User’s Manual
IE-703102-MC-EM1,
IE-703102-MC-EM1-A
In-circuit Emulator Optional Board
Target device
V850E/MS1TM
Document No. U13876EJ1V0UM00 (1st edition)
Date Published December 1998 N CP(K)
©
Printed in Japan
1998
1991
[MEMO]
2
V850E/MS1 is a trademark of NEC Corporation.
Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States
and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
Ethernet is a trademark of Xerox Corporation.
UNIX is a registered trademark in the United States and other countries, licensed exclusively through
X/Open Company Limited.
The information in this document is subject to change without notice.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or of others.
M7A 96. 10
3
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
Device availability
•
Ordering information
•
Product release schedule
•
Availability of related technical literature
•
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
NEC Electronics (Germany) GmbH
NEC Electronics Hong Kong Ltd.
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
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Tel: 040-2445845
Fax: 040-2444580
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
NEC Electronics Singapore Pte. Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
Spain Office
Madrid, Spain
Tel: 01-504-2787
Fax: 01-504-2860
United Square, Singapore 1130
Tel: 65-253-8311
Fax: 65-250-3583
NEC Electronics Italiana s.r.l.
NEC Electronics (Germany) GmbH
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
NEC Electronics Hong Kong Ltd.
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
Fax: 02-2719-5951
NEC do Brasil S.A.
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J98. 11
4
INTRODUCTION
Readers
This manual is intended for users who design and develop application systems
TM
using the V850E/MS1 .
Purpose
The purpose of this manual is to describe the proper operation of the IE-703102-MCEM1 and IE-703102-MC-EM1-A, and their basic specifications.
Organization
This manual is broadly divided into the following parts.
• Overview
• Name and function of components
• Cautions
How to Read This Manual
It is assumed that the reader of this manual has general knowledge of electrical
engineering, logic circuits, and microcontrollers.
The IE-703102-MC-EM1 and IE-703102-MC-EM1-A are used connected to the
IE-703102-MC in-circuit emulator.
This manual explains the basic setup
procedure and switch settings of the IE-703102-MC-EM1 and IE-703102-MCEM1-A. For the names and functions, and the connection of parts, refer to the
IE-703102-MC User’s Manual, which is a separate volume.
To understand the basic specifications and operation methods broadly
→ Read this manual in the order listed in CONTENTS.
To know the operation methods and command functions of the IE-703102-MC, IE703102-MC-EM1, and IE-703102-MC-EM1-A
→ Read the user’s manual of the debugger (separate volume) that is used.
Conventions
Note:
Footnote for item marked with Note in the text
Caution:
Information requiring particular attention
Remark:
Supplementary information
Binary … ×××× or ××××B
Numeral representations:
Decimal … ××××
Hexadecimal … ××××H
Prefixes representing the powers of 2 (address space, memory capacity):
10
K (kilo): 2 = 1024
20
M (mega): 2 = 1024
Terminology
2
The meanings of terms used in this manual are listed below.
Target device
Device that is emulated.
Target
system
The system (user-built system) to be debugged. This includes the target
program and user-configured hardware.
5
Product Names
Unless otherwise specified, the IE-703102-MC-EM1 is treated as the representative model
in this manual. When using the IE-703102-MC-EM1-A, read IE-703102-MC-EM1 as IE703102-MC-EM1-A.
For functional differences between IE-703102-MC-EM1 and IE-
703102-MC-EM1-A, refer to CHAPTER 1 OVERVIEW.
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
{ Documents related to V850E/MS1
Document Name
Document Number
V850E/MS1 User’s Manual-Hardware
U12688E
V850E/××× User’s Manual-Architecture
U12197E
µPD703100-40, 703101-33, 703102-33 Data Sheet
To be prepared
µPD703100-A40, 703101-A33, 703102-A33 Data Sheet
To be prepared
µPD70F3102-33 Data Sheet
U13844E
µPD70F3102-A33 Data Sheet
U13845E
{ Documents related to development tools (User’s Manual)
Product Name
Document Number
IE-703102-MC (In-circuit emulator)
U13875E
IE-703102-MC-EM1, IE-703102-MC-EM1-A (In-circuit emulator optional board)
CA850 (C Compiler package)
TM
Operation UNIX based
TM
U12839E
Operation Windows based
U12827E
C language
U12840E
Assembly Language
U10543E
ID850 (Integrated debugger)
Operation Windows based
U13716E
RX850 (Real-time OS)
Basics
U13430E
Technical
U13431E
Installation
U13410E
Fundamental
Under preparation
Technical
U13772E
Installation
U13774E
RX850 Pro (Real-time OS)
Note
RD850 (Task debugger)
U11158E
RD850 (Ver. 3.0) (Task debugger)
U13737E
AZ850 (System performance analyzer) Operation
U11181E
Note
6
This manual
Supports ID850 (Ver. 1.31 only)
CONTENTS
CHAPTER 1
1.1
1.2
1.3
1.4
1.5
1.6
Hardware Configuration .............................................................................................................12
Features (When Connected to IE-703102-MC)..........................................................................13
Function Specifications (When Connected to IE-703102-MC) ................................................14
System Configuration .................................................................................................................15
Contents in Carton ......................................................................................................................16
Connection between IE-703102-MC and IE-703102-MC-EM1 ..................................................17
CHAPTER 2
2.1
2.2
2.3
2.4
OVERVIEW .........................................................................................................................11
NAME AND FUNCTION OF COMPONENTS.................................................................19
Component Name and Function of IE-703102-MC-EM1 ..........................................................19
Clock Settings..............................................................................................................................21
MODE Pin Setting ........................................................................................................................22
2.3.1
MODE pin setting when emulator is used as stand-alone unit ...................................................... 22
2.3.2
MODE pin setting when emulator is used connected to target system ......................................... 22
Power Supply Settings ...............................................................................................................23
2.4.1
JP2 setting when the emulator operates as a stand-alone unit and target system power is off.... 23
2.4.2
JP2 setting when power of the target system is on ....................................................................... 23
CHAPTER 3 FACTORY SETTINGS .........................................................................................................25
CHAPTER 4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
CAUTIONS..........................................................................................................................27
VDD and HVDD of Target System ..................................................................................................27
X1 Signal ......................................................................................................................................27
Pin Termination ...........................................................................................................................28
Internal RAM and ROM ...............................................................................................................29
Port 4 to 6, A, and B ....................................................................................................................30
Bus Interface Pin .........................................................................................................................31
Emulation Memory Operation Timing Difference.....................................................................33
APPENDIX A
DIMENSIONS ....................................................................................................................35
APPENDIX B
EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION ....................41
APPENDIX C
CONNECTORS FOR TARGET CONNECTION.............................................................43
C.1
C.2
Use ................................................................................................................................................43
Cautions on Handling Connectors ............................................................................................45
APPENDIX D
MOUNTING OF PLASTIC SPACER..............................................................................47
7
LIST OF FIGURES
Figure No.
Title
Page
1-1.
System Configuration ....................................................................................................................................... 15
1-2.
Contents in Carton............................................................................................................................................ 16
1-3.
Connection between IE-703102-MC and IE-703102-MC-EM1......................................................................... 17
2-1.
IE-703102-MC-EM1.......................................................................................................................................... 19
2-2.
Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and Target System Power is Off)
.......................................................................................................................................................................... 23
2-3.
Power Supply Setting (When Power of the Target System is On).................................................................... 23
4-1.
Schematic Diagram of Power Supply Flow....................................................................................................... 27
4-2.
Diagram of X1 Signal Flow ............................................................................................................................... 28
4-3.
Circuit Diagram of CKSEL Pin .......................................................................................................................... 28
4-4.
Circuit Diagram of Port 4 to 6, A, and B ........................................................................................................... 30
C-1.
Mounting of NQPACK144SD............................................................................................................................ 43
C-2.
Mounting Device............................................................................................................................................... 44
C-3.
NQPACK100SD and Device Pin ...................................................................................................................... 44
D-1.
Mounting Method of Plastic Spacer.................................................................................................................. 47
8
LIST OF TABLES
Table No.
2-1.
Title
Page
Clock Setting (When the Emulator is Used as a Stand-Alone Unit) ................................................................. 21
2-2.
Clock Setting (When the Emulator is Used in Target System Connection)...................................................... 21
2-3.
MODE Pin Setting when Emulator is Used as Stand-Alone Unit ..................................................................... 22
2-4.
MODE Pin Setting when Emulator is Used Connected to Target System........................................................ 22
4-1.
Memory Capacity Limitation List ...................................................................................................................... 29
4-2.
Bus Interface Pin Operation List....................................................................................................................... 31
9
[MEMO]
10
CHAPTER 1
OVERVIEW
The IE-703102-MC-EM1 is an optional board for the in-circuit emulator IE-703102-MC. By connecting the IE703102-MC-EM1 to IE-703102-MC, hardware and software can be debugged efficiently in system development using
the V850E/MS1.
IE-703102-MC-EM1 is an optional board when HVDD = 5 V
IE-703102-MC-EM1-A is an optional board when HVDD = 3.3 V
In this manual, the basic setup sequences and switch settings of the IE-703102-MC-EM1 when connecting it to
the IE-703102-MC are described. For the names and functions of the parts of the IE-703102-MC, and for the
connection of elements, refer to the IE-703102-MC User’s Manual (U13875E) which is a separate volume.
11
CHAPTER 1 OVERVIEW
1.1
Hardware Configuration
Optionalsold
hardware
Separately
hardware
In-circuit emulator (IE-703102-MC)
Optional board
IE-703102-MC-EM1
IE-703102-MC-EM1-A
IE-703102-MC can be used as in-circuit emulator for V850E/MS1 by
adding these boards.
Separately sold hardware
Extension probe
Note 1
(SC-×××SDA )
General-purpose extension probe made by TOKYO ELETECH
CORPORATION.
PC interface board
IE-70000-××-IF-B
IE-70000-××-IF-C
IE-70000-PCI-IF
IE-70000-CD-IF-A
These boards are used to connect the IE-703102-MC to a personal
computer. These boards are inserted in the expansion slot of the
personal computer.
Note 2
××: 98 (for PC-9800 series C bus)
Note 2
TM
PC (for IBM PC/AT compatible ISA bus)
IE-70000-PCI-IF : for PCI bus
IE-70000-CD-IF-A : for PCMCIA socket
Network module
(IE-70000-MC-SV3)
The module is used when a workstation controls the IE-703102-MC via
ethernetTM.
Power adapter
(IE-70000-MC-PS-B)
AC adapter dedicated to the NEC’s in-circuit emulator
Notes 1. For further information, contact Daimaru Kogyo Co., Ltd.
Tokyo Electronic Components Division (TEL +81-3-3820-7112)
Osaka Electronic Components Division (TEL +81-6-244-6672)
2. These interface boards cannot be used for the PC98-NX series.
12
CHAPTER 1 OVERVIEW
1.2
Features (When Connected to IE-703102-MC)
{ Maximum operation frequency: 40 MHz (HVDD = 3.3 V or 5.0 V operation)
{ Extremely lightweight and compact
{ Higher equivalence with target device can be achieved by omitting buffer between signal cables.
{ Following pins can be masked.
RESET, NMI, WAIT, HLDRQ
{ Two methods of connection to target system:
• Direct connection of the IE-703102-MC-EM1
• Attach an extension probe (sold separetely) to the connection tab of the IE-703102-MC-EM1.
{ Dimensions of the IE-703102-MC-EM1 are as follows.
Parameter
Value
Note
0.4 W (at 40-MHz operation frequency)
Power dissipation
External dimensions
(Refer to APPENDIX A DIMENSIONS)
Weight
Height
15 mm
Length
207 mm
Width
96 mm
170 g
Note The power dissipation is 11.4 W when IE-703102-MC + IE-703102-MC-EM1.
13
CHAPTER 1 OVERVIEW
1.3
Function Specifications (When Connected to IE-703102-MC)
Parameter
Emulation memory capacity
Execution/pass detection
Coverage memory capacity
Memory access detection
Coverage memory capacity
Specification
Internal ROM
128 Kbytes
External memory
2 Mbytes
Internal ROM
128 Kbytes
External
memory
In ROM-less
mode
2 Mbytes
When using iROM
1 Mbyte
External memory
1 Mbyte
Trace memory capacity
168 bits × 32 Kframes
Time measurement function
Can be measured with time tag and timers (3
lines)
External logic probe
8-bit external trace is possible
Event setting for trace/break is possible
Break function
Event break
Step execution break
Forced break
Fail safe break
• Illegal access to peripheral I/O
• Access to guard space
• Write to the ROM space
Caution
14
Some of the functions may not be supported depending on the debugger used.
CHAPTER 1 OVERVIEW
1.4
System Configuration
The system configuration when connecting the IE-703102-MC-EM1 to the IE-703102-MC, which is then connected
to a personal computer (PC-9800 series or PC/AT compatible) is shown below.
Figure 1-1. System Configuration
<12>
<5>
<13>
<6>
<7>
[Magnified drawing: example of use of
connector for target connection]
<11>
<4>
<2>
<9>
Target
system
<10>
For PC-9800 series
<8>
<3>
<9>
<10>
For PC/AT
<1>
Target system
Remark
<1> Personal computer (PC-9800 series or PC/AT compatible)
<2> Debugger (sold separately)
<3> PC interface board (IE-70000-98-IF-B/IE-70000-98-IF-C, IE-70000-PC-IF-B/IE-70000-PC-IF-C
: sold separately )
<4> PC interface cable (included with IE-703102-MC)
<5> In-circuit emulator (IE-703102-MC: sold separately)
<6> In-circuit emulator option board (IE-703102-MC-EM1)
<7> External logic probe (included with IE-703102-MC)
<8> Extension probe (SC-144SD, SC-144SD PR: sold separately)
<9> Connector for emulator connection (YQPACK144SD: included)
<10> Connector for target connection (NQPACK144SD: included)
<11> Power adapter (IE-70000-MC-PS-B: sold separately)
<12> AC100-V power cable (sold separately: included with IE-70000-MC-PS-B)
<13> AC220-V power cable (sold separately: included with IE-70000-MC-PS-B)
15
CHAPTER 1 OVERVIEW
1.5
Contents in Carton
The carton of the IE-703102-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag.
Make sure that the accessory bag contains this manual and connector accessories. In case of missing or damaged
contents, contact an NEC sales representative or an NEC distributor.
Figure 1-2. Contents in Carton
<1> IE-703102-MC-EM1
<4> Packing list
<3> Guarantee card
<2> Accessory bag
<1> IE-703102-MC-EM1 × 1
<2> Accessory bag × 1
<3> Guarantee card × 1
<4> Packing list × 1
Make sure that the accessory bag contains this manual and an accessory list (1 sheet).
16
CHAPTER 1 OVERVIEW
1.6
Connection between IE-703102-MC and IE-703102-MC-EM1
The procedure for connecting the IE-703102-MC and IE-703102-MC-EM1 is described below.
Caution
Connect carefully so as not to break or bend connector pins.
<1> Remove the pod cover (upper and lower) of the IE-703102-MC.
<2> Set the PGA socket lever of the IE-703102-MC-EM1 to the OPEN position as shown in Figure 1-3 (b).
<3> Connect the IE-703102-MC-EM1 to the PGA socket at the back of the pod (refer to Figure 1-3 (c)). When
connecting, position the IE-703102-MC and IE-703102-MC-EM1 so that they are horizontal.
Spacers can be connected to fix the pod. (refer to APPENDIX D MOUNTING OF PLASTIC SPACER)
<4> Set the PGA socket lever of the IE-703102-MC-EM1 to the CLOSE position as shown in Figure 1-3 (b).
<5> Fix the IE-703102-MC-EM1 between the pod covers (upper and lower) with nylon rivets.
<6> Secure the pod cover (upper) end with nylon rivets.
Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (1/2)
(a) Overview
Nylon rivets
Upper cover
IE-703102-MC-EM1
Nylon rivets
IE-703102-MC
Lower cover
Nylon rivets
17
CHAPTER 1 OVERVIEW
Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (2/2)
(b) PGA Socket Lever of IE-703102-MC-EM1
CLOSE
OPEN
(c) Connecting part (IE-703102-MC-EM1)
Pin A1 location
: Insertion guide
: IE-703102-MC insertion area
18
CHAPTER 2
NAME AND FUNCTION OF COMPONENTS
This chapter describes the names, functions, and switch settings of components comprising the IE-703102-MCEM1. For the details of the pod, jumper, and switch positions, etc., refer to the IE-703102-MC User’s Manual.
2.1
Component Name and Function of IE-703102-MC-EM1
Figure 2-1. IE-703102-MC-EM1
(a) Top View
(b) Bottom View
Direction of pin 1 of the connector
for target connection
Direction of pin 1 of the connector
for target connection
Connector for target
connection
2
1
JP1
OSC
8 2
7 1
TP1
TP2
JP2
TP3
4
3
TP4
TP5
TP6
V850E/MS1
I/O chip
CKSEL (Green)
LED
PLL
SW1
DIRECT
Connector for connection
to IE-703102-MC
19
CHAPTER 2
NAME AND FUNCTION OF COMPONENTS
(1) Test pin (TP1 to TP6)
To leave the DMA cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external
logic probe.
• TP1: GND
• TP2: REFRQ
• TP3: DMAAK0
• TP4: DMAAK1
• TP5: DMAAK2
• TP6: DMAAK3
(2) SW1
This is a switch for clock mode switching (for details, refer to 2.2 Clock Settings).
(3) JP1
This is a switch jumper for the clock supply source (for details, refer to 2.2 Clock Settings).
(4) JP2
This is a switch jumper for the power supply (for details, refer to 2.4 Power Supply Settings).
(5) LED (CKSEL: Green)
LED Status
When Used as a Stand-Alone Unit
When Used in Target System Connection
ON
SW1 = DIRECT
The CKSEL signal from the target system is high
OFF
SW1 = PLL
The CKSEL signal from the target system is low
(6) Connector for IE-703102-MC connection
This is a connector for connecting the IE-703102-MC.
(7) Connector for target connection
This is a connector for connecting the target system or the extension probe.
20
CHAPTER 2
2.2
NAME AND FUNCTION OF COMPONENTS
Clock Settings
This section describes the clock settings. For JP1 and SW1, refer to Figure 2-1.
Table 2-1. Clock Setting (When the Emulator is Used as a Stand-Alone Unit)
Clock Supply Source Setting
JP1 Setting
Clock Supply Method
Internal clock
Clock Mode Setting
Note
SW1 Setting (CKSEL Setting)
PLL mode
2
8
1
7
PLL
DIRECT
Direct mode
PLL
DIRECT
Note Setting any other state is prohibited.
Table 2-2. Clock Setting (When the Emulator is Used in Target System Connection)
Clock Supply Source Setting
JP1 Setting
Clock Supply Method
Internal
clock/target
Note 2
clock
Clock Mode Setting
Note 1
SW1 Setting
(CKSEL Setting)
PLL mode
CKSEL Setting of
Target System
Low level
2
8
1
7
PLL
DIRECT
Direct mode
High level
PLL
DIRECT
Notes 1. Setting any other state is prohibited.
2. Switching the internal clock and target clock is done with the debugger.
21
CHAPTER 2
2.3
NAME AND FUNCTION OF COMPONENTS
MODE Pin Setting
The emulator operation mode can be changed with the MODE pin setting.
2.3.1 MODE pin setting when emulator is used as stand-alone unit
When the emulator is used as a stand-alone unit, MODE0 and MODE1 in the emulator are set as follows.
The setting cannot be changed.
Table 2-3. MODE Pin Setting when Emulator is Used as Stand-Alone Unit
Emulator Operation
Settings Inside Emulator
MODE0
Single-chip mode 0
Low-level input
MODE1
High-level input
2.3.2 MODE pin setting when emulator is used connected to target system
When the emulator is connected to a target system, set the MODE pins of the target system as follows based on
the emulator operations.
The MODE2 and MODE3 signals in the target system are not used in the emulator.
Table 2-4. MODE Pin Setting when Emulator is Used Connected to Target System
Emulator Operation
Target System Setting
MODE0
MODE1
ROM-less mode 0
Low-level input
Low-level input
ROM-less mode 1
High-level input
Low-level input
Single-chip mode 0
Low-level input
High-level input
Single-chip mode 1
High-level input
High-level input
22
CHAPTER 2
2.4
NAME AND FUNCTION OF COMPONENTS
Power Supply Settings
Using the JP2 setting, the IE-703102-MC-EM1 can switch between operation using the emulator as a stand-alone
unit (using the power of the emulator) and operation using the emulator connected to the target system (using the
power of the target system).
2.4.1 JP2 setting when the emulator operates as a stand-alone unit and target system power is off
The IE-703102-MS-EM1 operates using the emulator’s power supply when the emulator operates as a standalone unit and target system power is off. Depending on the product, the condition of the power is as follows.
• IE-703102-MC-EM1
: VDD = 3.3 V, HVDD = 5.0 V
• IE-703102-MC-EM1-A : VDD = 3.3 V, HVDD = 3.3V
Figure 2-2 shows the JP2 setting.
Caution
If the JP2 setting is incorrect, the emulator may be damaged.
Figure 2-2. Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and
Target System Power is Off)
JP2
2
4
1
3
Set both 1-2 and 3-4 as open
2.4.2 JP2 setting when power of the target system is on
The IE-703102-MC-EM1 operates using the target system’s power supply when the power of the target system is
on. Figure 2-3 shows the JP2 setting.
Caution
If the JP2 setting is incorrect, the emulator may be damaged.
Figure 2-3. Power Supply Setting (When Power of the Target System is On)
JP2
2
4
1
3
Set 1-2 as open and 3-4 as short
23
[MEMO]
24
CHAPTER 3 FACTORY SETTINGS
Item
Setting
Remark
JP1
2
8
1
7
JP2
2
4
1
3
SW1
All settings other than those set in the factory are
prohibited.
Setting that supplies the IE-703102-MC-EM1 with
the power of the emulator (when the emulator
operates as a stand-alone unit and target system
power is off).
Set to PLL mode.
PLL
DIRECT
Crystal oscillator
8.000-MHz crystal oscillator is mounted.
If SW1 is set to the factory setting, the CPU
operates at 40 MHz.
25
[MEMO]
26
CHAPTER 4
4.1
CAUTIONS
VDD and HVDD of Target System
(1) VDD and HVDD in the target system are used to operate the circuit in the emulator.
(2) When JP2 is set as 1-2 : open and 3-4 : short, the evaluation chip in the emulator operates on VDD and HVDD
from the target system.
(3) When JP2 is set as 1-2 : open and 3-4 : open, the emulator recognizes the target system power is off and
operates with the 3.3 V power supply.
Figure 4-1. Schematic Diagram of Power Supply Flow
Target system
IE-703102-MC-EM1
IE-703102-MC
I/O chip
Evaluation
chip
CVDD
VDD
Power supply
circuit
Relay
HVDD
JP2
JP2
4.2
2
4
2
4
1
3
1
3
X1 Signal
The input signal (X1 signal) from the target system is delayed (for tpLH = tpHL = 13.2 ns (MAX.)) because it passes
through VHC157 before it is input to the I/O chip of the emulator.
In addition, the DC characteristics change. The input voltage becomes VIH = 2.31 V (MIN.) and VIL = 0.99 V
(MAX.). The input current becomes I IN = ±1.0 µA (MAX.).
27
CHAPTER 4
CAUTIONS
Figure 4-2. Diagram of X1 Signal Flow
IE-703102-MC-EM1
Target System
X1 signal
X1 pin
4.3
VHC157
I/O chip
Pin Termination
(1) MODE0 to MODE3 pins
When the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0.
The MODE0 to MODE3 pins are connected as follows.
•
MODE0: Connected to VSS via a resistor (33 kΩ). (Pull-down)
•
MODE1: Connected to VDD via a resistor (5.1 kΩ). (Pull-up)
•
MODE2: Unconnected
•
MODE3: Unconnected
(2) RESET pin
This pin is connected to VDD via a resistor (5.1 kΩ). (Pull-up)
(3) CKSEL pin
Pull-up/pull-down switching is possible with SW1.
Figure 4-3. Circuit Diagram of CKSEL Pin
CKSEL pin
HVDD
I/O chip
100 Ω
SW1
CKSEL
33 kΩ
VHCT541
28
CHAPTER 4
4.4
CAUTIONS
Internal RAM and ROM
Because the internal RAM (iRAM) and internal ROM (iROM) capacities of the emulator are set in steps, the
memory capacity is different from that of the target device. If access is performed to addresses that exceed the
target device capacity, the memory of the emulator is accessed. Memory capacities are as follows.
Table 4-1. Memory Capacity Limitation List
(a) iRAM capacity (Unit: byte)
Target Device
Emulator
(b) iROM capacity (Unit: byte)
Target Device
Emulator
(Emulation Memory)
1K
1K
1 K to 32 K
32 K
2K
2K
33 K to 64 K
64 K
3K
3K
65 K to 128 K(V850E/MS1) 128 K
4K
129 K to 256 K
256 K
5 K to 6 K
6K
257 K to 512 K
512 KNote
7 K to 8 K
8K
9 K to 10 K
10 K
11 K to 12 K
12 K
13 K to 16 K
16 K
17 K to 20 K
20 K
21 K to 24 K
24 K
25 K to 28 K
28 K
29 K to 36 K
36 K
37 K to 44 K
44 K
45 K to 52 K
52 K
53 K to 60 K
60 K
4K
(V850E/MS1)
Note The emulator is mounted iROM
emulation memory of 512 Kbytes.
29
CHAPTER 4
4.5
CAUTIONS
Port 4 to 6, A, and B
Ports 4 to 6, A, and B are connected to VHCT541, VHC541, and VHCT00, respectively.
Figure 4-4. Circuit Diagram of Port 4 to 6, A, and B
Evaluation chip
Port
B
Port
A
Port
6
Port
5
Port
4
VHCT541
VHC541
VHCT541
VHC541
Target system
VHCT00
VHCT541
VHCT541
30
Emulation memory
(2 Mbytes)
CHAPTER 4
4.6
CAUTIONS
Bus Interface Pin
There are the following differences between the emulator and the target device in the operation of the pins for bus
interface.
Table 4-2. Bus Interface Pin Operation List (1/3)
(a) During break
Pin Name
Waiting for Emulator
Command
Internal Memory
Internal
ROM
R
Internal RAM
R
W
External Memory
Internal
Peripheral I/O
R
Emulation RAM
W
R
W
Target System
R
A0 to A23
Note
Note
Note
Note
D0 to D15
Hi-Z
Hi-Z
Note
Note
WE
H
H
H
Note
OE
H
H
H
Note
RD
H
H
H
Note
ADV/BCYST
Note
H
Note
Note
UWR/UCAS
H
H
H
Note
LWR/LCAS
H
H
H
Note
IORD
H
H
H
Note
IOWR
H
H
H
Note
CS0 to CS7
H
H
H
Note
RAS0 to RAS7
H
H
H
Note
REFRQ
H
H
H
Note
WAIT
Invalid
Note
Maskable
HLDRQ
Maskable
Maskable
Maskable
HLDAK
Note
Note
Note
Note
W
Performs the same operation as the cycle that is generated by the target device program execution.
Remarks 1.
2.
R
: Read
W
: Write
H
: High-level output
Hi-Z : High-impedance
31
CHAPTER 4
CAUTIONS
Table 4-2. Bus Interface Pin Operation List (2/3)
(b) During user program execution
Pin Name
Internal Memory
Internal ROM
F
R
Internal RAM
F
R
External Memory
Internal
Peripheral I/O
W
R
Emulation RAM
W
F
R
Target System
W
F
A0 to A23
Note
Note
Note
D0 to D15
Hi-Z
Note
Note
WE
H
H
Note
OE
H
H
Note
RD
H
H
Note
ADV/
BCYST
H
Note
Note
UWR/
UCAS
H
H
Note
LWR/
LCAS
H
H
Note
IROD
H
H
Note
IOWR
H
H
Note
CS0 to CS7
H
H
Note
RAS0 to
RAS7
H
H
Note
REFRQ
H
H
Note
WAIT
Note
Maskable
HLDRQ
Maskable
Maskable
HLDAK
Note
Note
Note
Performs the same operation as the cycle that is generated by the target device program execution.
Remarks 1.
2.
F
: Fetch
R
: Read
W
: Write
H
: High-level output
Hi-Z : High-impedance
32
R
W
CHAPTER 4
CAUTIONS
Table 4-2. Bus Interface Pin Operation List (3/3)
(c) Refresh cycle
Pin Name
Operation
A0 to A23
Note
D0 to D15
Note
WE
Note
OE
Note
RD
Note
ADV/BCYST
Note
UWR/UCAS
Note
LWR/LCAS
Note
IORD
Note
IOWR
Note
CS0 to CS7
Note
RAS0 to RAS7
Note
REFRQ
Note
WAIT
Maskable
HLDRQ
Maskable
HLDAK
Note
Note
4.7
Performs the same operation as the cycle that is generated by the target device program execution.
Emulation Memory Operation Timing Difference
When the area of the DRAM, synchronous flash memory, or page ROM in the target system has been allocated to
the emulation memory, the operation timing is the SRAM access timing.
When measuring the performance by using the emulation memory, adjust the setting so that the wait set matches
the memory access timing that is actually used.
33
[MEMO]
34
APPENDIX A
DIMENSIONS
(1) IE-703102-MC + IE-703102-MC-EM1 (Unit: mm)
461
55
240
58.8
90
166
Top View
57
Pin 1 direction
Side View
27
IE-703102-MC
IE-703102-MC-EM1
Bottom View
207
29.0
96
37.5
15.88
Top View
29.0
35
APPENDIX A DIMENSIONS
(2) SC-144SD (Unit: mm)
109
108
36
37
73
72
46
144
43
1
40
130
43
36
13
13
213
APPENDIX A DIMENSIONS
(3) NQPACK144SD (Unit: mm)
27.0
0.5 × 35 = 17.5
C1.5
[Top View]
0.5
7.0
3-R1.5
0.3
144
109
1
108
7.0
18.9
26.2
22.65
3-φ1.0
36
73
2.5
37
72
2.5
20.1
1.85
1.2
3.7
9.45
5.5
3.9
[Side View]
21.05
0.2
0.18
0.5
0.5
23.0
12.0
[Bottom View]
109
144
1
73
36
0.2
20.1
108
72
37
4-φ2.0 Height of projection 1.8
37
APPENDIX A DIMENSIONS
(4) YQPACK144SD (Unit: mm)
22.65
0.5 × 35 = 17.5
C2.0
0.5
[Top View]
4-φ2.2
7.0
144
109
108
1
7.0
19.4
27.0
29.0
23.6
21.2
18.8
16.4
3-φ1.0
36
73
37
3-R2.5
72
0.25 × 0.3
0.3
2.3
2.2
3.9
7.4
3.1
9.0
1.2
3.7
2.5
[Side View]
4-R1.5
0.25
109
[Bottom View]
22.8
19.6
C1.5
144
108
20.8
1
73
36
37
0.2
72
38
APPENDIX A DIMENSIONS
(5) HQPACK144SD (Unit: mm)
22.65
±0.15
0.5 × 35 = 17.5
[Top View]
7.0
C2.0
±0.1
4-φ2.2
±0.1
109
3.95
2.75
144
1
108
7.0
19.4
27.0
29.0
18.4
23.9
16.0
3-φ1.0
73
3.95
2.75
36
37
72
4-R1.5
1.2
3-R2.5
2.3
7.4
1.6
3.9
2.25
3.1
[Side View]
0.25
[Bottom View]
109
22.8
19.6
C1.5
144
108
21.4
±0.2
1
36
72
37
0.2
73
39
[MEMO]
40
APPENDIX B
EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION
(1) When directly connecting device to target system (Connector for target connection is not used)
Device
Target system
(2) When equipping device by using connector for target connection
Fastening screws
HQPACK144SD
Device
NQPACK144SD
Target system
(3) Connection between emulator and target system
(a) When extension probe is not used
Note
YQPACK144SD
NQPACK144SD
Target system
Note
Connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height adjustment.
41
APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION
(b) Example of use of extension probe
Extension probe
Note
YQPACK144SD
NQPACK144SD
Target system
Note
42
Connector for emulator connection (YQSOCKET144SDN) can be inserted at this position for height adjustment.
APPENDIX C
CONNECTORS FOR TARGET CONNECTION
C.1 Use
(1) When mounting NQPACK144SD to target system
<1>
Coat the tip of four projections (points) at the bottom of the NQPACK144SD with two-component type
epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not
bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the
target system. If the lead of the NQPACK144SD does not coincide with the pad of the target system
easily, perform step <2> to adjust the position.
<2>
To adjust the position, insert the guide pins for position-adjustment (NQGUIDE) provided with
NQPACK144SD into the pin holes at the upper side of NQPACK144SD (refer to Figure C-1).
The diameter of a hole is φ = 1.0 mm.
There are three non-through holes (refer to APPENDIX A
DIMENSIONS).
<3>
After setting the HQPACK144SD, solder NQPACK144SD to the target system.
By following this
sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided.
Recommended soldering condition… Reflow
: 240°C, 20 sec. max.
Partial heating : 240°C, 10 sec. max. (per pin row)
<4>
Remove the guide pins.
Figure C-1. Mounting of NQPACK144SD
HQPACK144SD
Guide pins
(NQGUIDE)
NQPACK144SD
Target system
Remark
NQPACK144SD: Connector for target connection
HQPACK144SD: Cover for device installation
43
APPENDIX C
CONNECTORS FOR TARGET CONNECTION
(2) When setting device
Caution Check for abnormal conditions such as resin burr or bent pins before setting a device to the
NQPACK144SD. Moreover, check that the hold pins of the HQPACK144SD are not broken or
bent before setting HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat
plate such as a blade.
<1>
Make sure that the NQPACK144SD is clean and the device pins are parallel (flat) before setting a device
to the NQPACK144SD. Then, after mounting the NQPACK144SD to the target board, set the device and
HQPACK144SD (refer to Figure C-2).
<2>
Using the screws provided with the HQPACK144SD (four locations: M2 × 6 mm), secure the
HQPACK144SD, device, and NQPACK144SD.
Tighten the screws in a crisscross pattern with the provided screwdriver or driver with torque gauge (avoid
tightening strongly only one screw).
Tighten the screws with 0.55 kg⋅f⋅cm (0.054 N⋅m) max. torque.
Excessive tightening may diminish conductivity.
At this time, each pin is fixed inside the plastic wall dividers by the contact pin of the NQPACK144SD and
the hold pin of the HQPACK144SD (refer to Figure C-3). Thus, pins cannot cause a short with pins of
neighboring devices.
Figure C-2. Mounting Device
Fastening screws
HQPACK144SD
Device
NQPACK144SD
Target system
Figure C-3. NQPACK100SD and Device Pin
Hold pin of HQPACK144SD
Divider
Device
Pin
Contact pin of NQPACK144SD
44
APPENDIX C
CONNECTORS FOR TARGET CONNECTION
C.2 Cautions on Handling Connectors
(1) When taking connectors out of the case, remove the sponge while holding the main unit.
(2) When soldering the NQPACK144SD to the target system, cover the HQPACK144SD to protect it against
splashing flux.
Recommended soldering conditions… Reflow
: 240°C, 20 sec. max.
Partial heating : 240°C, 10 sec. max. (per pin row)
(3) Check for abnormal conditions such as resin burr or bent pins before setting a device to the NQPACK144SD.
Moreover, check that the hold pins of the HQPACK144SD are not broken or bent before setting HQPACK144SD.
If there are broken or bent pins, fix them with a thin, flat plate such as a blade.
(4) When securing the YQPACK144SD (connector for emulator connection) or HQPACK144SD to the
NQPACK144SD with screws, tighten the four screws temporarily with the provided screwdriver or driver with
torque gauge, then tighten the screws in a crisscross pattern (with 0.054 N⋅m max. torque).
Excessive tightening of only one screw may diminish conductivity.
If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and check whether the
NQPACK144SD is stained and make sure the device pins are parallel.
(5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD may cause pins to bend.
When setting a device to the NQPACK144SD, check and adjust bent pins.
45
[MEMO]
46
APPENDIX D
MOUNTING OF PLASTIC SPACER
This chapter describes the mounting method for the plastic spacer supplied with the IE-703102-MC.
When using the emulator connected to the target system, mount the plastic spacer as shown in Figure D-1 to fix
the pod horizontally.
(1) Mounting IE-703102-MC to plastic spacer
<1> Remove the nylon rivet from the rear part of the pod.
<2> Tighten the plastic spacer with the supplied plastic screw.
<3> To adjust the height, use a user spacer or stand.
Figure D-1. Mounting Method of Plastic Spacer
Plastic spacer
Target system
47
[MEMO]
48
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CS 98.8