To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. 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HB28B1700IA2/HB28B1000IA2 HB28B512IA2 IDE Card ADE-203-1370B (Z) Rev. 1.0 Dec. 25, 2002 Description HB28B1700IA2, HB28B1000IA2, HB28B512IA2 are IDE cards. These cards comply with ATA-5 specification standard, and are suitable for the usage of data storage memory medium for PC or any other electric equipment. These cards are equipped with Hitachi 512 Mega bit Flash memory. By using these cards it is possible to operate good performance for a system which has ATA interface. Features • Conform to ANSI AT Attachment-5 (ATA-5) specification standard • Card density is 1.7 Giga bytes maximum This card is equipped with Hitachi 512 Mega bit Flash memory • 5 V power supplies are used • Data write is 300,000 cycle/block • High reliability based on internal ECC (Error Correcting Code) function • Data reliability is less than 1 error in 10 bits read 14 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Card Line Up*1 4 Type No. Card density Capacity* Total sectors/ Sectors/ 3 2 card* track* Number of head Number of cylinder HB28B1700IA2 1.7 GB 1,794,465,792 byte 3,504,816 63 16 3,477 HB28B1000IA2 1.0 GB 1,025,482,752 byte 2,002,896 63 16 1,987 HB28B512IA2 512,483,328 byte 63 16 933 Notes: 1. 2. 3. 4. 512 MB 1,000,944 These data are written in ID. Total tracks = number of head × number of cylinder. Total sectors/card = sectors/track × number of head × number of cylinder. It is the logical address capacity including the area which is used for file system. Rev.1.0, Dec. 2002, page 2 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Card Pin Assignment Pin No. Signal name Pin No. Signal name Pin No. Signal name 1 GND 24 47 2 D3 25 48 3 D4 26 49 4 D5 27 A2 50 5 D6 28 A1 51 VCC 6 D7 29 A0 52 7 -CS0 30 D0 53 8 31 D1 54 9 32 D2 55 10 33 -IOIS16 56 -CSEL 11 34 GND 57 * 12 35 GND 58 -RESET 13 36 * 59 IORDY 14 37 D11 60 DMARQ 15 38 D12 61 -DMACK 16 INTRQ 39 D13 62 -DASP 17 VCC 40 D14 63 -PDIAG 18 41 D15 64 D8 19 42 -CS1 65 D9 20 43 1 * 66 D10 21 44 -IORD 67 * 22 45 -IOWR 68 GND 23 46 Note: 1 1 1 1. Host system should not connect these pin. Rev.1.0, Dec. 2002, page 3 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Card Pin Explanation Host Interface Pin Explanation Signal name Direction Pin No. Description -RESET I 58 This signal is active low host reset pin. Once the host asserts -RESET, the host must keep -RESET asserting for at least 25 µs. A2 to A0 I 27, 28, 29 Address bus of Host I/F is A2 to A0. A2 is MSB and A0 is LSB. D15 to D0 I/O 41, 40, 39 38, 37, 66 65, 64, 6 5, 4, 3 2, 32, 31 30 Data bus of Host I/F is D15 to D0. D0 is the LSB of the even byte of the word. D8 is the LSB of the odd byte of the word. -CS0 -CS1 I 7, 42 -CS1 is used for selecting the Alternate Status Register and the Device Control Register. -CS0 is used for the other task file registers. -IOWR I 45 -IOWR is used for control of write data in I/O task file area. STOP (Ultra DMA mode) -IORD This signal must be negated prior to initiation of an Ultra DMA burst. And this signal must be negated before data is transferred in an Ultra DMA burst. Assertion during an Ultra DMA burst flowing indicates the termination of the Ultra DMA burst. I 44 -IORD is used for control of read data in I/O task file area. -HDMARDY (Ultra DMA data-in) -HDMARDY is a data flow control signal. The host shall assert this signal to indicate that the host is ready to receive Ultra DMA data-in bursts. The host may negate this signal to indicate that the host pauses an Ultra DMA data-in burst. HSTROBE (Ultra DMA data-out) HSTROBE is a data strobe signal. Both the rising and falling edges of HSTROBE latch the data of D15 to D0 into this card. Stopping generating HSTROBE edges indicates that the host pauses an Ultra DMA data-out burst. -DMACK I 61 This signal is used for response to asserting DMARQ to initiate DMA transfers. -IOCS16 O 33 This output signal is asserted low when the 16-bit wide data register is addressed and the card is prepared to send or receive a 16-bit wide data. INTRQ O 16 This signal is the active high Interrupt Request to the host. DMARQ O 60 This signal is asserted high when the card is ready to DMA data transfers. -PDIAG I/O 63 -PDIAG is the Pass Diagnostic signal in Master/Slave handshake protocol. Rev.1.0, Dec. 2002, page 4 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Signal name Direction Pin No. Description IORDY O IORDY is used at PIO modes 3 and above. IORDY is negated to extend the host transfer cycle of any host register access (Read or Write) when the card is not ready to respond to a data transfer request. 59 DSTROBE (Ultra DMA data-in) DSTROBE is a data strobe signal. The host latches the data of D15 to D0 at both the rising and falling edge of DSTROBE. Stopping generating DSTROBE edges indicates that the card pauses an Ultra DMA data-in burst. -DDMARDY (Ultra DMA data-out) -DDMARDY is a data flow control signal. The card asserts this signal to indicate that the card is ready to receive Ultra DMA data-out bursts. The card negates this signal to indicate that the card pauses an Ultra DMA data-out burst. -DASP I/O 62 -DASP is the Device Active/Slave Present signal in the Master/Slave handshake protocol. -CSEL I 56 This signal is used to configure this card as a Master or a Slave. When this pin is grounded, this card is configured as a Master. When the pin is open, this card is configured as a Slave. Rev.1.0, Dec. 2002, page 5 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Card Block Diagram SDRAM (Data buffer) 16 ATA interface 16 Flash memory 16 Flash bus A Controller 16 Flash memory Flash bus B Reset IC X'tal Rev.1.0, Dec. 2002, page 6 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Card Function Explanation Register Construction • Task File region Data register Error register Feature register Sector Count register Sector Number register Cylinder Low register Cylinder High register Device Head register Status register Alternate Status register Command register Device Control register Rev.1.0, Dec. 2002, page 7 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Host Access Specifications Read I/O Function Mode -CS1 -CS0 A2 to A0 -IORD -IOWR D15 to D8 D7 to D0 Invalid mode L L × × × High-Z High-Z Standby mode H H × × × High-Z High-Z Data register H access L 0 L H odd byte even byte Alternate L status access H 6H L H × status out Other task file H access L 1-7H L H × data out -CS0 A2 to A0 -IORD -IOWR D15 to D8 D7 to D0 Invalid mode L L × × × don’t care don’t care Standby mode H H × × × don’t care don’t care Data register H access L 0 H L odd byte even byte Device control register access L H 6H H L don’t care control in Other task file H access L 1-7H H L don’t care data in Note: ×: L or H Write I/O Function Mode -CS1 Note: ×: L or H Rev.1.0, Dec. 2002, page 8 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Task File Register Specification These registers are used for reading and writing the storage data in this card. The decoded addresses are shown as follows. I/O map -CS1 -CS0 A2 A1 A0 -IORD -IOWR 0 1 0 0 0 Data register Data register 0 1 0 0 1 Error register Feature register 0 1 0 1 0 Sector count register Sector count register 0 1 0 1 1 Sector number register Sector number register 0 1 1 0 0 Cylinder low register Cylinder low register 0 1 1 0 1 Cylinder high register Cylinder high register 0 1 1 1 0 Device head register Device head register 0 1 1 1 1 Status register Command register 1 0 1 1 0 Alt. status register Device control register 1. Data register: This register is a 16-bit register that has read/write ability, and it is used for transferring 1 sector data between the card and the host. bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 D15 to D0 2. Error register: This register is a read only register, and it is used for analyzing the error content at the card accessing. This register is valid when the BSY bit in Status register and Alternate Status register are set to "0" (Ready). bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 ICRC UNC 0 IDNF 0 ABRT 0 0 bit Name Function 7 ICRC (Interface CRC error) This bit is set to one when an interface CRC error has occurred during an Ultra DMA data transfer. The content of this bit is not applicable for Multiword DMA data transfer. 6 UNC (Data ECC error) This bit is set when Uncorrectable error is occurred at reading the card. 4 IDNF (ID Not Found) The requested sector cannot be found. 2 ABRT (ABoRTed command) This bit is set if the command has been aborted because of the card status condition. (Not ready, Write fault, Invalid command, etc.) Rev.1.0, Dec. 2002, page 9 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 3. Feature register: This register is write only register, and provides information regarding features of the card which the host wishes to utilize. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Feature byte 4. Sector count register: This register contains the numbers of sectors of data requested to be transferred on a read or write operation between the host and the card. If the value of this register is zero, a count of 256 sectors is specified. This register's initial value is "01H". bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Sector count byte 5. Sector number register: This register contains the starting sector number which is started by following sector transfer command. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Sector number byte 6. Cylinder low register: This register contains the low 8-bit of the starting cylinder address which is started by following sector transfer command. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Cylinder low byte 7. Cylinder high register: This register contains the high 8-bit of the starting cylinder address which is started by following sector transfer command. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Cylinder high byte 8. Device head register: This register is used for selecting the Device number and Head number for the following command. bit7 bit6 bit5 bit4 bit3 1 LBA 1 DEV Head number Rev.1.0, Dec. 2002, page 10 of 46 bit2 bit1 bit0 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 bit Name Function 7 1 This bit is set to "1". 6 LBA LBA is a flag to select either Cylinder / Head / Sector (CHS) or Logical Block Address (LBA) mode. When LBA=0, CHS mode is selected. When LBA=1, LBA mode is selected. In LBA mode, the Logical Block Address is interrupted as follows: LBA07-LBA00: Sector number Register. LBA15-LBA08: Cylinder low Register. LBA23-LBA16: Cylinder high Register. LBA27-LBA24: Head number in Device head register. 5 1 This bit is set to "1". 4 DEV (DEVice select) This bit is used for selecting the Master (Device 0) and Slave (Device 1) in Master/Slave organization. 3 to 0 Head number This bit is used for selecting the Head number for the following command. Bit 3 is MSB. 9. Status register: This register is read only register, and it indicates the card status of command and reset execution. Other bits are invalid when BSY bit is "1". When this register is read, H_INTRQ is negated. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 BSY DRDY DWF DSC DRQ CORR IDX ERR bit Name Function 7 BSY (BuSY) This bit is set when the card internal operation is executing. When this bit is set to "1", other bits in this register are invalid. 6 DRDY (Device ReaDY) If this bit and DSC bit are set to "1", the card is capable of receiving the read or write or seek requests. 5 DWF (Device Write Fault) This bit is set if this card indicates the write fault status. 4 DSC (Device Seek Complete) This bit is set when the card seek complete. 3 DRQ (Data ReQuest) This bit is set when the information can be transferred between the host and Data register. This bit is cleared when the card receives the other command. 2 CORR (CORRected data) This bit is set when a correctable data error has been occurred and the data has been corrected. 1 IDX (InDeX) This bit is always set to "0". 0 ERR (ERRor) This bit is set when the previous command has ended in some type of error. The error information is set in Error register. This bit is cleared by the next command. Rev.1.0, Dec. 2002, page 11 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 10. Alternate status register: This register is the same as Status register physically, so the bit assignment refers to previous item of Status register. But this register is different from Status register that INTRQ is not negated when data read. 11. Command register: This register is write only register, and it is used for writing the command at executing the card operation. The command code is written in the command register, after the parameter is written in the Task File registers during the card is Ready state. 12. Device control register: This register is write only register, and it is used for controlling the card interrupt request and issuing an ATA soft reset to the card. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 × × × × × SRST nIEN 0 bit Name Function 7 to 3 × don't care 2 SRST (Software ReSeT) This bit is set to "1" in order to force the card to perform Task File Reset operation. Once the host sets SRST bit to "1", SRST bit must be kept to "1" for at least 5 µs. The card remains in Reset until this bit is reset to "0". While BSY bit is set to "1" in Status register as a result of executing either the power-on or hardware reset protocol, the host must not set SRST bit to "1" in Device Control register. 1 nIEN (Interrupt ENable) This bit is used for enabling INTRQ. When this bit is set to "0", INTRQ is enabled. When this bit is set to "1", INTRQ is disabled. 0 0 This bit is set to "0". Rev.1.0, Dec. 2002, page 12 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 ATA Command specifications This table summarizes the ATA command set with the paragraphs. Following shows the support commands and command codes which are written in command registers. ATA Command Set No. Command set Code FR SC SN CY DR HD LBA 1 CHECK POWER MODE 98h,E5h N N N N Y N N 2 EXECUTE DEVICE DIAGNOSTIC 90h N N N N N N N 3 FLUSH CACHE E7h N N N N Y N N 4 FORMAT TRACK 50h N Y Y Y Y Y Y 5 IDENTIFY DEVICE ECh N N N N Y N N 6 IDLE 97h,E3h N Y N N Y N N 7 IDLE IMMEDIATE 95h,E1h N N N N Y N N 8 INITIALIZE DEVICE PARAMETERS 91h N Y N N Y Y N 9 NOP 00h N N N N Y N N 10 READ BUFFER E4h N N N N Y N N 11 READ DMA C8h,C9h N Y Y Y Y Y Y 12 READ MULTIPLE C4h N Y Y Y Y Y Y 13 READ NATIVE MAX ADDRESS F8h N N N N Y N Y 14 READ LONG SECTOR 22h,23h N Y Y Y Y Y Y 15 READ SECTOR(S) 20h,21h N Y Y Y Y Y Y 16 READ VERIFY SECTOR(S) 40h,41h N Y Y Y Y Y Y 17 RECALIBRATE 1Xh N N N N Y N Y 18 SEEK 7Xh N N Y Y Y Y Y 19 SET FEATURES SET TRANSFER MODE EFh 03h Y N N Y N N Rev.1.0, Dec. 2002, page 13 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 No. Command set Code FR SC SN CY DR HD LBA 20 SET FEATURES SET 4BYTES APPENDED EFh BBh N N N Y N N 21 SET MAX ADDRESS F9h N Y Y Y Y Y Y 22 SET MAX SET PASSWORD F9h 01h N N N Y N N 23 SET MAX LOCK F9h 02h N N N Y N N 24 SET MAX UNLOCK F9h 03h N N N Y N N 25 SET MAX FREEZE LOCK F9h 04h N N N Y N N 26 SET MULTIPLE C6h N Y N N Y N N 27 SLEEP 99h,E6h N N N N Y N N 28 SMART ENABLE/DISABLE AUTO SAVE B0h D2h Y N Y Y N N 29 SMART ENABLE OPERATION B0h D8h N N Y Y N N 30 SMART DISABLE OPERATION B0h D9h N N Y Y N N 31 SMART RETURN STATUS B0h DAh N N Y Y N N 32 STANDBY 96h,E2h N Y N N Y N N 33 STANDBY IMMEDIATE 94h,E0h N N N N Y N N 34 WRITE BUFFER E8h N N N N Y N N 35 Write DMA CAh,CBh N Y Y Y Y Y Y 36 Write Multiple C5h N Y Y Y Y Y Y 37 Write Long Sector 32h,33h N Y Y Y Y Y Y 38 Write Same E9h Y Y Y Y Y Y Y 39 Write Sector(s) 30h,31h N Y Y Y Y Y Y 40 Write Verify 3Ch N Y Y Y Y Y Y Note: FR: Feature Register SC: Sector Count register SN: Sector Number register CY: Cylinder Low/High register DR: Device bit of Device/Head register HD: Head No.(3 to 0) of Device/Head register NH: No. of Heads LBA: Logical Block Address Y: Set up N: Not set up Rev.1.0, Dec. 2002, page 14 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 1. CHECK POWER MODE (code: E5h): This command checks the power mode. 2. EXECUTE DEVICE DIAGNOSTIC (code: 90h): This command performs the internal diagnostic tests implemented by the card. 3. FLUSH CACHE (code: E7h): This command is used by the host request the card to flush the write cache. 4. FORMAT TRACK (code: 50h): This command writes the desired head and cylinder of the selected drive. But selected sector data is not exchange. This controller excepts a sector buffer of data from the host to follow the command with same protocol as the WRITE SECTOR command. 5. IDENTIFY DEVICE (code: ECh): The IDENTIFY DEVICE command enables the host to receive parameter information from the card. Rev.1.0, Dec. 2002, page 15 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Identify Device Information Word bit 0 Description Default value F / V General configuration bit-significant information 15 0 = ATA device 14-8 Retired 0040h F 7 1 = removable media device 6 1 = not removable controller and/or device 5-3 Retired 2 1 = Response incomplete V 1 Retired F 0 Reserved 1 Default number of logical cylinders xxxxh V 2 Specific configuration 0000h V 3 Default number of logical heads xxxxh F 4-5 Retired 0000h F 6 Default number of logical sectors per logical track xxxxh F TM 7-8 Reserved for assignment by CompactFlash 0000h V 9 Retired 0000h F 10-19 Serial Number xxxxh F 20-21 Retired 0000h F 22 Number of vendor specific bytes available on READ/WRITE LONG 0004h commands F 23-26 Firmware revision (8 ASCII characters) xxxxh F 27-46 Model Number (40 ASCII characters) xxxxh F 47 READ/WRITE Multiple support 8010h X 48 Association 15-8 80h 7-0 Maximum number of sectors that shall be transferred per interrupt on READ/WRITE MULTIPLE commands Reserved Rev.1.0, Dec. 2002, page 16 of 46 F 0000h R HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word bit 49 Description Default value F / V Capabilities 15-14 Reserved 13 1 = Standby timer values as specified in this standard are supported 0 = Standby timer values shall be managed by the device F 12 Reserved R 11 1 = device supports IORDY operation F 10 1 = device supports the disabling IORDY 9 1 8 1 7-0 Retired 50 2F00h R R X Capabilities 15 0 14 1 13-1 Reserved 0 Shall be set to one to indicate a device specific Standby timer value minimum 51 4000h F 0200h F PIO data transfer mode number 15-8 00h = PIO mode-0 is supported 01h = PIO mode-1 is supported 02h = PIO mode-2 is supported 7-0 Obsolete 52 Obsolete 53 Field validity 15-3 Reserved 2 1 = Word88 is valid 1 1 = Words 64 through 70 are valid 0 1 = Words 54 through 58 are valid X 0000h R 0007h R F V 54 Number of current logical cylinders xxxxh V 55 Number of current logical heads xxxxh V 56 Number of current logical sectors per track xxxxh V 57-58 Current capacity in sectors xxxxh V 59 Multiple sector setting 0110h R 15-9 Reserved 8 1 = Multiple sector setting is valid 7-0 xxh = Current setting for number of sectors that shall be transferred per interrupt on Read/Write Multiple command V Rev.1.0, Dec. 2002, page 17 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word Description Default value F / V 60-61 bit Total number of user addressable sectors (LBA mode only) xxxxh F 62 obsolete 0000h F 63 Multiword DMA transfer 0007h R 15-11 Reserved 10 1 = Multiword DMA mode-2 is selected 9 1 = Multiword DMA mode-1 is selected 8 1 = Multiword DMA mode-0 is selected 7-3 Reserved R 2 1 = Multiword DMA mode-2 and below are supported F 1 1 = Multiword DMA mode-1 and below are supported 0 64 V 1 = Multiword DMA mode-0 is supported Advanced PIO transfer modes supported 15-2 Reserved 1 1 = PIO mode-4 is supported 0 1 = PIO mode-3 is supported 0003h R F 65 Minimum Multiword DMA transfer cycle time per word 0078h F 66 Manufacturer’s recommended Multiword DMA transfer cycle time 0078h F 67 Minimum PIO transfer cycle time without flow control 0078h F 68 Minimum PIO transfer cycle time with IORDY flow control 0078h F 69-79 Reserved 0000h R 80 Major version number 0030h F 81 Reserved 0000h F Rev.1.0, Dec. 2002, page 18 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word bit 82 15 Obsolete 14 1 = NOP command supported 13 1 = READ BUFFER command supported 12 1 = WRITE BUFFER command supported 11 Obsolete 10 1 = Host Protect Area feature set supported 9-5 Reserved 4 0 3 1 = Power Management feature set supported 2-1 Reserved 0 1 = SMART feature set supported 83 84 Description Default value F / V Command sets supported 7409h F 4100h F 4000h F Command sets supported 15 0 14 1 13-9 Reserved 8 1 = SET MAX security extension supported 7-0 Reserved 15 0 14 1 13-0 Reserved Rev.1.0, Dec. 2002, page 19 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word bit 85 Description Default value F / V Command set/feature enabled 15 Obsolete 14 1 = NOP command enabled 13 1 = READ BUFFER command enabled 12 1 = WRITE BUFFER command enabled 11 Obsolete 10 1 = Host Protect Area feature set enabled 9-5 Reserved 4 0 3 1 = Power Management feature set enabled 2-1 Reserved 0 1 = SMART feature set enabled 86 7408h V 0000h V 4000h V 101Fh R Command set/feature enabled 15-9 Reserved 8 1 = SET MAX security extension enabled by SET MAX SET PASSWORD 7-0 Reserved 87 Command set/feature default 15 0 14 1 13-0 88 Reserved Ultra DMA mode 15-13 Reserved 12 1 = Ultra DMA mode-4 is selected 11 1 = Ultra DMA mode-3 is selected 10 1 = Ultra DMA mode-2 is selected 9 1 = Ultra DMA mode-1 is selected 8 1 = Ultra DMA mode-0 is selected 7-5 Reserved R 4 1= Ultra DMA mode-4 and below are supported F 3 1= Ultra DMA mode-3 and below are supported 2 1= Ultra DMA mode-2 and below are supported 1 1= Ultra DMA mode-1 and below are supported 0 1= Ultra DMA mode-0 is supported Rev.1.0, Dec. 2002, page 20 of 46 V HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word Description Default value F / V 89-92 Reserved 0000h R 93 Hardware Reset result xxxxh V 0000h R 94-128 bit 15 0 14 1 13 1 = device detected CBLID_N above VIH 0 = device detected CBLID_N below VIL 12 Reserved 11 0 = Device 1 did not assert H_PDIAG_N 1 = Device 1 asserted H_PDIAG_N 10-9 These bit indicate how Device1 determined the device number 00 = Reserved 01 = a jumper was used 10 = H_CSEL_N signal was used 11 = some other method was used or the method is unknown 8 1 7 Reserved 6 0 = Device 0 does not respond when Device 1 is selected 1 = Device 0 responds when Device 1 is selected 5 0 = Device 0 did not detect the assertion of H_DASP_N 1 = Device 0 detected the assertion of H_DASP_N 4 0 = Device 0 did not detect the assertion of H_PDIAG-_N 1 = Device 0 detected the assertion of H_PDIAG_N 3 0 = Device 0 failed diagnostics 1 = Device 0 passed diagnostics 2-1 These bit indicate how Device 0 determined the device number. 00= Reserved 01 = a jumper was used 10 = H_CSEL_N signal was used 11 = some other method was used or the method was unknown 0 1 Reserved Rev.1.0, Dec. 2002, page 21 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Word Description Default value F / V 129-159 Vendor Specific 0000h X 160-254 Reserved 0000h R 255 Integrity word xxA5h Note: bit 15-8 Checksum V 7-0 Signature F 1. F: the content of the word is fixed and does not change. V: the content of the word is variable and may change depending on the state of the device or the commands executed by the device. X: the content of the word is Vendor Specific R: the content of the word is reserved and set to zero 6. IDLE (code: 97h or E3h): This command allows the host to place the card in the Idle mode and also set the Standby timer. H_INTRQ_P may be asserted even through the card may not have fully transitioned to Idle mode. If the Sector Count register is non-zero then the Standby timer shall be enabled. The value in the Sector Count register shall be used to determine the time programmed into the Standby timer. If the Sector Count register is zero then the Standby timer is disabled. Automatic Standby timer periods Sector Count register contents Corresponding timeout period 0 (00h) Timeout disabled 1-240 (01h-F0h) (Value × 5)s 241-251 (F1h-FBh) ((Value − 240) × 30) min 252 (FCh) 21 min 253 (FDh) Period between 8 and 12 hrs 254 (FEh) Reserved 255 (FFh) 21 min 15s Note: 1. Times are approximate. 7. IDLE IMMEDIATE (code: 95h or E1h): This command causes the card to set BSY, enter the Idle (Read) mode, clear BSY and generate an interrupt. 8. INITIALIZE DEVICE PARAMETERS (code: 91h): This command enables the host to set the number of sectors per track and the number of heads per cylinder. 9. NOP (code: 00h): If this command is issued, the card respond with command aborted. 10. READ BUFFER(code: E4h): This command enables the host to read the current contents of the card's sector buffer. 11. READ DMA (code: C8h,C9h): This command reads from 1 to 256 sectors as specified in the Sector Count register using the DMA data transfer protocol. A sector count of 0 requests 256 sectors. The transfer begins at the sector specified in the Sector Number register. Rev.1.0, Dec. 2002, page 22 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 12. READ MULTIPLE (code: C4h): This command performs similarly to the READ SECTORS command. Interrupts are not generated on each sector, but on the transfer of a block which contains the number of sectors defined by a Set Multiple command. 13. READ NATIVE MAX ADDRESS (code: F8h): This command returns the native maximum address. 14. READ LONG SECTOR (code: 22h,23h): This command is provided for compatibility purposes and nearly performs one sector READ SECTOR command except that it transfers the data and 4 bytes appended to the sector. These appended 4 bytes are all 0 data. 15. READ SECTOR(S) (code: 20h, or 21h): This command reads from 1 to 256 sectors as specified in the Sector Count register. A sector count of 0 requests 256 sectors. The transfer begins at the sector specified in the Sector Number register. 16. READ VERIFY SECTOR(S) (code: 40h or 41h): This command is identical to the READ SECTORS command, except that DRQ is never set and no data is transferred to the host . 17. RECALIBRATE (code: 1Xh): This command return value is select address mode by the host request. Return address mode status Request Addressing Sector Number Reg. CHS 0x01h LBA 0x00h 18. SEEK (code: 7Xh): This command perform a range check. 19. SET FEATURES SET TRANSFER MODE (code: EFh): This command is a host can choose the transfer mechanism by Set Transfer Mode. 20. SET FEATURES SET 4BYTES APPENDED ( code: EFh): This command allows the host to set the 4 byte data appended to the data transfer on Read Long and Write Long commands. 21. SET MAX ADDRESS (code: F9h): This command allows the host to redefine the maximum address of the user-accessible address space. 22. SET MAX SET PASSWORD ( code: F9h): This command requests a transfer of a single sector of data from the host. Password data table defines the content of this sector of information. The password is retained by the card until the next power cycle. When the card accepts this command the card is in Set Max Unlocked state. Rev.1.0, Dec. 2002, page 23 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 SET MAX SET PASSWORD content Word Content 0 Reserved 1-16 Password (32 bytes) 17-255 Reserved 23. SET MAX LOCK ( code: F9h): This command sets the card into Set Max Locked state. After this command is completed any other Set Max commands except Set Max Unlock and Set Max Freeze Lock are rejected. The card remains in this state until a power cycle or the acceptance of a Set Max Unlock or Set Max Freeze Lock command. 24. SET MAX UNLOCK (code: F9h): This command requests a transfer of a single sector of data from the host. Password data Table defines the content of this sector of information. The password supplied in the sector of data transferred shall be compared with the stored SET MAX password. If the password compare fails, then the card returns command aborted and decrements the unlock counter. On the acceptance of the Set Max Lock command, this counter is set to a value of five and shall be decremented for each password mismatch when Set Max Unlock is issued and the card is locked. When this counter reaches zero, then the Set Max Unlock command shall return command aborted until a power-cycle. If the password compare matches, then the card shall make a transition to the Set Max Unlocked state and all SET MAX commands shall be accepted. SET MAX SET PASSWORD content Word Content 0 Reserved 1-16 Password (32 bytes) 17-255 Reserved 25. SET MAX FREEZE LOCK (code: F9h): The Set Max Freeze Lock command sets the card to Set Max Frozen state. After command completion any subsequent Set Max commands are rejected. Commands disabled by Set Max Freeze Lock Set Max Address Set Max Set Password Set Max Lock Set Max Unlock Rev.1.0, Dec. 2002, page 24 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 26. SET MULTIPLE MODE (code: C6h): This command enables the card to perform READ and Write Multiple operations and establishes the block count for these commands. 27. SLEEP ( code: 99h or E6h ): This command causes the card to set BSY, enter the Sleep mode, clear BSY and generate an interrupt. 28. SMART ENABLE/DISABLE AUTO SAVE (code: B0h): This command enables and disables the optional attribute auto save feature of the card. 29. SMART ENABLE OPERATIONS (code: B0h): This command enables access to all SMART capabilities within the card. 30. SMART DISABLE OPERATIONS (code: B0h): This command disables all SMART capabilities within the card. 31. SMART RETURN STATUS (code: B0h): This command causes the card return the reliability status of the card to the host. 32. STANDBY (code: 96h or E2h): This command causes the card to set BSY, enter the Sleep mode (which corresponds to the ATA "Standby" Mode), clear BSY and return the interrupt immediately. 33. STANDBY IMMEDIATE (code: 94h or E0h): This command causes the card to set BSY, enter the Sleep mode (which corresponds to the ATA "Standby" Mode), clear BSY and return the interrupt immediately. 34. WRITE BUFFER (code: E8h): This command enables the host to overwrite contents of the card's sector buffer with any data pattern desired. 35. WRITE DMA (code: CAh or CBh): This command writes from 1 to 256 sectors as specified in the Sector Count register using the DMA data transfer protocol. A sector count of 0 requests 256 sectors. The transfer begins at the sector specified in the Sector Number register. 36. WRITE MULTIPLE (code: C5h): This command is similar to the WRITE SECTORS command. Interrupts are not presented on each sector, but on the transfer of a block which contains the number of sectors defined by Set Multiple command. 37. WRITE LONG SECTOR (code: 32h or 33h): This command is provided for compatibility purposes and nearly performs one sector WRITE SECTOR command except that it transfers the data and 4 bytes appended to the sector. These appended 4 bytes are not written on the flash memories. 38. WRITE SAME (code: E9h): This command nearly performs one sector WRITE SECTOR command except that only one sector of data transferred. The Sector Counter Register value means one sector data write counts. (ex: value is 5 to nearly fifth one sector write execute.) 39. WRITE SECTOR(S) (code: 30h or 31h): This command writes from 1 to 256 sectors as specified in the Sector Count register. A sector count of zero requests 256 sectors. The transfer begins at the sector specified in the Sector Number register. Rev.1.0, Dec. 2002, page 25 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 40. WRITE VERIFY (code: 3Ch): This command is similar to the WRITE SECTOR(S) command, except that each sector is verified before the command is completed. Rev.1.0, Dec. 2002, page 26 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Absolute Maximum Ratings Parameter Symbol Value Unit Notes All input/output voltages Vin, Vout –0.3 to VCC + 0.3 V 1 VCC voltage VCC –0.3 to +6.7 V Operating temperature range Topr 0 to +70 °C Storage temperature range Tstg –20 to +75 °C Notes: 1. Vin, Vout min = –2.0 V for pulse width ≤ 20 ns. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating temperature Ta 0 25 70 °C VCC voltage VCC 4.5 5.0 5.5 V Capacitance (Ta = 25°C, f = 1 MHz) Parameter Symbol Min Typ Max Unit Test conditions Note Input capacitance Cin — — 25 pF Vin = 0 V 1 Output capacitance Cout — — 25 pF Vout = 0 V 1 Note: 1. This parameter is sampled and not 100% tested. Rev.1.0, Dec. 2002, page 27 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 DC Characteristics-1 (Ta = 0 to +70°C, VCC = 5 V ± 10%) Parameter Min Typ Max Unit Test conditions Note Output leakage current ILO — — 1 µA Vout = high impedance 1 Pull-up current –IPE 40 100 240 µA Vin = GND Output voltage VOL — — 0.5 V IOL = 4 mA 2 VOH 2.4 — — V IOH = –400 µA 2 Input voltage VIL — — 0.8 V VIH 2.2 — — V Note: Symbol 1. Except pulled up input pin. 2. Output voltage is measured at static status. Rev.1.0, Dec. 2002, page 28 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 DC Characteristics-2 (Ta = 0 to +70°C, VCC = 5 V ± 10%) Parameter Symbol Min Typ Max Unit Test conditions Sleep current ISL — 5 10 mA CMOS level (Host control signal = VCC − 0.2) Standby current ISB — 10 20 mA CMOS level (Host control signal = VCC − 0.2) Idle current IID — 100 150 mA CMOS level (Host control signal = VCC − 0.2) Sector read current ICCR (DC) — 170 220 mA CMOS level (Host control 1 signal = VCC − 0.2) ICCR (Peak) — 200 300 mA CMOS level (Host control 1 signal = VCC − 0.2) ICCW (DC) — 550 900 mA CMOS level (Host control 2 signal = VCC − 0.2) ICCW (Peak) — 800 1300 mA CMOS level (Host control 2 signal = VCC − 0.2) Sector write current Note Notes 1. Measured during sector read transfer. 2. Measured during sector write transfer. Rev.1.0, Dec. 2002, page 29 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 AC Characteristics (Ta = 0 to +70°C, VCC = 5 V ± 10%) Register Access AC Characteristics Parameter Symbol Mode0 Mode1 Mode2 Mode3 Mode4 Unit Cycle time (min) t0 600 383 330 180 120 ns Address valid to -IORD/-IOWR setup (min) t1 70 50 30 30 25 ns -IORD/-IOWR pulse width 8bit (min) t2 290 290 290 80 70 ns -IORD/-IOWR recovery time (min) t2i — — — 70 25 ns -IOWR data setup (min) t3 60 45 30 30 20 ns -IOWR data hold (min) t4 30 20 15 10 10 ns -IORD data setup (min) t5 50 35 20 20 20 ns -IORD data hold (min) t6 5 5 5 5 5 ns -IORD data tristate (max) t6Z 30 30 30 30 30 ns -IORD/-IOWR to address valid hold (min) t9 20 15 10 10 10 ns Read data valid to IORDY active (If IORDY initially low after tA) (min) tRD 0 0 0 0 0 ns IORDY setup time (min) tA 35 35 35 35 35 ns IORDY pulse width (max) tB 1250 1250 1250 1250 1250 ns PIO Mode Access AC Characteristics Parameter Symbol Mode0 Mode1 Mode2 Mode3 Mode4 Unit Cycle time (min) t0 600 383 240 180 120 ns Address valid to -IORD/-IOWR setup (min) t1 70 50 30 30 25 ns -IORD/-IOWR pulse width 16bit (min) t2 165 125 100 80 70 ns -IORD/-IOWR recovery time (min) t2i — — — 70 25 ns -IOWR data setup (min) t3 60 45 30 30 20 ns -IOWR data hold (min) t4 30 20 15 10 10 ns -IORD data setup (min) t5 50 35 20 20 20 ns -IORD data hold (min) t6 5 5 5 5 5 ns -IORD data tristate (max) t6Z 30 30 30 30 30 ns -IORD/-IOWR to address valid hold (min) t9 20 15 10 10 10 ns Read data valid to IORDY active (If IORDY initially low after tA) (min) tRD 0 0 0 0 0 ns IORDY setup time (min) tA 35 35 35 35 35 ns IORDY pulse width (max) tB 1250 1250 1250 1250 1250 ns Rev.1.0, Dec. 2002, page 30 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Register Access/PIO Mode Access Timing t0 ADDR valid*1 t2 t1 t9 t 2i -IORD/-IOWR D15 to D0 (Write) t3 t4 D15 to D0 (Read) tA t6 t5 t RD t 6Z IORDY tB Note: 1. ADDR valid consists of signals -CS0, -CS1 and A2 to A0. Rev.1.0, Dec. 2002, page 31 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Multiword DMA Mode Access AC Characteristics Parameter Symbol Mode0 Mode1 Mode2 Unit Cycle time (min) t0 480 150 120 ns -IORD/-IOWR asserted pulse width (min) tD 215 80 70 ns -IORD data access (max) tE 150 60 50 ns -IORD data hold (min) tF 5 5 5 ns -IORD/-IOWR data setup (min) tG 100 30 20 ns -IOWR data hold (min) tH 20 15 10 ns -DMACK to -IORD/-IOWR setup (min) tI 0 0 0 ns -IORD/-IOWR to -DMACK hold (min) tJ 20 5 5 ns -IORD negated pulse width (min) tKR 50 50 25 ns -IOWR negated pulse width (min) tKW 215 50 25 ns -IORD to DMARQ delay (max) tLR 120 40 35 ns -IOWR to DMARQ delay (max) tLW 40 40 35 ns -CS0/-CS1 valid to -IORD/-IOWR (min) tM 50 30 25 ns -CS0/-CS1 hold (min) tN 15 10 10 ns -DMACK to read data released (max) tZ 20 25 25 ns Rev.1.0, Dec. 2002, page 32 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Multiword DMA Mode Access Timing -CS0/-CS1 tM tN DMARQ t LR t LW t0 -DMACK tI tD t KR t KW tJ -IORD/-IOWR tE tZ D15 to D0 (Read) tG tF D15 to D0 (Write) tG tH Rev.1.0, Dec. 2002, page 33 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Ultra DMA Mode Access AC Characteristics Mode0 Mode1 Mode2 Mode3 Mode4 Parameter Symbol Min Max Min Max Min Max Min Max Min Max Unit Cycle time allowing for asymmetry and clock variations tCYC 112 — 73 Two cycle time allowing for clock variations t2CYC 230 — Data setup time at recipient tDS 15 Data hold time at recipient tDH 5 — 5 — 5 — 5 — 5 — ns Data valid setup at sender tDVS 70 — 48 — 30 — 20 — 6 — ns Data valid hold at sender tDVH 6 — 6 — 6 — 6 — 6 — ns tFS 0 230 0 200 0 170 0 130 0 120 ns Limited interlock time* tLI 0 150 0 150 0 150 0 100 0 100 ns Interlock time with minimum tMLI 20 — 20 — 20 — 20 — 20 — ns Unlimited interlock time tUI 0 — 0 — 0 — 0 — 0 — ns Maximum time allowed for output drivers to release tAZ — 10 — 10 — 10 — 10 — 10 ns Minimum delay time required for output tZAH 20 — 20 — 20 — 20 — 20 — ns Drivers to assert or negate tZAD 0 — 0 — 0 — 0 — 0 — ns Envelope time tENV 20 70 20 70 20 70 20 55 20 55 2 First STROBE time* 3 — — — 39 — 25 — ns 154 — 115 — 86 — 57 — ns 10 7 7 — 5 — ns — 54 — 1 ns 1 STROBE–to–DMARDY time tSR — 50 — 30 — 20 — NA* — NA* ns Ready-to-final STROBE time tRFS — 75 — 70 — 60 — 60 60 ns Minimum time to assert STOP or negate DMARQ tRP 160 — 125 — 100 — 100 — 100 — ns Setup and hold times for DMACK tACK 20 — 20 — 20 — 20 — 20 — ns 50 — 50 — 50 — 50 — 50 — ns Time from STROBE edge to negation tSS of DMARQ or assertion of STOP Note: — 1. NA = Not Available 2. When Ultra DMA data-in burst termination is occured before command completion and then the host resumes Ultra DMA data-in burst, the Fast STROBE time may be longer than tFS. 3. When Ultra DMA data-out burst termination is occurred before command completion and then the host resumes Ultra DMA data-out burst, the STOP–to–DMARDY time may be longer than tLI. 4. All timing measurement switching points (low to high and high to low) is taken at 1.5 V. Rev.1.0, Dec. 2002, page 34 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Initializing an Ultra DMA data-in Burst DMARQ t UI -DMACK t ACK t FS t ENV t ZAD STOP t ACK t FS t ENV t ZAD -HDMARDY DSTROBE t AZ t DVS t DVH D15 to D0 t ACK -CS0/-CS1 t ACK A2 to A0 Timing of Sustained Ultra DMA data-in Burst t 2CYC t CYC t CYC t 2CYC STROBE t DVH t DVS t DVH t DVS t DVH D15 to D0 Rev.1.0, Dec. 2002, page 35 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Host pausing an Ultra DMA data-in Burst DMARQ -DMACK t RP STOP t SR -HDMARDY *1 t RFS -DSTROBE D15 to D0 Note: 1. If the tSR timing is not satisfied, the host may receive zero, one, or two more data words from the card. Rev.1.0, Dec. 2002, page 36 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Card Terminating Ultra DMA data-in Burst -DMARQ t MLI -DMACK t LI t LI t ACK STOP t LI t ACK -HDMARDY t SS -DSTROBE t ZAH t AZ D15 to D0 t DS t DH CRC t ACK -CS0/-CS1 t ACK A2 to A0 Rev.1.0, Dec. 2002, page 37 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Host terminating an Ultra DMA data-in Burst DMARQ t LI t MLI t ZAH -DMACK tAZ tRP tACK STOP tACK -HDMARDY t RFS t LI t MLI -DSTROBE t DS t DH D15 to D0 CRC tACK -CS0/-CS1 tACK A2 to A0 Rev.1.0, Dec. 2002, page 38 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Initializing an Ultra DMA data-out Burst DMARQ t UI -DMACK tACK t ENV STOP t LI t UI DDMARDY t ACK HSTROBE t DS t DH D15 to D0 tACK -CS0/-CS1 tACK A2 to A0 Timing of Sustained Ultra DMA data-out Burst t 2CYC t CYC t CYC t 2CYC HSTROBE t DH t DH t DS t DH t DS D15 to D0 Rev.1.0, Dec. 2002, page 39 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Card pausing an Ultra DMA data-out Burst t RP DMARQ -DMACK STOP t SR DDMARDY * 1 t RFS HSTROBE D15 to D0 Note: 1. If the tSR timing is not satisfied, the card may receive zero, one, or two more data words from the host. Rev.1.0, Dec. 2002, page 40 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Host terminating an Ultra DMA data-out Burst tLI DMARQ t MLI -DMACK t LI tSS t ACK STOP tLI DDMARDY t ACK HSTROBE t DS D15 to D0 -CS0/-CS1 t DH CRC t ACK t ACK A2 to A0 Rev.1.0, Dec. 2002, page 41 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Timing of Card Terminating Ultra DMA data-out Burst DMARQ -DMACK t LI t MLI t ACK t LI t MLI t ACK STOP t RP -DDMARDY t RFS HSTROBE t DS D15 to D0 -CS0/-CS1 t DH CRC t ACK t ACK A2 to A0 Rev.1.0, Dec. 2002, page 42 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Attention for Card Use • In the reset or power off, all register informations are cleared. • After the card hard reset, soft reset, or power on reset, the host cannot access the card during BSY bit in Status Register is set. • The card shall not have a pull-up resistor on D7. The host shall have a 10 kΩ pull-down resistor and not a pull-up resistor on D7 to allow a host to recognize the absence of a card at power-up so that a host shall detect BSY as being cleaned when attempting to read the status register of a card that is not present. • Power off should not be done during internal operation. When power off occurred during internal operation, there is the possibility that data are lost. • All card status are cleared automatically when VCC voltage turns below about 2.5V. • Notice that the card insertion/removal should not be executed while host is kept power supply. • Before the card insertion VCC can not be supplied to the card. • We recommend that a circuit to detect the level of power supply voltage be added to the host. • When a read error occurs, rewriting of the sector is recommended. This may avoid the error. Rev.1.0, Dec. 2002, page 43 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Physical Outline As of January, 2002 Surface A 5.0 (max) Surface A 54.0 ± 0.1 85.6 ± 0.2 10.0 min 3.3 ± 0.1 Surface A 34 pin 1 pin 1.27 ± 0.1 68 pin 35 pin 1.27 ± 0.1 41.91 (Reference value) Surface B Rev.1.0, Dec. 2002, page 44 of 46 Unit: mm HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Caution for Handling Cards • Confirm the direction of insertion before inserting the card. • Be careful not to damage the connector. • To avoid damaging the card, never insert it in the wrong direction. • Do not bend the card; do not drop the card or expose the card to mechanical shock of any other kind. • Never modify or disassemble the card. • Do not expose the card to static electricity or electrical noise. • Make regular backups of the data in the card. Rev.1.0, Dec. 2002, page 45 of 46 HB28B1700IA2, HB28B1000IA2, HB28B512IA2 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 URL http://www.hitachisemiconductor.com/ For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-6538-6533/6538-8577 Fax : <65>-6538-6933/6538-3877 URL : http://semiconductor.hitachi.com.sg Hitachi Europe GmbH Electronic Components Group Dornacher Str 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://semiconductor.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-2735-9218 Fax : <852>-2730-0281 URL : http://semiconductor.hitachi.com.hk Copyright © Hitachi, Ltd., 2002. All rights reserved. Printed in Japan. Colophon 7.0 Rev.1.0, Dec. 2002, page 46 of 46