PD - 94352 IRGC49B120UB Die in Wafer Form Features • • • • • G Benefits • • • • 1200V IC(nom)= 50A VCE(on) typ.=3.39V @ IC(nom) @ 25°C UltraFast IGBT Short Circuit Rated 150mm Wafer C GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10µs Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency above 20KHz Rugged Transient Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market E Reference Standard IR Package Part: IRGPS40B120UD Electrical Characteristics (Wafer Form) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Guaranteed (min, max) Collector-to-Emitter Saturation Voltage 1.80V min, 2.25V max Colletor-to-Emitter Breakdown Voltage 1200V min Gate Threshold Voltage 4.4V min, 6.0V max Zero Gate Voltage Collector Current 20µA max Gate-to-Emitter Leakage Current ± 1.1µA max Test Conditions IC = 10A, TJ = 25°C, VGE = 15V TJ = 25°C, ICES = 500µA, VGE = 0V VGE = VCE , TJ =25°C, IC = 500µA TJ = 25°C, VCE = 1200V TJ = 25°C, VGE = +/-20V Mechanical Data Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA) 99% Al/1% Si, (4µm) 0.305" x 0.390" 150mm, with std. < 100 > flat 185µm, +/-15µm 01-5404 100µm 0.25mm diameter minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300°C Recommended Die Attach Conditions Die Outline 7.747 [.305] NOT ES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMET ERS [INCHES ]. 6.354 [.250] 2. CONTROLLING DIMENSION: [INCH]. 3. LET TER DES IGNATION: S = S OURCE S K = S OURCE KELVIN G = GATE IS = CURRENTSENSE E = EMIT TER 4. DIMENS IONAL T OLERANCES: 9.906 [.390] EMIT TER 8.429 [.332] 1.205 [.047] WIDTH & LENGT H G 1.196 [.047] www.irf.com BONDING PADS : < 0.635 TOLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 TOLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] OVERALL DIE: < 1.270 TOLERANCE = + /- 0.102 WIDTH < [.050] T OLERANCE = + /- [.004] & > 1.270 TOLERANCE = + /- 0.203 LENGT H > [.050] T OLERANCE = + /- [.008] 01/07/02