ETC CYM1861AV33

CYM1861AV33
2,048K x 32 3.3V Static RAM Module
Features
chip selects are used to independently enable the four bytes.
Reading or writing can be executed on individual bytes or any
combination of multiple bytes through proper use of selects.
• High-density 3.3V 64-megabit SRAM module
• 32-bit Standard Footprint supports densities from
16K × 32 through 2M × 32
• High-speed SRAMs
— Access time of 20 ns
• 72 pins
• Available in SIMM format
The CYM1861AV33 is designed for use with standard 72-pin
SIMM sockets. The pinout is downward compatible with the
64-pin JEDEC SIMM module family (CYM1821, CYM1831,
CYM1836, and CYM1841). Thus, a single motherboard
design can be used to accommodate memory depth ranging
from 16K words (CYM1821) to 2,048K words
(CYM1861AV33). The CYM1861AV33 is offered in vertical
SIMM configuration and is available with tin-lead edge
contacts.
Functional Description
The CYM1861AV33 is a high-performance 3.3V 64-megabit
static RAM module organized as 2,048K words by 32 bits. This
module is constructed from sixteen 1,024K × four SRAMs in
SOJ packages mounted on an epoxy laminate substrate. Four
Presence detect pins (PD0–PD3) are used to identify module
memory density in applications where modules with alternate
word depths can be interchanged.
Logic Block Diagram
Pin Configuration
ZIP/SIMM
Top View
A0–A19
OE
Buffer
PD0 –
PD1 –
PD 2 –
PD3 –
20
OPEN
GND
GND
OPEN
WE
4
1M x 4
SRAM
4
4
1M x 4
SRAM
4
CS1 –CS 4
A20
MUX
4:8
4
1M x 4
SRAM
4
4
1M x 4
SRAM
4
I/O4 – I/O7
1M x 4
SRAM
I/O0 – I/O3
I/O12 – I/O15
4
4
4
I/O8 – I/O11
1M x 4
SRAM
4
I/O20 – I/O23
I/O16 –I/O19
1M x 4
SRAM
4
I/O28 – I/O31
I/O24 –I/O27
1M x 4
SRAM
4
4
4
I/O4 – I/O7
I/O0 – I/O3
NC
PD3
PD0
I/O0
I/O1
I/O2
I/O3
VCC
A7
A8
A9
I/O4
I/O5
I/O6
I/O7
WE
A14
CS1
CS3
A16
I/O12– I/O15
GND
I/O8 – I/O11 I/O16
I/O17
I/O18
I/O19
A10
I/O20 – I/O23
A11
I/O16 –I/O19
A12
A13
I/O20
I/O21
I/O28 – I/O31 I/O22
I/O23
I/O24 –I/O27
GND
A19
NC
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
33
35
NC
PD2
GND
PD1
I/O8
I/O9
I/O10
I/O11
A0
A1
A2
I/O12
I/O13
I/O14
I/O15
GND
A15
CS2
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
CS4
A17
OE
I/O24
I/O25
I/O26
I/O27
A3
A4
A5
VCC
A6
I/O28
I/O29
I/O30
I/O31
A18
A20
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
Selection Guide
CY1861AV33-20
20
2400
1050
Maximum Access Time
Maximum Operating Current
Maximum Standby Current
Cypress Semiconductor Corporation
Document #: 38-05297 Rev. **
•
3901 North First Street
•
CY1861AV33-25
25
2400
1050
San Jose
•
Unit
ns
mA
mA
CA 95134 • 408-943-2600
Revised August 20, 2002
CYM1861AV33
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .................................–55°C to +125°C
Ambient Temperature with
Power Applied............................................... –10°C to +85°C
DC Voltage Applied to Outputs
in High-Z State................................................ –0.5V to +VCC
DC Input Voltage ............................................–0.5V to +4.6V
Operating Range
Range
Commercial
Ambient Temperature
0°C to +70°C
Test Conditions
Min.
Supply Voltage to Ground Potential ............... –0.5V to +4.6V
VCC
3.3 V
+ 10% –5%
Electrical Characteristics Over the Operating Range
Parameter
Description
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VCC = Min., IOL = 4.0 mA
VOL
Output LOW Voltage
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIX
Input Load Current
IOZ
ICC
Max.
Unit
2.4
V
2.2
0.4
V
VCC + 0.3
V
–0.3V
0.8
V
GND < VI < VCC
–10
+10
µA
Output Leakage Current
GND < VO < VCC, Output Disabled
–20
+20
µA
VCC Operating Supply Current
VCC = Max., IOUT = 0 mA,
CSN < VIL
2400
mA
ISB1
Automatic CS Power-down Current[1]
Max. VCC, CS > VIH,
Min. Duty Cycle = 100%
1050
mA
ISB2
Automatic CS Power-down Current[1]
Max. VCC,
CS > VCC − 0.2V,
VIN > VCC − 0.2V, or
VIN < 0.2V
500
mA
Capacitance[2]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 3.3V
Max.
Unit
7
pF
14
pF
AC Test Loads and Waveforms
R1 589 Ω
R1 589 Ω
3.3V
ALL INPUT PULSES
3.3V
OUTPUT
R2
434 Ω
30 pF
INCLUDING
JIG AND
SCOPE
OUTPUT
90%
OUTPUT
THÉVENIN
250 Ω
R2
434 Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a)
Equivalent to:
3.3V
GND
90%
10%
10%
< 5 ns
< 5 ns
(b)
EQUIVALENT
1.40V
Notes:
1. A pull-up resistor to VCC on the CS input is required to keep the device deselected during VCC power-up, otherwise ISB will exceed values given.
2. Tested on a sample basis.
Document #: 38-05297 Rev. **
Page 2 of 7
CYM1861AV33
Switching Characteristics Over the Operating Range[3]
CY1861AV33-20
Parameter
Description
Min.
Max.
CY1861AV33-25
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
20
25
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACS
CS LOW to Data Valid
20
25
ns
tDOE
OE LOW to Data Valid
12
15
ns
tLZOE
OE LOW to Low-Z
tHZOE
OE HIGH to High-Z
20
3
25
3
0
3
ns
ns
4
10
[4]
ns
ns
12
7
ns
tLZCS
CS LOW to Low-Z
tHZCS
CS HIGH to High-Z[4, 5]
10
12
ns
ns
tPD
CS HIGH to Power-down
20
25
ns
Write Cycle[6]
tWC
Write Cycle Time
20
25
ns
tSCS
CS LOW to Write End
17
20
ns
tAW
Address Set-up to Write End
17
20
ns
tHA
Address Hold from Write End
3
3
ns
tSA
Address Set-up to Write Start
2
2
ns
tPWE
WE Pulse Width
15
20
ns
tSD
Data Set-up to Write End
12
15
ns
tHD
Data Hold from Write End
2
2
ns
tLZWE
WE HIGH to Low-Z
3
tHZWE
WE LOW to High-Z[5]
0
3
12
0
ns
12
ns
Switching Waveforms
Read Cycle No. 1[7, 8]
t RC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Notes:
3. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
4. At any given temperature and voltage condition, tHZCS is less than tLZCS for any given device. These parameters are guaranteed and not 100% tested.
5. tHZCS and tHZWE are specified with CL = 5 pF as in (b) of AC Test Loads and Waveforms. Transition is measured ± 500 mV from steady-state voltage.
6. The internal Write time of the memory is defined by the overlap of CS LOW and WE LOW. Both signals must be LOW to initiate a Write and either signal can
terminate a Write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the Write.
7. WE is HIGH for Read cycle.
Document #: 38-05297 Rev. **
Page 3 of 7
CYM1861AV33
Switching Waveforms (continued)
Read Cycle No. 2 [7, 9]
t RC
CS
tACS
OE
tHZOE
tDOE
tHZCS
tLZOE
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
DATA OUT
tLZCS
tPD
tPU
ICC
V CC
SUPPLY
CURRENT
50%
50%
ISB
Write Cycle No. 1 (WE Controlled) [6]
tWC
ADDRESS
tSCS
CS
tAW
tSA
tHA
tPWE
WE
tSD
DATA IN
DATA VALID
tHZWE
DATA OUT
tHD
tLZWE
HIGH IMPEDANCE
DATA UNDEFINED
Notes:
8. Device is continuously selected, CS = VIL, and OE = VIL.
9. Address valid prior to or coincident with CS transition LOW.
Document #: 38-05297 Rev. **
Page 4 of 7
CYM1861AV33
Switching Waveforms (continued)
Write Cycle No. 2 (CS Controlled) [6,10]
tWC
ADDRESS
tSCS
tSA
CS
tAW
tHA
tPWE
WE
tSD
DATA IN
tHD
DATA VALID
tHZWE
HIGH IMPEDANCE
DATA OUT
DATA UNDEFINED
Truth Table
CS
WE
OE
H
X
X
High-Z
Inputs/Output
Deselect/Power-down
Mode
L
H
L
Data Out
Read
L
L
X
Data In
Write
L
H
H
High-Z
Deselect
Ordering Information
Speed
(ns)
Ordering Code
Package
Type
Package Type
Operating
Range
20
CYM1861AV33PM-20C
PM48
72-pin Plastic SIMM Module
Commercial
25
CYM1861AV33PM-25C
PM48
72-pin Plastic SIMM Module
Commercial
Note:
10. If CS goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
Document #: 38-05297 Rev. **
Page 5 of 7
CYM1861AV33
Package Diagram
72-pin Plastic SIMM Module
51-41322-*D
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05297 Rev. **
Page 6 of 7
© Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CYM1861AV33
Document Title: CYM1861AV33 2,048K x 32 3.3V Static RAM Module
Document Number: 38-05297
REV.
ECN NO.
Issue
Date
Orig. of
Change
**
117909
08/22/02
MEG
Document #: 38-05297 Rev. **
Description of Change
New Data Sheet
Page 7 of 7