 - 10 - 10 - ns tRWL Write Command to RAS Lead Time 10 - 13 - 15 - ns tCWL Write Command to CAS Lead Time 10 - 13 - 15 - ns tDS Data-in Setup Time 0 - 0 - 0 - ns 12 tDH Data-in Hold Time 10 - 15 - 15 - ns 12 11 GMM7324110CNS/SG Refresh Cycle Symbol Parameter GMM7324110 CNS/SG-6 GMM7324110 CNS/SG-7 GMM7324110 CNS/SG-8 Min Max Min Max Min Max Unit tCSR CAS Set-up Time (CAS-before-RAS Refresh Cycle) 5 - 5 - 5 - ns tCHR CAS Hold Time (CAS-before-RAS Refresh Cycle) 10 - 10 - 10 - ns tRPC RAS Precharge to CAS Hold Time 0 - 0 - 0 - ns tWRP WE Set-up Time (CAS-before-RAS Refresh Cycle) 0 - 0 - 0 - ns tWRH WE Hold Time (CAS-before-RAS Refresh Cycle) 10 - 10 - 10 - ns Note Extended Data Out (EDO) Mode Cycle Symbol Parameter GMM7324110 CNS/SG-6 GMM7324110 CNS/SG-7 Min Max Min GMM7324110 CNS/SG-8 Max Min Unit Note Max tHPC EDO Mode Cycle Time 25 - 30 - 35 - ns tCP EDO Mode CAS Precharge Time 10 - 13 - 15 - ns tRASP EDO Mode RAS Pulse Width - 100,000 - 100,000 - 100,000 ns 13 tACP Access Time from CAS Precharge - 35 - 40 - 45 ns 3,14 tRHCP RAS Hold Time from CAS Precharge 35 - 40 - 45 - ns tRCHP Read Command Hold Time from CAS Precharge 35 - 40 - 45 - ns tDOH Output Data Hold Time from CAS Low 3 - 3 - 3 - ns 7 GMM7324110CNS/SG Notes: 1. AC measurements assume tT = 5ns. 2. Assumes that tRCD<=tRCD(max) and tRAD<=tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC exceeds the value shown. 3. Measured with a load circuit equivalent to 1TTL loads and 100pF. 4. Assumes that tRCD>=tRCD(max) and tRAD<=tRAD(max). 5. Assumes that tRCD<=tRCD(max) and tRAD>=tRAD(max). 6. Either tRCH or tRRH must be satisfied for a read cycles. 7. tOFF(max) defines the time at which the outputs achieve the open circuit condition and is not referenced to output voltage levels. 8. VIH (min) and VIL(max) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH and VIL. 9. Operation with the tRCD(max) limit insures that tRAC(max) can be met, tRCD(max) is specified as a reference point only, if tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC. 10. Operation with the tRAD(max) limit insures that tRAC(max) can be met, tRAD(max) is specified as a reference point only, if tRAD is greater than the specified tRAD(max) limit, then access time is controlled exclusively by tAA. 11. tWCS is not restrictive operating parameter. It is included in the data sheet as electrical characteristics only. If tWCS>=tWCS(min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle. 12. These parameters are referenced to CAS leading edge in early write cycles. 13. tRASP is defines RAS pulse width in EDO Mode cycles. 14. Access time is determined by the longer of tAA or tCAC or tACP. 15. An initial pause of 200us is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS clock such as RAS only refresh). If the internal refresh counter is used, a minimum of eight CAS before RAS refresh cycles are required. 16. tOFF and tOFR are determined by the later rising edge of RAS or CAS. Timing Waveforms : Please refer to attached Timing Waveform-7 8 GMM7324110CNS/SG Package Dimension Unit: mil (mm) * (1mil = 1/1000 inches) 4250(107.95) 133(3.38) 3984(101.19) 133(3.38) 1000(25.4) 2- φ 125 +3, -0 (3.175) R62(1.57) 250 (6.35) 80 (2.032) 1750(44.45) 1750(44.45) 250 (6.35) 250 (6.35) R62(1.57) 400(10.16) 100(2.54) DETAIL “ A 200(5.08) MAX DETAIL “ A 41+/-3(1.04+/-0.076) : Gold plating 36+/-3(0.914+/-0.076) : Solder plating MIN 100 (2.540) MAX 10 (0.254) 125(3.175) MIN 50 (1.27) Tolerances : +/-5 (0.127) unless otherwise specified. 16 47(1.19) MIN 54(1.37) MAX