Bussmann® SMT Chip Fuse 1608FF Subminiature Surface Mount Fuses R Dimensional Data Dimensions - mm (inches) 1.60 ± 0.15 (0.063 ± 0.006) 0.80 ± 0.15 (0.032 ± 0.006) Catalog Symbol: 1608FF Voltage Rating: 24 VDC Interrupting Rating: 35 Amperes Physical Size: EIA SOCM-1608-AC (Equivalent to 0603) 1.6 ≈ 0.8 ≈ 0.8mm 0.063 ≈ 0.032 ≈ 0.032 in. Time-Current Characteristics: Carry 100% rated current, 4 hours minimum. Open within 5 seconds at 250% rated current. Agency Approvals: UL Recognized, Std. 248-14, File E19180, Guide JDYX2 CSA Component Acceptance File 53787, Class 1422-30 General Information: • Bussmann SMT Chip Fuses utilize thick and thin metal film technologies for superior fusing action and enhanced reliability. • The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short-circuit performance and environmental integrity. Predicted reliability of the 1608FF chip fuse is 30 times greater than that of the typical chip capacitor (consult Bussmann for details). • Substrate and coating thermal expansion coefficients are closely matched to that of FR-4 epoxy-glass circuit board for superior solder joint reliability. • The end terminations are over-plated with nickel and tin-lead. 0.36 ± 0.15 (0.014 ± 0.006) 0.80 ± 0.15 (0.032 ± 0.006) Construction 1 2 3 4 5 6 7 8 SUBSTRATE Not to Scale. 1. 2. 3. 4. 5. Ceramic Substrate Silver Termination Pad Metal Film Fusible Element Fused Glass Cover (Color Coded) White Stripe (Only On Certain Ratings) 6. Silver End Termination 7. Nickel Barrier (5.1-10.2 µm) 8. 90/10 Tin-Lead Plating (7.6-12.7 µm) Packaging and Ordering Information: Tape and Reel: Standard 8mm tape, in compliance with EIA-RS481 (equivalent to IEC 286, Part 3). 1608FF (See Table) Product Symbol Rated Current Package Code TR = 3,000 pieces on tape on a 178mm reel. TR1 = 15,000 pieces on tape on a 330mm reel. SP = 50 pieces on tape in a plastic box. Contact Bussmann if other package quantities are required. CE logo denotes compliance with European Union Low Voltage Directive (50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact Bussmann Application Engineering at 314-527-1270 for more information. Electrical Characteristics Part Number (XX=Package Code) xx/1608FF-250mA xx/1608FF-375mA xx/1608FF-500mA xx/1608FF-750mA xx/1608FF-1A xx/1608FF-1.5A xx/1608FF-2A xx/1608FF-2.5A xx/1608FF-3A xx/1608FF-3.5A xx/1608FF-4A Current Rating (Amperes) 0.25 0.375 0.5 0.75 1 1.5 2 2.5 3 3.5 4 Color Code (Cover/Stripe) Typ. Resistance @ ² 10% Rated Current (Ohms) Typ. Voltage Drop @ Rated Current (Volts) Green Green/White Blue Blue/White Brown Brown/White Black Black/White Violet Violet/White Yellow 3.0 2.0 0.9 0.51 0.15 0.068 0.042 0.029 0.022 0.018 0.014 0.90 0.80 0.54 0.45 0.18 0.12 0.11 0.09 0.087 0.08 0.08 Typ. Melting Integral @ 35A (A2 sec.) .000067 .00015 .00055 .00132 .0022 .014 .037 .070 .095 .185 .270 Typ. Total Clearing Integral @ 35A (A2 sec.) .000082 .00017 .00058 .00137 .0026 .015 .038 .078 .107 .190 .272 General Notes: 1. AC interrupting rating, melting integral and total clearing integral measured at 32V, unity power factor. 2. DC interrupting rating, melting integral and total clearing integral measured at 63V (250mA-3A) and 32V (4-5A), with a battery source. 3. It is recommended that fuses be mounted with ceramic (white) side facing up. 4. Contact Bussmann if higher ampere ratings are needed. 5. Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. 12-16-98 SB98107 Rev. A Form No. 1608FF Page 1 of 2 BIF Doc #3002 Bussmann® SMT Chip Fuse 1608FF Subminiature Surface Mount Fuses R Carrier Dimensions - mm E D0 A0 F W B0 P2 P0 8.0 + 0.3 / -0.1 3.5 ± 0.05 1.75 ± 0.1 2.0 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 1.71 ± 0.1 1.88 ± 0.1 1.5 + 0.1 / -0.0 250mA 375mA 500mA 750mA 1A 1.5A 2A 2.5A 3A 3.5A 4A P1 W F E P2 P0 P1 A0 B0 D0 AMPERE RATING 10 Environmental Specifications Operating Temperature Range: -65 to +125°C, with proper derating. Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 to 125°C), 1000 cycles, fuses soldered to FR-4 glass -epoxy circuit board. Vibration: MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G). Solderability: Withstands 60 seconds above 200°C, 260°C maximum. Moisture Resistance: MIL-STD-202, Method 106, 10 day cycle. Solder Leach Resistance & Terminal Adhesion: EIA-576 (30 seconds submersion in 260°C tin-lead solder). Recommended Land Pattern - mm (inches) TIME IN SECONDS 1 1.25 (0.05) .1 0.90 (0.035) .01 1,000 100 10 .1 .001 1 0.50 (0.02) CURRENT IN AMPERES The only controlled copy of this BIF document is the electronic read-on version located on the Bussmann Network Drive. All other copies of this BIF document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. 12-16-98 SB98107 Rev. A Form No. 1608FF Page 2 of 2 BIF Doc #3002