Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation GENERAL DESCRIPTION Passivated guaranteed commutation triacs in a plastic envelope suitable for surface mounting intended for use in motor control circuits or with other highly inductive loads. These devices balance the requirements of commutation performance and gate sensitivity. The "sensitive gate" E series and "logic level" D series are intended for interfacing with low power drivers, including micro controllers. PINNING - SOT404 PIN BTA212B series D, E and F QUICK REFERENCE DATA SYMBOL PARAMETER MAX. MAX UNIT BTA212BBTA212BBTA212BRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current VDRM IT(RMS) ITSM PIN CONFIGURATION 600D 600E 800E 600F 600 800 12 95 V 12 95 A A SYMBOL DESCRIPTION mb 1 main terminal 1 2 main terminal 2 3 gate mb T2 T1 2 main terminal 2 1 G 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM Repetitive peak off-state voltages IT(RMS) RMS on-state current ITSM Non-repetitive peak on-state current I2t dIT/dt IGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate power Average gate power CONDITIONS MIN. - full sine wave; Tmb ≤ 99 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs over any 20 ms period Storage temperature Operating junction temperature MAX. -600 6001 UNIT -800 800 V - 12 A - 95 105 45 100 A A A2s A/µs - 2 5 0.5 A W W -40 - 150 125 ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. October 2003 1 Rev 3.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Thermal resistance full cycle junction to mounting base half cycle Thermal resistance in free air junction to ambient Rth j-a CONDITIONS MIN. TYP. MAX. UNIT - 55 1.5 2.0 - K/W K/W K/W STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. BTA212B- 2 IGT Gate trigger current IL Latching current IH Holding current VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A MAX. UNIT ...D ...D ...E ...F - 5 5 5 10 10 10 25 25 25 mA mA mA - 15 25 25 25 30 30 30 40 40 mA mA mA - 15 25 30 mA ...D, E, F VT VGT On-state voltage Gate trigger voltage ID Off-state leakage current IT = 17 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C 0.25 1.6 1.5 - V V V - 0.5 mA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. BTA212B- dVD/dt Critical rate of rise of off-state voltage dIcom/dt Critical rate of change of commutating current dIcom/dt Critical rate of change of commutating current VDM = 67% VDRM(max); Tj = 110 ˚C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 12 A; dVcom/dt = 10V/µs; gate open circuit VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 12 A; dVcom/dt = 0.1V/µs; gate open circuit ...D MAX. UNIT 70 - V/µs 8 21 - A/ms 16 32 - A/ms ...E ...F 20 60 1.0 3.5 2 Device does not trigger in the T2-, G+ quadrant. October 2003 2 Rev 3.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation 20 BTA212B series D, E and F Tmb(max) / C 95 Ptot / W 15 IT(RMS) / A BT138 = 180 15 120 1 99 C 102.5 90 10 60 10 110 30 5 117.5 5 0 0 5 125 15 10 0 -50 0 50 Tmb / C IT(RMS) / A Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 100 150 Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb. ITSM / A 25 IT(RMS) / A 20 dI T /dt limit 15 100 10 I TSM IT T 5 time Tj initial = 25 C max 10 10us 100us 1ms T/s 10ms 0 0.01 100ms Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms. 100 80 1.6 ITSM T 10 Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb ≤ 99˚C. ITSM / A IT 0.1 1 surge duration / s VGT(Tj) VGT(25 C) 1.4 time Tj initial = 25 C max 1.2 60 1 40 0.8 20 0 0.6 1 10 100 Number of cycles at 50Hz 0.4 -50 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. October 2003 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 3 Rev 3.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F IGT(Tj) IGT(25°C) 40 3 IT / A Tj = 125 C Tj = 25 C T2+ G+ T2+ GT2- G- 2.5 typ max 30 Vo = 1.175 V Rs = 0.0316 Ohms 2 20 1.5 1 10 0.5 0 0 -50 0 50 Tj/°C 100 150 0.5 1 1.5 VT / V 2 2.5 3 Fig.10. Typical and maximum on-state characteristic. Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 0 IL(Tj) IL(25 C) 10 Zth j-mb (K/W) 2.5 1 unidirectional 2 bidirectional 0.1 1.5 1 P D tp 0.01 0.5 t 0 -50 0 50 Tj / C 100 0.001 10us 150 Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms 1ms 10ms tp / s 0.1s 1s 10s Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp. IH(Tj) IH(25C) 103 dIcom/dt (A/ms) F TYPE E TYPE D TYPE 2.5 102 2 1.5 10 1 0.5 0 -50 0 50 Tj / C 100 1 150 20 Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. October 2003 40 60 80 100 120 Tj (˚C) 140 Fig.12. Minimum, critical rate of change of commutating current dIcom/dt versus junction temperature, dVcom/dt = 10V/µs. 4 Rev 3.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F MECHANICAL DATA Dimensions in mm 4.5 max 1.4 max 10.3 max Net Mass: 1.4 g 11 max 15.4 2.5 0.85 max (x2) 0.5 2.54 (x2) Fig.13. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.14. SOT404 : minimum pad sizes for surface mounting. Notes 1. Plastic meets UL94 V0 at 1/8". October 2003 5 Rev 3.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F DEFINITIONS DATA SHEET STATUS DATA SHEET STATUS3 PRODUCT STATUS4 DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 3 Please consult the most recently issued datasheet before initiating or completing a design. 4 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. October 2003 6 Rev 3.000