fax id: 7006 1CY 74FCT2 827 T CY74FCT2827T 10-Bit Buffer Features • Sink current Source current • Function and pinout compatible with FCT, F, and AM29827 logic • FCT-C speed at 5.0 ns max. (Com’l), FCT-A speed at 8.0 ns max. (Com’l) • 25Ω output series resistors to reduce transmission line reflection noise • Reduced VOH (typically = 3.3V) versions of equivalent FCT functions • Edge-rate control circuitry for significantly improved noise characteristics • Power-off disable feature • ESD > 2000V • Matched rise and fall times • Fully compatible with TTL input and output logic levels • Extended commercial temp. range of –40°C to +85°C 12 mA 15 mA Functional Description The FCT2827T 10-bit bus driver provides high-performance bus interface buffering for wide data/address paths or buses carrying parity. This 10-bit buffer has NAND-ed output enables for maximum control flexibility. The FCT2827T is designed for high-capacitance load drive capability, while providing low-capacitance bus loading at both inputs and outputs. All inputs have clamp diodes and all outputs are designed for low-capacitance bus loading in the high impedance state. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections. The FCT2827T can be used to replace the FCT827T to reduce noise in an existing design. The outputs are designed with a power-off disable feature to allow for live insertion of boards. Pin Configurations Logic Block Diagram SOIC/QSOP Top View Y0 D0 Y1 D1 Y2 D2 Y3 D3 Y4 D4 Y5 D5 Y6 Y7 D6 D7 Y8 D8 Y9 D9 OE1 1 24 VCC D0 2 23 Y0 D1 3 22 Y1 D2 4 21 Y2 D3 5 20 Y3 D4 6 19 Y4 D5 7 18 Y5 D6 8 17 Y6 D7 9 16 Y7 D8 10 15 Y8 D9 11 14 Y9 GND 12 13 OE2 OE1 OE2 FCT2827T–3 FCT2827T–2 Function Table Inputs Outputs OE1 OE2 D Y Function L L L L L H L H Transparent H X X H X X Z Z Three-State Note: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 May 1994 – Revised October 1996 CY74FCT2827T Maximum Ratings[2, 3] DC Output Current (Maximum Sink Current/Pin) ...... 120 mA Power Dissipation.......................................................... 0.5W (Above which the useful life may be impaired. For user guidelines, not tested.) Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –65°C to +135°C Operating Range Supply Voltage to Ground Potential ............... –0.5V to +7.0V Range DC Input Voltage............................................ –0.5V to +7.0V Commercial DC Output Voltage ......................................... –0.5V to +7.0V Ambient Temperature VCC –40°C to +85°C 5V ± 5% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ. 2.4 3.3 VOH Output HIGH Voltage VOL Output LOW Voltage VCC = Min., IOH = –15 mA VCC = Min., IOL = 12 mA ROUT Output Resistance VCC = Min., IOL = 12 mA VIH Input HIGH Voltage VIL Input LOW Voltage VH Hysteresis All inputs 0.2 VIK Input Clamp Diode Voltage VCC = Min., IIN = –18 mA –0.7 II Input HIGH Current IIH Input HIGH Current VCC = Max., VIN = VCC VCC = Max., VIN = 2.7V IIL Input LOW Current IOZH 20 Max. Unit V 0.3 0.55 V 25 40 Ω 2.0 V 0.8 V V –1.2 V 5 µA ±1 µA VCC = Max., VIN = 0.5V ±1 µA Off State HIGH-Level Output Current VCC = Max., VOUT = 2.7V 10 µA IOZL Off State LOW-Level Output Current VCC = Max., VOUT = 0.5V –10 µA IOS Output Short Circuit Current –225 mA IOFF Power-Off Disable VCC = Max., VOUT = 0.0V VCC = 0V, VOUT = 4.5V ±1 µA –60 –120 Capacitance Parameter Description Typ. Max. Unit CIN Input Capacitance 5 10 pF COUT Output Capacitance 9 12 pF Notes: 2. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V CC or ground. 4. Typical values are at VCC=5.0V, TA=+25°C ambient. 5. This parameter is guaranteed but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 2 CY74FCT2827T Power Supply Characteristics Parameter Description Test Conditions Typ. Max. Unit ICC Quiescent Power Supply Current VCC=Max., VIN ≤ 0.2V, VIN ≥ VCC-0.2V 0.1 0.2 mA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max., VIN=3.4V, f1=0, Outputs Open 0.5 2.0 mA ICCD Dynamic Power Supply Current VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 0.06 0.12 mA/ MHz IC Total Power Supply Current VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 0.7 1.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OE1 or OE2=GND, VIN=3.4V or VIN=GND 1.0 2.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, Ten Bits Toggling at f1=2.5 MHz, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 1.6 3.2 mA VCC=Max., 50% Duty Cycle, Outputs Open, Ten Bits Toggling at f1=2.5 MHz, OE1 or OE2=GND, VIN=3.4V or VIN=GND 4.1 13.2 mA Notes: 7. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 8. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = I QUIESCENT + I INPUTS + I DYNAMIC 9. IC IC = I CC+∆ICCDHNT +ICCD(f0/2 + f 1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (V IN=3.4V) DH = Duty Cycle for TTL inputs HIGH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 10. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. ] 3 CY74FCT2827T Switching Characteristics Over the Operating Range CY74FCT2827AT Param. Description CY74FCT2827BT CY74FCT2827CT Test Load Min. Max. Min. Max. Min. Max. Unit Fig. No. tPLH tPHL Propagation Delay D to Y CL=50 pF RL=500Ω 1.5 8.0 1.5 5.0 1.5 4.4 ns 1, 3 tPLH tPHL Propagation Delay D to Y CL=300 pF RL=500Ω 1.5 15.0 1.5 13.0 1.5 10.0 ns 1, 3 tPZH tPZL Output Enable Time OE to Y CL=50 pF RL=500Ω 1.5 12.0 1.5 8.0 1.5 7.0 ns 1, 7, 8 tPZH tPZL Output Enable Time OE to Y CL=300 pF RL=500Ω 1.5 23.0 1.5 15.0 1.5 14.0 ns 1, 7, 8 tPHZ tPHL Output Disable Time OE to Y CL=5 pF RL=500Ω 1.5 9.0 1.5 6.0 1.5 5.7 ns 1, 7, 8 tPHZ tPHL Output Disable Time OE to Y CL=50 pF RL=500Ω 1.5 9.0 1.5 7.0 1.5 6.0 ns 1, 7, 8 Ordering Information Speed (ns) 4.4 5.0 8.0 Ordering Code Package Name Package Type CY74FCT2827CTQC Q13 24-Lead (150-Mil) QSOP CY74FCT2827CTSOC S13 24-Lead (300-Mil) Molded SOIC CY74FCT2827BTQC Q13 24-Lead (150-Mil) QSOP CY74FCT2827BTSOC S13 24-Lead (300-Mil) Molded SOIC CY74FCT2827ATQC Q13 24-Lead (150-Mil) QSOP CY74FCT2827CTSOC S13 24-Lead (300-Mil) Molded SOIC Note: 11. Minimum limits are guaranteed but not tested on Propagation Delays. 12. See “Parameter Measurement Information” in the General Information section. Document #: 38-00347-A 4 Operating Range Commercial Commercial Commercial CY74FCT2827T Package Diagrams 24-Lead Quarter Size Outline Q13 24-Lead (300-Mil) Molded SOIC S13 © Cypress Semiconductor Corporation, 1996. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.