ETC PS2733-1-V-F3

DATA SHEET
PHOTOCOUPLER
PS2732-1,-2,-4, PS2733-1,-2,-4
HIGH COLLECTOR TO EMITTER VOLTAGE
SOP MULTI PHOTOCOUPLER
−NEPOC
TM
Series−
DESCRIPTION
The PS2732-1, -2, -4 and PS2733-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode
and an NPN silicon darlington-connected phototransistor.
This package is SOP (Small Outline Package) type and has shield effect to cut off ambient light.
It is designed for high density mounting applications.
FEATURES
• High isolation voltage (BV = 2 500 Vr.m.s.)
• High collector to emitter voltage (VCEO = 300 V: PS2732-1, -2, -4)
(VCEO = 350 V: PS2733-1, -2, -4)
• SOP (Small Outline Package) type
• High current transfer ratio (CTR = 4 000 % TYP.)
• Ordering number of taping product (only 1-channel type) : PS2732-1-E3, E4, F3, F4, PS2733-1-E3, E4, F3, F4
• UL approved: File No. E72422 (S)
• VDE0884 approved (Option)
APPLICATIONS
• Hybrid IC
• Telephone/Telegraph Receiver
• FAX
The information in this document is subject to change without notice.
Document No. P11312EJ3V0DS00 (3rd edition)
Date Published December 1997 NS CP (K)
Printed in Japan
The mark
shows major revised points.
©
1994
PS2732-1,-2,-4,PS2733-1,-2,-4
PACKAGE DIMENSIONS (in millimeters)
PS2732-1
PS2733-1
4.5 MAX.
TOP VIEW
4
1
3
1. Anode
2. Cathode
3. Emitter
4. Collector
2
1.3
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
7.0±0.3
4.4
2.54
0.4 +0.10
–0.05
1.2 MAX.
0.5±0.3
0.25 M
PS2732-2
PS2733-2
9.3 MAX.
TOP VIEW
8
7
6
5
1. 3.
2. 4.
5. 7.
6. 8.
1
2
3
4
7.0±0.3
4.4
1.3
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
Anode
Cathode
Emitter
Collector
2.54
0.4 +0.10
–0.05
1.2 MAX.
0.5±0.3
0.25 M
PS2732-4
PS2733-4
19.46 MAX.
TOP VIEW
16
15
1
2
14
13
12
3
4
5
1. 3. 5. 7.
2. 4. 6. 8.
9. 11. 13. 15.
10. 12. 14. 16.
0.15 +0.10
–0.05
2.0
0.1±0.1
2.3 MAX.
2
0.25 M
2.54
1.2 MAX.
0.5±0.3
10
9
6
7
8
Anode
Cathode
Emitter
Collector
7.0±0.3
4.4
0.4 +0.10
–0.05
11
1.3
PS2732-1,-2,-4,PS2733-1,-2,-4
ORDERING INFORMATION
Part Number
Package
Safety Standard Approval
PS2732-1, PS2733-1
4-pin SOP
Standard products
PS2732-2, PS2733-2
8-pin SOP
• UL approved
PS2732-4, PS2733-4
16-pin SOP
PS2732-1-V, PS2733-1-V
4-pin SOP
PS2732-2-V, PS2733-2-V
8-pin SOP
PS2732-4-V, PS2733-4-V
16-pin SOP
VDE0884 approved products (Option)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
Ratings
PS2732-1
Diode
PS2732-2,-4
PS2733-2,-4
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
6
V
∆PD/°C
0.8
mW/°C
PD
80
mW/ch
IFP
1
A
Power Dissipation Derating
Power Dissipation
Peak Forward Current
Transistor
PS2733-1
Unit
*1
Collector to Emitter Voltage
VCEO
Emitter to Collector Voltage
VECO
0.3
V
IC
150
mA/ch
Collector Current
Power Dissipation Derating
Power Dissipation
*2
300
350
300
350
V
∆PC/°C
1.5
1.2
mW/°C
PC
150
120
mW/ch
Isolation Voltage
BV
2 500
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
°C
Storage Temperature
Tstg
–55 to +150
°C
*1 PW = 100 µs, Duty Cycle = 1 %
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
3
PS2732-1,-2,-4,PS2733-1,-2,-4
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
Transistor
Coupled
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Terminal Capacitance
Ct
V = 0 V, f = 1 MHz
Collector to Emitter
Current
ICEO
IF = 0 mA, VCE = 300 V
Current Transfer Ratio
TYP.
MAX.
Unit
1.15
1.4
V
5
µA
30
pF
400
CTR
IF = 1 mA, VCE = 2 V
VCE (sat)
IF = 1 mA, IC = 2 mA
Isolation Resistance
RI-O
VI-O = 1 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.4
pF
VCC = 5 V, IC = 10 mA, RL = 100 Ω
100
µs
Fall Time
*1
tr
*1
VCC
IF
VOUT
RL = 100 Ω
V
Ω
100
Pulse Input
%
1.0
11
tf
50 Ω
4 000
10
*1 Test circuit for switching time
PW = 1 ms
Duty cycle = 1/10
1 500
nA
Collector Saturation
Voltage
Rise Time
4
MIN.
PS2732-1,-2,-4,PS2733-1,-2,-4
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
75
50
25
25
0
50
75
50
25
50
75
100
TA = +100 ˚C
+75 ˚C
+50 ˚C
+25 ˚C
0 ˚C
–25 ˚C
–55 ˚C
0.8
1.0
1.2
1.4
1.6
10 000
VCE = 300 V
1 000
100
10
1
0.1
–25
–50
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (˚C)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
1 000
5 mA
4.5 mA
4 mA
3.5 mA
3 mA
2.5 mA
140
120
100
Collector Current IC (mA)
Forward Current IF (mA)
PS2732-2,-4,
PS2733-2,-4
1.2 mW/˚C
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
160
Collector Current IC (mA)
100
FORWARD CURRENT vs.
FORWARD VOLTAGE
0.1
2 mA
80
1.5 mA
60
1 mA
40
20
0
PS2732-1,
PS2733-1
1.5 mW/˚C
Ambient Temperature TA (˚C)
1
0.01
0.6
150
Ambient Temperature TA (˚C)
100
10
200
0
100
Collector to Emitter Dark Current ICEO (nA)
Diode Power Dissipation PD (mW)
100
IF = 5 mA
100
2 mA
1 mA
0.5 mA
10
1
IF = 0.5 mA
1
2
3
4
Collector to Emitter Voltage VCE (V)
5
0.1
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
Collector Saturation Voltage VCE (sat) (V)
5
PS2732-1,-2,-4,PS2733-1,-2,-4
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
5 000
1.2
Current Transfer Ratio CTR (%)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.0
0.8
0.6
0.4
Normalized to 1.0
at TA = 25 ˚C,
IF = 1 mA, VCE = 2 V
0.2
0
–50
–25
25
0
50
75
Sample A
VCE = 2 V
4 000
Sample B
3 000
2 000
1 000
0
0.1
100
0.5
1
5
10
Ambient Temperature TA (˚C)
Forward Current IF (mA)
SWITCHING TIME vs.
LOAD RESISTANCE
FREQUENCY RESPONSE
20
300
VCC = 10 V,
IC = 10 mA
0
Normalized Gain GV
Switching Time t ( µ s)
50
td
tf
10
5
ts
50
100
500
1k
–5
2k
Load Resistance RL (Ω)
100 Ω
–10
1 kΩ
–15
VCE = 4 V,
IC = 10 mA,
–20 Vin = 0.1 Vp-p
–25
1
20
RL = 10 Ω
tr
100
1 kΩ
1
µF
Vin
–30
0.01
47
Ω RL Vout
0.1
1
10
Frequency f (kHz)
LONG TERM CTR DEGRADATION
1.2
TA = 25 ˚C
IF = 1 mA
CTR (Relative Value)
1.0
0.8
TA = 60 ˚C
0.6
0.4
0.2
0
10
102
103
104
105
106
Time (Hr)
Remark The measurement of TYPICAL CHARACTERISTICS are only for reference, not guaranteed.
6
100
PS2732-1,-2,-4,PS2733-1,-2,-4
TAPING SPECIFICATIONS (in millimeters)
1.55±0.1
4.6±0.1
2.4±0.1
7.4±0.1
5.5±0.1
1.55±0.1
12.0±0.2
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
8.0±0.1
Tape Direction
PS2732-1-E4, F4
PS2733-1-E4, F4
PS2732-1-E3, F3
PS2733-1-E3, F3
Outline and Dimensions (Reel)
2.0±0.5
1.5±0.5
60
˚
6.0±1
Packing: PS2732-1-E3, E4, PS2733-1-E3, E4 900 pcs/reel
PS2732-1-F3, F4, PS2733-1-F3, F4 3 500 pcs/reel
1.5±0.1
φ 13.0±0.5
˚
φ 66
12
0
PS2732-1-E3, E4, PS2733-1-E3, E4 : φ 178
PS2732-1-F3, F4, PS2733-1-F3, F4: φ 330
φ 21.0±0.8
1.5±0.1
12.4 +2.0
–0.0
18.4 MAX.
7
PS2732-1,-2,-4,PS2733-1,-2,-4
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
120 to 160 ˚C
60 to 90 s
(preheating)
Time (s)
Caution Please avoid to removed the residual flux by water after the first reflow processes.
Peak temperature 235 ˚C or below
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
8
PS2732-1,-2,-4,PS2733-1,-2,-4
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
Parameter
Symbol
Speck
Unit
Application classification (DIN VDE 0109)
for rated line voltages ≤ 150 Vr.m.s.
IV
for rated line voltages ≤ 300 Vr.m.s.
III
Climatic test class (DIN IEC 68 Teil 1/09.80)
55/100/21
Dielectric strength
Maximum operating isolation voltage
UIORM
710
Vpeak
Upr
850
Vpeak
Test voltage (partial discharge test, procedure b for random test)
Upr = 1.6 × UIORM, Pd < 5 pC
Upr
1 140
Vpeak
Highest permissible overvoltage
UTR
4 000
Vpeak
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.2 × UIORM, Pd < 5 pC
Degree of pollution (DIN VDE 0109)
2
Clearance distance
>5
mm
Creepage distance
>5
mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)
CTI
Material group (DIN VDE 0109)
175
III a
Storage temperature range
Tstg
–55 to +150
°C
Operating temperature range
TA
–55 to +100
°C
Ris MIN.
10
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 °C
VIO = 500 V dc at TA MAX. at least 100 °C
12
Ω
11
Ris MIN.
10
Ω
Package temperature
Tsi
150
°C
Current (input current IF, Psi = 0)
Isi
300
mA
Power (output or total power dissipation)
Psi
500
mW
Ris MIN.
10
Safety maximum ratings
(maximum permissible in case of fault, see thermal derating curve)
Isolation resistance
VIO = 500 V dc at TA = 175 °C (Tsi)
9
Ω
9
PS2732-1,-2,-4,PS2733-1,-2,-4
[MEMO]
10
PS2732-1,-2,-4,PS2733-1,-2,-4
[MEMO]
11
PS2732-1,-2,-4,PS2733-1,-2,-4
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
NEPOC is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5