0.13 µm Cell-Based IC CB-12 Family L/M/H Type I in d a e L y a w e g th LS m e t s y S w e to a N New s t c u d o r P Features Cell-based IC utilizing a leading edge 0.13 µ m process technology enabling design of a wide variety of system LSI NEC can now offer the new CB-12 Family, a cell-based IC that is a world-first in its use of a 0.13 µm process technology. The CB-12 Family consists of three types (L, M and H), and enables the realization of system LSI ideal for both the low static power consumption requirements of portable devices and the large-scale, high-speed requirements of the network and image processing markets. Moreover, future plans to provide a design environment in which the three CB-12 Family transistor types can be combined will allow designers to create a highly functional system LSI that both minimizes static power consumption and realizes high-speed operation, in a reduced TAT. L type: Due to its leak-current suppressant transistor characteristics, this library was developed for portable devices and other such set applications in which low static power consumption is a requirement. The L-type library should be selected when backing up the circuit power supply. M type: This library features transistor characteristics suited to high-speed operations, making it ideal for set applications that demand high-speed processing. H type: Notwithstanding a density inferior to that of the M type, with its ultra-high-speed operation transistor characteristics, this library is ideally suited to set applications where ultra-high-speed processing is essential. CB-12 Family Family Name L Type M Type H Type 0.13 µm CMOS (effective gate length 0.10 µm), 5/7/8 aluminum layers Technology Power supply voltage 1.5±0.15 V I/O power supply voltage 2.5±0.2 V 3.3±0.3 V Maximum number of mounted gates 26M 32M 22M 31.7ps 20.7ps 17.1ps 13nW/MHz/gate 13nW/MHz/gate 24nW/MHz/gate 0.02 1 10 Note Delay time Internal gates Power consumption Static current consumption ratio Note Value for 2-nand power gate, fanout 2, wiring length 0 mm. Diverse package lineup • Tape BGA 696 pins (MAX.) • QFP 304 pins (MAX.) (0.5 mm pitch) • Flip-chip BGA 2000 pins (MAX.) Testing Large-scale circuit design-for-test supported • Scan path test • JTAG 2 Pamphlet A15021EJ2V0PF Abundant macro library Functional Cells Compiled Macros Logic gates Single-port RAM Delay gates Dual-port RAM Adders ROM Decoders Multiplexers Latches Flip-flops Shift registers Counters Cores Core Name PC ™ ™ ™ PCI controller USBNote IEEE1394Note V8xx CPU VR4xxx CPU V30MZTM MPEG2 (decoder) A/D, D/A Modem codec ™ DSP (SPX, OAK/Pine) ARM CPU Consumer Portable Devices ™ ™ ™ ™ ™ ™ ™ ™ ™ Ethernet Graphics ™ ™ ™ ™ ™ ™ ™ ATM (25 MHz, 155 MHz) TM Communication 10/100 Base PHY, MAC ™ ™ RAC (RambusTM ASIC Core cell) 2D, 3D accelerator I/O Buffers High-Speed I/O (Peripheral Component Interconnect) LVTTL PCI Low-noise buffers HSTL (High-Speed Transceiver Logic) 3-state buffers pECL (Pseudo Emitter Coupled Logic) SSTL (Stub Series Terminated Transfer Logic) Open-drain buffers LVDS (Low Voltage Differential Signaling) Other DPLL (up to 250 MHz) USBNote (Universal Serial Bus) IEEE1394Note APLL (up to 500 MHz) AGP Multipliers GTL+ (Gunning Transceiver Logic Plus) (Accelerated Graphics Port) UART Register file DRAM Flash memory Scan block JTAG Note Under development Remark The release schedule differs depending on the macro, so please contact NEC for details. Pamphlet A15021EJ2V0PF 3 Electrical Specifications Absolute maximum ratings Parameter Symbol Conditions Unit –0.5 to +2.0 V Power supply 1.5 V system voltage 2.5 V system –0.5 to +3.6 V 3.3 V system –0.5 to +4.6 V VI/VO < VDD +0.3V –0.5 to +3.6 V VI/VO < VDD +0.5V –0.5 to +4.6 V I/O voltage VDD Ratings 2.5 V buffer VI/VO 3.3 V buffer Output current 2.5 V buffer IO 2 mA type TDOPAC25NN02 IOL = 2 mA 9 mA 4 mA type TDOPAC25NN04 IOL = 4 mA 17 mA 6 mA type TDOPAC25NN06 IOL = 6 mA 38 mA 9 mA type TDOPAC25NN09 IOL = 9 mA 49 mA 12 mA type TDOPAC25NN12 IOL = 12 mA 63 mA 3 mA type TDOPAC33NN03 IOL = 3 mA 10 mA 6 mA type TDOPAC33NN06 IOL = 6 mA 19 mA 9 mA type TDOPAC33NN09 IOL = 9 mA 27 mA 12 mA type TDOPAC33NN12 IOL = 12 mA 41 mA 18 mA type TDOPAC33NN18 IOL = 18 mA 53 mA 24 mA type TDOPAC33NN24 IOL = 24 mA 67 mA 3.3 V buffer Operating ambient temperature TA –40 to +85 °C Storage temperature Tstg –65 to +150 °C Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Remark Be sure to confirm the power supply voltage before applying either 2.5 V or 3.3 V to the I/O pins. 4 Pamphlet A15021EJ2V0PF AC characteristics The following ratings are applicable for a power supply voltage of 1.5 V. Parameter Symbol Toggle frequency (L type) ftog Conditions Internal toggle F/F (fanout 1) MIN. TYP. MAX. Unit 1.9 GHz Toggle frequency (M type) 3.1 GHz Toggle frequency (H type) 5.7 GHz 249 ps 1187 ps 207 ps 995 ps Propagation delay time tPD 2.5 V input buffer Fanout 1, wiring length = 30 µm, tr, tf = 0.1 ns (2.5 V buffer) 2.5 V output buffer (12 mA) CL = 15 pF Propagation delay time 3.3 V input buffer (3.3 V buffer) Fanout 1, wiring length = 30 µm, tr, tf = 0.1 ns 3.3 V output buffer (24 mA) CL = 15 pF Propagation delay time Fanout 1, standard wiring length 41.3 ps (internal gates: L type) Fanout 1, standard wiring length 30.8 ps (Power gate) Propagation delay time Fanout 1, standard wiring length 27.1 ps (internal gates: M type) Fanout 1, standard wiring length 19.9 ps 17.1 ps (Power gate) Propagation delay time Fanout 1, standard wiring length (internal gates: H type) Fanout 1, standard wiring length ps (Power gate) Output rise time tro 2.5 V output buffer (12 mA) 841 ps 944 ps 673 ps 637 ps CL = 15 pF; 10 to 90% 3.3 V output buffer (18 mA) CL = 15 pF; 10 to 90% Output fall time tfo 2.5 V output buffer (12 mA) CL = 15 pF; 10 to 90% 3.3 V output buffer (18 mA) CL = 15 pF; 10 to 90% Remark Blank spaces in the table above indicate values under study. Pamphlet A15021EJ2V0PF 5 Design Environment NEC provides OPENCADTM CB12_KIT as the ideal design environment for the CB-12 Family. OPENCAD CB12_KIT includes a number of tools, from amongst which the customer can select those best-suited to their environment. Function NEC Tools Function simulator Commercial Tools I/F Data Verilog-XLTM – NC-VerilogTM ModelSimTM EE ModelSim SE/VHDL VCSTM Circuit diagram editor VdrawTM Logic synthesis – Design Compiler ® – Floor planner ace_floorplan Gate-level simulator Note 1 V.simTM Function description language VerilogTM HDL/VHDL – Verilog-XL NC-Verilog • Netlist PWC/EDIF(2.0.0)/Verilog HDL ModelSim EE ModelSim SE/VHDL • Test pattern ALBA/LOGPAT VCS STANote 1 PrimeTime® Tiara Format verification Formality ® – TuxedoTM-Lec Placement and routing Design-for-test Silicon EnsembleTM Note 2 – NEC_SCAN TestCompilerTM(DFT) TESTACT DFTAdvisorTM(DFT) TestgenTM(ATPG) FastScanTM(ATPG) TetraMAXTM(ATPG) Notes 1. Sign-off tool 2. Tool not supported in the HPTM version Remark Platform: SUNTM(SolarisTM)/HP(HP-UXTM) OPENCAD, V30MZ, Vdraw, and V.sim are trademarks of NEC Corporation. Rambus is a trademark of Rambus Inc. Ethernet is a trademark of XEROX Corporation. Design Compiler is a registered trademark of Synopsys, Inc. in Japan. PrimeTime and Formality are registered trademarks of Synopsys, Inc. in the USA. Verilog and NC-Verilog are trademarks of Cadence Design Systems, Inc. VCS, TetraMAX, TestCompiler, and Testgen are trademarks of Synopsys, Inc. Verilog-XL and Silicon Ensemble are trademarks of Cadence Design Systems, Inc. ModelSim is a trademark of Model Technology, Inc. SUN and Solaris are trademarks of SUN Microsystems, Inc. HP and HP-UX are trademarks of Hewlett-Packard Co. Tuxedo is a trademark of Verplex Systems, Inc. FastScan and DFTAdvisor are trademarks of Mentor Graphics, Inc. 6 • Delay data SDF Pamphlet A15021EJ2V0PF • Timing constraint file The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative. • The information in this document is current as of December, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 Pamphlet A15021EJ2V0PF 7 For further information, please contact: NEC Corporation NEC Building 7-1, Shiba 5-chome, Minato-ku Tokyo 108-8001, Japan Tel: 03-3454-1111 http://www.ic.nec.co.jp/ [North & South America] [Europe] NEC Electronics Inc. 2880 Scott Blvd. Santa Clara, CA 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 http://www.necel.com/ NEC Electronics (Germany) GmbH Kanzlerstr. 2, ¨ 40472 Dusseldorf Germany Tel: 0211-650302 Fax: 0211-6503490 http://www.nec.de/ Munich Office Arabellastr. 17 ¨ 81925 Munchen, Germany Tel: 089-921003-0 Fax: 089-92100315 NEC do Brasil S.A. 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Via Fabio Filzi, 25/A, 20124 Milano, Italy Tel: 02-667541 Fax: 02-66754299 [Asia & Oceania] NEC Electronics Hong Kong Limited 12/F., Cityplaza 4, 12 Taikoo Wan Road, Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 Seoul Branch 10F, ILSONG Bldg., 157-37, Samsung-Dong, Kangnam-Ku Seoul, the Republic of Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics Taiwan Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan, R. O. C. Tel: 02-2719-2377 Fax: 02-2719-5951 NEC Electronics Singapore Pte. Ltd. 101 Thomson Road #04-01/05 United Square, Singapore 307591 Tel: 65-253-8311 Fax: 65-250-3583 G00. 6 Document No. A15021EJ2V0PF00(2nd edition) Date Published December 2000 N CP(K) © NEC Corporation 2000 Printed in Japan