HD1875 20W Audio Power Amp www.hsin.com.sg HSiN Semiconductor Pte Ltd 1. Overview The HD1875 is a 20W mono audio power amplifier with high fidelity characterized by low harmonic distortion, high output power, few external components and it can safeguard the output against overloads, thermal runaway, short circuit and so on. Besides these above, with advanced manufacturing process, the HD1875 can be used for hi-fis, stereo recorders and other audio systems. Its features are: Output power as high as over 30W Open loop gain 90dB (Typ) Low THD: f = 1kHz P O = 20W THD = 0.015 Wide power bandwidth: Typ fP = 70 kHz Short circuit protection system Thermal shut-down system High output current: Iom= 4A (Typ) Wide supply voltage range: VCC=16~60V Built-in output protection diode Ripple rejection (94dB) FZIP5 2. Block Diagram and Pin Description 2.1 Block Diagram ５ １ ４ ２ ３ Page 1 of 5 2.2 Pin Description Pin No. 1 2 3 Symbol IN NF VEE /GND Description Pin No. Signal Input 4 Negative feedback 5 Ground Symbol OUT VCC Description Output VCC 3. Electrical Characteristics 3.1 Absolute Maximum Ratings Unless otherwise specified, T amb= 25 Parameter Symbol Supply Voltage VCC Input Voltage Vin Thermal Resistance 1 jc Thermal Resistance 2 jA Power Dissipation PD Operating Temperature T amb Storage Temperature T stg Value 60 VCC 3 73 41.6 -20 ~ 70 -65~150 Notes: With the operating temperature above 55 a load of 4 , the maximum output power into will be decreased based on the heat sink of 1 3.2 Electrical Characteristics Unless otherwise specified, T amb= 25 , VCC = Unit V V /W /W W 25V, RL = 8 /W. , AV = 26dB, f = 1kHz, P O = 20W Value Parameter Symbol Test Conditions Unit Min Typ Max Quiescent Current ICCQ Vi= 0 70 100 mA THD = 1 Output Power PO 25 W 0.015 f = 20kHz 0.05 0.4 Total Harmonic Distortion THD RL= 4 0.022 RL = 4 , f = 20kHz 0.07 0.6 1 Offset Voltage Vfs -15 15 mV 0.2 Input Bias Current IB -2 2 uA Input Offset Current Ifs -0.5 0 0.5 uA Bandwidth BW f = 20kHz 5.5 MHz Open Loop Voltage Gain AVO DC 90 dB VCC, 1kHz, 1V 52 95 Power Supply Rejection Ratio PSRR dB VEE, 1kHz, 1V 52 83 Slew Rate SR 70kHz, BW 8 V/uS Max Output Current Im Vout = VCC -10V 3 4 A RS = 600 , CCIR Equivalent Input Noise Voltage Vno 3 uV Page 2 of 5 4. Characteristics Curve Ｐｏ －－－ Ｖｃｃ Ｉｃｃ －－－ Ｖｃｃ １００ Ｒ ＝８ Ｌ ８０ ＴＨＤ＝１ ３０ Ｏｕｔｐｕｔ Ｐｏｗｅｒ Ｐｏ（Ｗ） Ｓｕｐｐｌｙ Ｃｕｒｒｅｎｔ Ｉｃｃ（ｍＡ） ３５ ６０ ４０ ２０ ２５ ２０ １５ １０ ５ ０ ０ ０ １０ ５ １５ ２０ ３０ ２５ ０ １０ ５ Ｓｕｐｐｌｙ Ｖｏｌｔａｇｅ Ｖｃｃ（Ｖ） Ｐ －－－ Ｔａｍｂ Ｄ Ｐｏｗｅｒ Ｄｉｓｓｉｐａｔｉｏｎ Ｐ （Ｗ） Ｄ ／Ｗ Ｒｔｈ ３０ ２５ ２ ２０ ５ １５ ／Ｗ Ｒｔｈ ／Ｗ Ｒｔｈ １０ ５ ０ １０ ０ ／Ｗ Ｒｔｈ ２０ ４０ ６０ ８０ ４０ ３５ ３０ Ｖｃｃ＝ ３０Ｖ ２５ ２０ Ｖｃｃ＝ １５ Ｖｃｃ＝ １０ Ｖｃｃ＝ ５ ２５Ｖ ２０Ｖ １５Ｖ ０ １００ １２０ １４０ １６０ ０ ５ Ａｍｂｉｅｎｔ Ｔｅｍｐｅｒａｔｕｒｅ Ｔａｍｂ（ １０ １５ ２０ ２５ ３０ Ｏｕｔｐｕｔ Ｐｏｗｅｒ Ｐｏ（Ｗ） Ｉｏｕｔ －－－ Ｖｏｕｔ Ｐ －－－ Ｐｏ Ｄ （ｓａｆｅ ａｒｅａ ６ ５０ ４５ Ｖｃｃ＝ ４０ ４ ３０Ｖ Ｏｕｔｐｕｔ Ｃｕｒｒｅｎｔ Ｉｏｕｔ （Ａ） Ｐｏｗｅｒ Ｄｉｓｓｉｐａｔｉｏｎ Ｐ （Ｗ） Ｄ Ｐｏｗｅｒ Ｄｉｓｓｉｐａｔｉｏｎ Ｐ （Ｗ） Ｄ ４０ １ ３０ ２５ ＲＬ＝８ ｆｏ＝１ｋＨｚ ４５ Ｉｎｆｉｎｉｔｅ Ｒｔｈ ３５ ２０ Ｐ －－－ Ｐｏ Ｄ ５０ ４５ １５ Ｓｕｐｐｌｙ Ｖｏｌｔａｇｅ Ｖｃｃ（ Ｖ） ３５ ３０ Ｖｃｃ＝ ２５ Ｖｃｃ＝ ２０ ２５Ｖ ２０Ｖ １５ １０ １５Ｖ Ｖｃｃ＝ ５ ０ ０ ５ １０ ＲＬ＝４ ｆｏ＝１ｋＨｚ １５ ２０ ２５ ２ ０ －２ －４ ３０ Ｏｕｔｐｕｔ Ｐｏｗｅｒ Ｐｏ（Ｗ） －６ －２５ －２０ －１５ －１０ －５ ０ ５ １０ １５ ２０ ２５ Ｏｕｔｐｕｔ Ｖｏｌｔａｇｅ Ｖｏｕｔ（Ｖ） Page 3 of 5 ＰＳＲＲ －－－ ｆ ＴＨＤ －－－ ｆ ０．１ ９０ Ｖ ＥＥ ６０ ５０ ４０ ３０ ２０ １０ ０ Ｒｅｆ． ＩＮＰＵＴ Ｒｓ＝０ Ｒ ＝４ Ｌ １Ｖｒｍｓ ０．０８ ０．０６ ０．０５ ０．０４ Ｒ ＝４ Ｌ ０．０３ ０．０２ Ｒ ＝８ Ｌ ０．０１ ０ ５０ １００ ２００ ５００ １ｋ ２ｋ ２０ ２５Ｖ Ｐｏ＝１０Ｗ ０．０７ ＴＨＤ（ ） ８０ ７０ Ｖｃｃ＝ ０．０９ Ｖｃｃ Ｔｏｔａｌ Ｈａｒｍｏｎｉｃ Ｄｉｓｔｏｒｔｉｏｎ Ｐｏｗｅｒ Ｓｕｐｐｌｙ Ｒｉｐｐｌｅ Ｒｅｊｅｃｔｉｏｎ ＰＳＲＲ（ｄＢ） １００ ５ｋ １０ｋ ２０ｋ ２０ Ｆｒｅｑｕｅｎｃｙ ｆ（Ｈｚ） Ｆｒｅｑｕｅｎｃｙ ｆ（Ｈｚ） ＴＨＤ －－－ Ｐｏ Ｉｂｉａｓ －－－ Ｖｃｃ １ ３００ Ｖｓ ２５Ｖ Ｔａ＝７０ Ｉｎｐｕｔ Ｂｉａｓ Ｃｕｒｒｅｎｔ Ｉｂｉａｓ（ｎＡ） ＴＨＤ（ ） Ｔｏｔａｌ Ｈａｒｍｏｎｉｃ Ｄｉｓｔｏｒｔｉｏｎ ５ｋ １０ｋ ２０ｋ ５０ １００ ２００ ５００ １ｋ ２ｋ ＲＬ＝４ ０．１ ＲＬ＝８ Ｔａ＝２５ ２５０ ２００ Ｔａ＝０ １５０ １００ ５０ ０ ０．０１ ０．１ １．０ １０ ０ １００ １０ ５ １５ ２０ ２５ Ｓｕｐｐｌｙ Ｖｏｌｔａｇｅ Ｖｃｃ（Ｖ） Ｏｕｔｐｕｔ Ｐｏｗｅｒ Ｐｏ（Ｗ） 5. Application Circuit 5. 1 OCL Way Ｖ ＣＣ ５ ２．２ｕＦ Ｖｉｎ Ｖｏｕｔ １ ４ ２ ２２ｋ １ｋ ０．２２ｕＦ １００ｕＦ ０．１ｕＦ １ ３ ２２ｕＦ １Ｍ １００ｕＦ ０．１ｕＦ Ｖ ＥＥ ２２ｋ Fig 5.1 Page 4 of 5 ４ ８ ３０ 5.2 OTL Way Ｖｃｃ ２２ｋ ５ ２２ｋ １０ｕＦ ２２ｋ １００ｕＦ ０．１ｕＦ Ｖｉｎ ２２００ｕＦ １ Ｖｏｕｔ ４ １ｕＦ １Ｍ ２ １ ３ ４ ８ １０ｕＦ ０．２２ｕＦ １０ｋ + ２００ｋ Fig 5.2 5.3 Notes (1)Be careful the arrangement of the large signal ground and the small signal ground in case of oscillation. (2) The anti-oscillation of the output ground should be as close as possible to IC pins. (3) Using large enough heat sink if necessary according to the practical situation. 6. Package Dimensions Page 5 of 5