TS461 TS462 TS464 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIERS ■ HIGH DYNAMIC FEATURES PIN CONNECTIONS (top view) ■ LARGE OUTPUT SWING (±2.4V @ VCC = ±2.5V) TS461CLT ■ LOW NOISE LEVEL : 4nV/√Hz ■ LOW DISTORTION : 0.003% ■ OPERATING RANGE : 2.7V to 10V ■ AVAILABLE IN SOT23-5 MICROPACKAGE Output 1 VDD 2 Non-inve rting input 3 5 V CC 4 Inve rting inpu t DESCRIPTION The TS46x is operational amplifiers able to operate with voltages as low as ±1.35V and to reach a minimum of ±2Vpp of output swing when supplied with ±2.5V. This device is well suited for every kind of portable and battery-supplied equipment where low noise and low distortion are key. The TS461/2/4 are a cost-attractive access to the range of the Rail to Rail Op-Amps from STMicroelectronics. APPLICATION TS461CD 8 N.C. N.C. 1 Inverting Input 1 2 - 7 VCC 3 + 6 Outpu t 2 Non-inve rting Input 1 5 N.C. V DD 4 TS462CN-TS462CD-TS462CPT-TS462CST ■ Sound cards ■ PDA ■ CD players ■ Recording equipments 8 VCC Output 1 1 Inverting Input 1 2 - Non-inve rting Input 1 3 + VDD 4 ■ Multimedia 7 Output 2 - 6 Inverting Input 2 + 5 Non-inverting Input 2 ■ Microphone preamplifier ORDER CODE Part Number TS461C TS462C TS464C Temperature Range -20°C, +70°C TS464CN-TS464CD-TS464CPT Package N D P L • • • • • • • • S SOT23 Marking Output 1 1 K105 • N = Dual in Line Package (DIP) D = Small Outline Package (SO) - also available in Tape & Reel (DT) P = Thin Shrink Small Outline Package (TSSOP) only available in Tape & Reel (PT) L = Tiny Package (SOT23-5) only available in Tape & Reel (LT) S = MiniSO Package (MiniSO) only available in Tape & Reel (ST) January 2002 14 Output 4 Inverting Input 1 2 - - 13 Inverting Input 4 Non-inverting Input 1 3 + + 12 Non-inverting Input 4 Non-inverting Input 2 5 + + 10 Non-inverting Input 3 Inverting Input 2 6 - - 9 Inverting Input 3 8 Output 3 VCC 4 Output 2 7 11 VDD 1/11 TS461-TS462-TS464 ABSOLUTE MAXIMUM RATINGS Symbol VCC Vid Vin Parameter Supply voltage 1) Differential Input Voltage 2) 3) Value Unit 12 V ±V CC V -0.3 to 12.3 V Toper Operating Free Air Temperature Range -20 to +70 °C Tstd Storage Temperature Range -65 to +150 °C 150 °C Tj Rthjc Input Voltage Range Maximum Junction Temperature Thermal Resistance Junction to Case SOT23-5 SO8 SO14 TSSOP8 TSSOP14 °C/W 4) 81 28 22 26 21 R thja Thermal Resistance Junction to Ambient - SOT23-5 256 °C/W ESD Human Body Model Lead Temperature (soldering, 10sec) 2 250 kV °C Value Unit 2.7 to 10 V VDD +1.15 to V CC - 1.15 V 1. All voltages values, except differential voltage are with respect to network group terminal. 2. Differential voltages are non-inverting input terminal with respect to the inverting input terminal. 3. The magnitude of input and output voltages must never exceed VCC +0.3V. 4. Short-circuits can cause excessive heating and destructive dissipation. OPERATING CONDITIONS Symbol VCC Vicm 2/11 Parameter Supply Voltage Common Mode Input Voltage Range TS461-TS462-TS464 ELECTRICAL CHARACTERISTICS VCC = 2.5V, VDD = -2.5V, Tamb = 25°C (unless otherwise specified) Symbol Parameter Vio Input Offset Voltage Tmin. ≤ Tamb ≤ T max. ∆V io Input Offset Voltage Drift Vicm = 0V, Vo = 0V Iio Input Offset Current Vicm = 0V, Vo = 0V Tmin. ≤ Tamb ≤ Tmax. Iib Input Bias Current Vicm = 0V, Vo = 0V Tmin. ≤ Tamb ≤ Tmax. Min. Typ. Max. Unit 1 5 7 mV µV/°C 5 nA 10 150 200 200 200 750 1000 nA Vicm Common Mode Input Voltage Range CMR Common Mode Rejection Ratio V icm = ±1.35V 60 85 SVR Supply Voltage Rejection Ratio Vcc = ±2V to ±3V 60 70 Avd Large Signal Voltage Gain RL = 2kΩ 70 80 dB VOH High Level Output Voltage R L = 2kΩ 2 2.4 V VOL Low Level Output Voltage RL = 2kΩ ICC Supply Current, per amplifier Unity gain - no load Gain Bandwith Product f = 100kHz SR Slew Rate AV = 1, Vin = ±1V en Equivalent Input Noise Voltage f = 100kHz Total Harmonic Distortion f = 1kHz, AV = -1 1.35 V dB dB -2.4 -2 2 2.8 V mA GBP THD -1.35 MHz R L = 2kΩ, CL = 100pF 8.5 12 2.8 4 V/µs R L = 10kΩ 4 0.003 nV -----------Hz % 3/11 TS461-TS462-TS464 TS462CN PACKAGE MECHANICAL DATA 8 PINS - PLASTIC DIP Millimeters Inches Dim. Min. A a1 B b b1 D E e e3 e4 F i L Z 4/11 Typ. Max. Min. 3.32 0.51 1.15 0.356 0.204 1.65 0.55 0.304 10.92 9.75 7.95 0.020 0.045 0.014 0.008 Max. 0.065 0.022 0.012 0.430 0.384 0.313 2.54 7.62 7.62 3.18 Typ. 0.131 0.100 0.300 0.300 6.6 5.08 3.81 1.52 0.125 0260 0.200 0.150 0.060 TS461-TS462-TS464 TS461CD - TS462CD PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (SO) s b1 b a1 A a2 C c1 a3 L E e3 D M 5 1 4 F 8 Millimeters Inches Dim. Min. A a1 a2 a3 b b1 C c1 D E e e3 F L M S Typ. Max. Min. 1.75 0.25 1.65 0.85 0.48 0.25 0.5 0.1 0.65 0.35 0.19 0.25 Typ. Max. 0.026 0.014 0.007 0.010 0.069 0.010 0.065 0.033 0.019 0.010 0.020 0.189 0.228 0.197 0.244 0.004 45° (typ.) 4.8 5.8 5.0 6.2 1.27 3.81 3.8 0.4 0.050 0.150 4.0 1.27 0.6 0.150 0.016 0.157 0.050 0.024 8° (max.) 5/11 TS461-TS462-TS464 TS462CPT PACKAGE MECHANICAL DATA 8 PINS - THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) k c 0.25mm .010 inch GAGE PLANE L1 L L L1 C SEATING PLANE E1 A E A2 A1 5 4 4 5 D b e 8 1 8 1 PIN 1 IDENTIFICATION Millimeters Inches Dim. Min. A A1 A2 b c D E E1 e k l L L1 6/11 0.05 0.80 0.19 0.09 2.90 4.30 0° 0.50 0.45 Typ. 1.00 3.00 6.40 4.40 0.65 0.60 0.600 1.000 Max. Min. 1.20 0.15 1.05 0.30 0.20 3.10 0.01 0.031 0.007 0.003 0.114 4.50 0.169 8° 0.75 0.75 0° 0.09 0.018 Typ. 0.039 0.118 0.252 0.173 0.025 0.0236 0.024 0.039 Max. 0.05 0.006 0.041 0.15 0.012 0.122 0.177 8° 0.030 0.030 TS461-TS462-TS464 TS464CN PACKAGE MECHANICAL DATA 14 PINS - PLASTIC DIP Millimeters Inches Dim. Min. a1 B b b1 D E e e3 F i L Z Typ. 0.51 1.39 Max. Min. 1.65 0.020 0.055 0.5 0.25 Typ. 0.065 0.020 0.010 20 0.787 8.5 2.54 15.24 0.335 0.100 0.600 7.1 5.1 0.280 0.201 3.3 1.27 Max. 0.130 2.54 0.050 0.100 7/11 TS461-TS462-TS464 TS464CD PACKAGE MECHANICAL DATA 14 PINS - PLASTIC MICROPACKAGE (SO) G c1 s e3 b1 e a1 b A a2 C L E D M 8 1 7 F 14 Millimeters Inches Dim. Min. A a1 a2 b b1 C c1 D (1) E e e3 F (1) G L M S Typ. Max. Min. 1.75 0.2 1.6 0.46 0.25 0.1 0.35 0.19 Typ. 0.069 0.008 0.063 0.018 0.010 0.004 0.014 0.007 0.5 Max. 0.020 45° (typ.) 8.55 5.8 8.75 6.2 0.336 0.228 1.27 7.62 0.344 0.244 0.050 0.300 3.8 4.0 0.150 0.157 4.6 0.5 5.3 1.27 0.68 0.181 0.020 0.208 0.050 0.027 8° (max.) Note : (1) D and F do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (.066 inc) ONLY FOR DATA BOOK. 8/11 TS461-TS462-TS464 TS464CPT PACKAGE MECHANICAL DATA 14 PINS - THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) k c A C SEATING PLANE E1 L1 L 0,25 mm .010 inch GAGE PLANE E A2 7 aaa C D 8 e b A1 14 1 PIN 1 IDENTIFICATION Millimeters Inches Dim. Min. A A1 A2 b c D E E1 e k l Typ. 0.05 0.80 0.19 0.09 4.90 4.30 0° 0.50 1.00 5.00 6.40 4.40 0.65 0.60 Max. Min. 1.20 0.15 0.01 1.05 0.30 0.20 5.10 0.031 0.007 0.003 0.192 4.50 0.169 8° 0.75 0° 0.09 Typ. Max. 0.05 0.006 0.039 0.196 0.252 0.173 0.025 0.0236 0.041 0.15 0.012 0.20 0.177 8° 0.030 9/11 TS461-TS462-TS464 TS461CLT PACKAGE MECHANICAL DATA 5 PINS - TINY PACKAGE (SOT23) A E A2 E D D1 B A1 L C F Millimeters Inches Dim. 10/11 Min. Typ. Max. Min. Typ. Max. A A1 A2 B C D D1 e E 0.90 0 0.90 0.35 0.09 2.80 1.20 1.45 0.15 1.30 0.50 0.20 3.00 0.035 0.047 0.035 0.014 0.004 0.110 3.00 0.102 0.041 0.016 0.006 0.114 0.075 0.037 0.110 0.057 0.006 0.051 0.020 0.008 0.118 F L K 1.50 0.10 0d 1.75 0.60 10d 0.059 0.004 0d 2.60 1.05 0.40 0.15 2.90 1.90 0.95 2.80 1.60 0.5 0.063 0.014 0.0118 0.069 0.024 10d TS461-TS462-TS464 TS462CST PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (miniSo) k 0,25mm .010inch GAGEPLANE C PLANE SEATING E1 L1 L c A E A2 A1 4 8 1 e C ccc b D 5 PIN1IDENTIFICA TION Millimeters Inches Dimensions A A1 A2 b c D E E1 e L L1 k aaa Min. Typ. 0.050 0.780 0.250 0.130 2.900 4.750 2.900 0.100 0.860 0.330 0.180 3.000 4.900 3.000 0.650 0.550 0.950 3d 0.400 0d Max. Min. Typ. 1.100 0.150 0.940 0.400 0.230 3.100 5.050 3.100 0.002 0.031 0.010 0.005 0.114 0.187 0.114 0.700 0.016 6d 0.100 0d 0.004 0.034 0.013 0.007 0.118 0.193 0.118 0.026 0.022 0.037 3d Max. 0.043 0.006 0.037 0.016 0.009 0.122 0.199 0.122 0.028 6d 0.004 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsib ility for the consequences of use of such information nor for any infringe ment of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change witho ut notice. This publication supersedes and replaces all infor mation previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 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