Philips Semiconductors Product specification Three quadrant triacs high commutation GENERAL DESCRIPTION Passivated high commutation triacs in a plastic envelope suitable for surface mounting intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. These devices will commutate the full rated rms current at the maximum rated junction temperature without the aid of a snubber. PINNING - SOT223 PIN BTA204W series B and C QUICK REFERENCE DATA SYMBOL VDRM IT(RMS) ITSM PARAMETER MAX. MAX. MAX. UNIT BTA204W- 500B BTA204W- 500C Repetitive peak 500 off-state voltages RMS on-state current 1 Non-repetitive peak on-state 10 current 600B 600C 600 800B 800C 800 V 1 10 1 10 A A PIN CONFIGURATION DESCRIPTION 1 main terminal 1 2 main terminal 2 3 gate SYMBOL 4 T2 tab main terminal 2 2 1 T1 G 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM Repetitive peak off-state voltages IT(RMS) RMS on-state current ITSM Non-repetitive peak on-state current I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power CONDITIONS MIN. - full sine wave; Tsp ≤ 108 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 1.5 A; IG = 0.2 A; dIG/dt = 0.2 A/µs over any 20 ms period Storage temperature Operating junction temperature MAX. -500 5001 -600 6001 UNIT -800 800 V - 1 A - 10 11 0.5 100 A A A2s A/µs - 2 5 5 0.5 A V W W -40 - 150 125 ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 6 A/µs. December 1998 1 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs high commutation BTA204W series B and C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient Rth j-a MIN. TYP. MAX. UNIT full or half cycle - - 15 K/W pcb mounted; minimum footprint pcb mounted; pad area as in fig:2 - 156 70 - K/W K/W STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. BTA204W2 IGT Gate trigger current IL Latching current IH Holding current VT VGT On-state voltage Gate trigger voltage ID Off-state leakage current VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A IT = 2 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C UNIT ...B ...C - - 50 50 50 35 35 35 mA mA mA - - 30 45 30 30 20 30 20 20 mA mA mA mA 0.25 1.2 0.7 0.4 1.5 1.5 - V V V - 0.1 0.5 mA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. BTA204W- dVD/dt dIcom/dt tgt Critical rate of rise of off-state voltage Critical rate of change of commutating current Gate controlled turn-on time VDM = 67% VDRM(max); Tj = 125 ˚C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 1 A; dVcom/dt = 20V/µs; gate open circuit ITM = 12 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs TYP. UNIT 1000 - V/µs 6 3 - A/ms - - 2 µs ...B 1000 ...C 2 Device does not trigger in the T2-, G+ quadrant. December 1998 2 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs high commutation BT134W Ptot / W 1.4 BTA204W series B and C Tsp(max) / C 1.2 104 107 1.2 1 110 120 0.8 90 0.8 113 60 0.6 0.6 116 30 0.4 119 0.2 122 0 0 0.2 0.4 0.6 0.8 IT(RMS) / A 0.4 0.2 125 1.2 1 0 -50 Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 2 50 Tsp / C 100 150 IT(RMS) / A BT134W I TSM IT T 100 0 Fig.4. Maximum permissible rms current IT(RMS) , versus solder point temperature Tsp. BT134W ITSM / A 108 C 1 = 180 1 BT134W IT(RMS) / A time 1.5 Tj initial = 25 C max dI T /dt limit 1 T2- G+ quadrant 10 0.5 1 10us 100us 1ms T/s 10ms 0 0.01 100ms Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms. 12 ITSM / A 10 8 1.6 ITSM T Tj initial = 25 C max 4 0.8 2 0.6 10 100 Number of cycles at 50Hz VGT(Tj) VGT(25 C) 0.4 -50 1000 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. December 1998 10 BT136 1.2 1 1 1 1.4 time 6 0 surge duration / s Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tsp ≤ 108˚C. BT134W IT 0.1 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 3 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs high commutation 3 IGT(Tj) IGT(25 C) BTA204W series B and C 2 BTA204 Tj = 125 C Tj = 25 C T2+ G+ T2+ GT2- G- 2.5 BT134W IT / A 1.5 Vo = 1.0 V 2 Rs = 0.21 Ohms typ 1 1.5 max 1 0.5 0.5 0 -50 0 50 Tj / C 100 0 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 IL(Tj) IL(25 C) 0 0.5 1 VT / V 1.5 2 Fig.10. Typical and maximum on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional 1 1.5 P D 1 tp 0.1 0.5 t 0 -50 0 50 Tj / C 100 0.01 10us 150 IH(Tj) IH(25C) 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp, versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms TRIAC 2.5 2 1.5 1 0.5 0 -50 0 50 Tj / C 100 150 Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. December 1998 4 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs high commutation BTA204W series B and C MOUNTING INSTRUCTIONS Dimensions in mm. 3.8 min 1.5 min 2.3 6.3 1.5 min (3x) 1.5 min 4.6 Fig.12. soldering pattern for surface mounting SOT223. MECHANICAL DATA Dimensions in mm 6.7 6.3 Net Mass: 0.11 g B 3.1 2.9 0.32 0.24 0.2 4 A A 0.10 0.02 16 max M 7.3 6.7 3.7 3.3 13 2 1 10 max 1.8 max 1.05 0.80 2.3 0.60 0.85 4.6 3 0.1 M B (4x) Fig.13. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". December 1998 5 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs high commutation BTA204W series B and C DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 1998 6 Rev 1.000