Revised October 2001 FSLV16211 24-Bit Bus Switch General Description Features The FSLV16211 is a 24-bit, high speed, low voltage bus switch. The low On Resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. ■ 5Ω switch connection between two ports This device’s design allow this part to be used as a 12-bit or 24-bit bus switch. When OE1 is LOW, Port 1A is connected to Port 1B. When OE2 is LOW, Port 2A is connected to Port 2B. ■ Minimal propagation delay through the switch ■ Low lCC ■ Zero bounce in flow-through mode ■ Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number FSLV16211GX (Note 1) Package Number BGA54A FSLV16211MTD MTD56 Package Description 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (TAPE and REEL) 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 1: BGA package available in Tape and Reel only. Logic Diagram © 2001 Fairchild Semiconductor Corporation DS500451 www.fairchildsemi.com FSLV16211 24-Bit Bus Switch February 2001 FSLV16211 Connection Diagrams Pin Descriptions Pin Assignment for TSSOP Pin Name Description OE1, OE2 Bus Switch Enables 1A, 2A Bus A 1B, 2B Bus B NC No Connect FBGA Pin Assignments 1 2 3 4 5 6 A 1A2 1A1 NC OE2 1B1 1B2 B 1A4 1A3 1A7 OE1 1B3 1B4 C 1A6 1A5 GND 1B7 1B5 1B6 D 1A10 1A9 1A8 1B8 1B9 1B10 E 1A12 1A11 2A1 2B1 1B11 1B12 F 2A4 2A3 2A2 2B2 2B3 2B4 G 2A6 2A5 VCC GND 2B5 2B6 H 2A8 2A7 2A9 2B9 2B7 2B8 J 2A12 2A11 2A10 2B10 2B11 2B12 Truth Table Inputs Pin Assignment for FBGA (Top Thru View) www.fairchildsemi.com 2 Inputs/Outputs OE1 OE2 1A, 1B 2A, 2B L L 1A = 1B 2A = 2B L H 1A = 1B Z H L Z 2A = 2B H H Z Z Recommended Operating Conditions (Note 4) Supply Voltage (VCC) −0.5V to +4.6V DC Switch Voltage (VS) −0.5V to +4.6V Power Supply Operating (VCC) DC Input Voltage (VIN) (Note 3) −0.5V to +4.6V Input Voltage (VIN) 0V to 3.6V 0V to 3.6V DC Input Diode Current (lIK) VIN < 0V −50 mA Output Voltage (VOUT) DC Output (IOUT) Sink Current 128 mA Input Rise and Fall Time (tr, tf) DC VCC/GND Current (ICC/IGND) Storage Temperature Range (TSTG) +/− 100 mA 2.3V to 3.6V Switch Control Input −65°C to +150 °C 0 ns/V to 4 ns/V Switch I/O 0 ns/V to DC Free Air Operating Temperature (TA) -40 °C to +85 °C Note 2: The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum rating. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 3: The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Note 4: Unused control inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics (Note: Not all conditions may appear on all switch types) Symbol Parameter VIK Clamp Diode Voltage VIH HIGH Level Control Input Voltage VIL II LOW Level Control Input Voltage Input Leakage Current TA = −40 °C to +85 °C VCC (V) Min Typ Max −1.2 3.0 2.3-2.7 1.7 2.7-3.6 2.0 Units V Conditions IIN = −18 mA V 2.3-2.7 0.7 2.7-3.6 0.8 2.3 10 0.0 10 V Force VI = 3.6V, IOUT = 0.0A µA Force VI = 3.6V VIN = VCC or GND, IOUT = 0A 0 ≤ VIN ≤ 3.6V 3.6 1 ICC Quiescent Supply Current 3.6 3 µA ∆ICC Increase in ICC per Input 3.6 300 µA One Input @ 3V, Other Inputs at VCC or GND ±1 µA 0.0 ≤ A, B ≤ 3.6V IOZ OFF-STATE Leakage 3.6 RON Switch On Resistance 3.0 5 7 IIN = 64 mA, VI = 0.0V 3.0 5 7 IIN = 30 mA, VI = 0.0V 3.0 10 15 IIN = 15 mA, VI = 2.4V 3.0 20 Ω IIN = 15 mA, VI = 3.0V IIN = 64 mA, VI = 0.0V 2.3 5 8 2.3 5 8 IIN = 30 mA, VI = 0.0V 2.3 10 15 IIN = 15 mA, VI = 1.7V 20 IIN = 15 mA, VI = 2.0V 2.3 3 www.fairchildsemi.com FSLV16211 Absolute Maximum Ratings(Note 2) FSLV16211 AC Electrical Characteristics Symbol TA = −40 °C to +85 °C, TA = −40 °C to +85 °C, CL = 30pF, RL = 500Ω CL = 50pF, RL = 500Ω VCC = 2.5V ± 0.20V VCC = 3.3V ± 0.30V Min Min Parameter Max tPHL, tPLH Propagation Delay (Note 5) tPHZ, tPLZ Enable Time 0.5 4.7 tPZH, tPZL Disable Time 0.5 5.1 Units Max 0.15 0.25 ns 1.0 7.0 ns 1.0 5.5 ns Note 5: This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On Resistance of the switch and the load capacitance, when driven by an ideal voltage source (zero output impedance). Capacitance Symbol (Note 6) Parameter Typ Max Units Conditions CIN Control Pin Input Capacitance 4.5 pF VCC = 3.3V CI/O Input/Output Capacitance 6.5 pF VCC, OE = 3.3V Note 6: TA = +25°C, f = 1 MHz, Capacitance is characterized but not tested. AC Loading and Waveforms Test Switch tPD Open tPLZ/tPZL VIN tPHZ/tPZH GND Note: CL includes load and stray capacitance Note: Input PRR = 1.0 MHz, tW = 500 ns FIGURE 1. AC Test Circuit FIGURE 2. AC Waveforms VCC www.fairchildsemi.com Symbol 3.3V ± 0.3V 2.5V ± 0.2V VMI 1.5V VCC/2 VMO 1.5V VCC/2 VMVO 0.3V 0.15V VIN 6.0V 2 x VCC VCCV 3.0 VCC tr/tf 2 ns 2.5 ns 4 FSLV16211 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A 5 www.fairchildsemi.com FSLV16211 24-Bit Bus Switch Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD56 Technology Description The Fairchild Switch family derives from and embodies Fairchild’s proven switch technology used for several years in its 74LVX3L384 (FST3384) bus switch product. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 6