TI CY74FCT2541ATSOCT

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT2541T
8-Bit Buffer/Line Driver
SCCS041 - September 1994 - Revised March 2000
Features
• Function and pinout compatible with FCT and F logic
• FCT-C speed at 4.1 ns max.
FCT-A speed at 4.8 ns max.
• 25Ω output series to reduce transmission line reflection
noise
• Reduced VOH (typically = 3.3V) versions of equivalent
FCT functions
• Edge-rate control circuitry for significantly improved
noise characteristics
• Power-off disable feature
• ESD > 2000V
• Matched rise and fall times
• Fully compatible with TTL input and output logic levels
• Sink current
12 mA
Source current
15 mA
Logic Block Diagram
• Extended commercial temp. range of –40˚C to +85˚C
• Three-state outputs
Functional Description
The FCT2541T is an octal buffer and line driver designed
to be employed as a memory address driver, clock driver,
and bus-oriented transmitter/receiver. On-chip termination resistors
have been added to the outputs to reduce system noise caused by
reflections. The FCT2541T can be used to replace the FCT541T to
reduce noise in an existing design. The speed of the FCT2541T is
comparable to bipolar logic counterparts while reducing power dissipation. The input and output voltage levels allow direct interface
with TTL and CMOS devices without external components.
The outputs are designed with a power-off disable feature to
allow for live insertion of boards.
Pin Configurations
OEA
OE B
D0
O0
D1
SOIC/QSOP
Top View
O1
D2
O2
D3
O3
D4
O4
D5
O5
D6
O6
D7
O7
OEA
1
20
D0
2
19
OE B
D1
3
18
O0
D2
4
17
O1
D3
5
16
O2
D4
6
15
O3
D5
7
14
O4
D6
8
13
O5
D7
9
12
O6
GND
10
11
O7
VCC
FCT2541T–2
FCT2541T–3
]
Function Table[1]
Inputs
OEA
OEB
D
Output
L
L
H
L
L
H
L
H
X
L
H
Z
Note:
1. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
Z = High Impedance
Copyright
© 2000, Texas Instruments Incorporated
CY74FCT2541T
Maximum Ratings[2,3]
DC Output Current (Maximum Sink Current/Pin) ...... 120 mA
Power Dissipation .......................................................... 0.5W
(Above which the useful life may be impaired. For user guidelines, not tested.)
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Storage Temperature ..................................... −65°C to +150°C
Operating Range
Ambient Temperature with
Power Applied .................................................. −65°C to +135°C
Supply Voltage to Ground Potential..................−0.5V to +7.0V
Range
DC Input Voltage .................................................−0.5V to +7.0V
Commercial
DC Output Voltage ..............................................−0.5V to +7.0V
Ambient
Temperature
VCC
−40°C to +85°C
5V ± 5%
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min.
Typ.[5]
2.4
3.3
VOH
Output HIGH Voltage
VCC = Min., IOH = −15 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 12 mA
ROUT
Output Resistance
VCC = Min., IOL = 12 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Hysteresis[6]
All inputs
0.2
VIK
Input Clamp Diode Voltage
VCC = Min., IIN = −18 mA
−0.7
II
Input HIGH Current
IIH
IIL
20
Max.
Unit
V
0.3
0.55
V
25
40
Ω
2.0
V
0.8
V
V
−1.2
V
VCC = Max., VIN = VCC
5
µA
Input HIGH Current
VCC = Max., VIN = 2.7V
±1
µA
Input LOW Current
VCC = Max., VIN = 0.5V
±1
µA
IOZH
Off State HIGH-Level
Output Current
VCC = Max., VOUT = 2.7V
15
µA
IOZL
Off State LOW-Level
Output Current
VCC = Max., VOUT = 0.5V
−15
µA
IOS
Output Short Circuit Current[7]
VCC = Max., VOUT = 0.0V
−225
mA
IOFF
Power-Off Disable
VCC = 0V, VOUT = 4.5V
±1
µA
−60
−120
Capacitance[6]
Parameter
Description
Typ.[5]
Max.
Unit
CIN
Input Capacitance
5
10
pF
COUT
Output Capacitance
9
12
pF
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. TA is the “instant on” case temperature.
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
2
CY74FCT2541T
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
ICC
Quiescent Power Supply
Current
VCC=Max., VIN≤0.2V,
VIN≥VCC−0.2V
0.1
0.2
mA
∆ICC
Quiescent Power Supply
Current (TTL inputs)
VCC=Max., VIN=3.4V,[8]
f1=0, Outputs Open
0.5
2.0
mA
ICCD
Dynamic Power Supply
Current[9]
VCC=Max., 50% Duty Cycle, Outputs Open,
One Bit Toggling,
OEA=OEB=GND, VIN≤0.2V or
VIN≥VCC−0.2V
0.06
0.12
mA/
MHz
IC
Total Power Supply Current[10]
VCC=Max., 50% Duty Cycle, Outputs Open,
One Bit Toggling at f1=10 MHz,
OEA=OEB=GND, VIN≤0.2V or VIN≥VCC−0.2V
0.7
1.4
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
One Bit Toggling at f1=10 MHz,
OEA=OEB=GND, VIN=3.4V or VIN=GND
1.0
2.4
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=2.5 MHz,
OEA=OEB=GND, VIN≤0.2V or VIN≥VCC−0.2V
1.3
2.6[11]
mA
VCC=Max., 50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=2.5 MHz,
OEA=OEB=GND, VIN=3.4V or VIN=GND
3.3
10.6[11]
mA
Switching Characteristics Over the Operating Range[12]
CY74FCT2541T
Parameter
Description
CY74FCT2541AT
CY74FCT2541AT
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Fig.
No.[13]
tPLH
tPHL
Propagation Delay
Data to Output
1.5
8.0
1.5
4.8
1.5
4.1
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
10.0
1.5
6.2
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
9.5
1.5
5.6
1.5
5.2
ns
1, 7, 8
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
10. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
3
CY74FCT2541T
Ordering Information
Speed
(ns)
4.1
4.8
8.0
Ordering Code
Package
Name
Package Type
CY74FCT2541CTQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2541CTSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
CY74FCT2541ATQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2541ATSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
CY74FCT2541TQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2541TSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
Document #: 38−00342−A
4
Operating
Range
Commercial
Commercial
Commercial
CY74FCT2541T
Package Diagrams
20-Lead Quarter Size Outline Q5
20-Lead (300-Mil) Molded SOIC S5
5
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  2000, Texas Instruments Incorporated