Product Data Sheet 5V TO 3.3V, AND PROGRAMMABLE DC/DC CONVERTER WITH PARALLELABLE BOOST MODULES 6-PAK DESCRIPTION The 6-PAK™ is a modular system of control and boost SIPs. Each 6A control SIP can also drive up to 8 additional 6A boost SIPs in parallel, for a total of 54A. Each SIP accepts a regulated 5V input (+10%) and provides 1.8V to 3.6Vdc output. The circuit is optimized for high efficiency and fast load transient response needed by telecom, DSP and microprocessor applications. FEATURES ! ! ! ! ! ! ! Small SIP Design Parallelable Boost SIP One stocking part meets a variety of loads Programmable Control SIP Control/Boost Pair extremely configurable Fast Transient Response No need for large external capacitors Extremely small footprint Low Component Count Low cost, high reliability Staked Pins Wave solderable Integrated Input Filter Low input ripple Advanced thermal design, monolithic power circuitry and synchronous rectification result in outstanding performance and value. With integrated input filter and output capacitors, the 6-PAK system makes a complete power supply which requires no external components over the specified operating range. Pins are staked for wave solderability. APPLICATION NOTE ! DCAN-34 - 6-PAK Demo Board Downloadable from our website cdpowerelectronics.com More product information and application notes are available on our website at www.cdpowerelectronics.com Power Electronics Division, United States 3400 E Britannia Drive, Tucson, Arizona 85706 Phone: 520.295.4100 Fax: 520.770.9369 6-PAK 11/99 REV D Power Electronics Division, Europe C&D Technologies (Power Electronics) Ltd. 132 Shannon Industrial Estate, Shannon, Co. Clare, Ireland Tel: +353.61.474.133 Fax:+353.61.474.141 Page 1 Electrical Specifications Unless otherwise specified, operating conditions are as follows: Vin=5V, Vo=3.3V, Io=6A, TA=25°C, Cin=100µF, Co=µF. Parameter Input Input Voltage Conditions Vin Min Typ Max 4.5 5.0 5.5 Input Current Ripple Required Capacitance Units VDC 200 mARMS 0 100 µF 3.3 C in Note 1 Vo Nominal 3.25 Note 2 Output Output Voltage Output Program Range Output Current Io Output Ripple Output Rise Time TA=25°C 3.35 VDC 1.8 3.6 VDC 0 6 Amps 50 mVp-p 20Mhz BW Tr Output Capacitance Range Co 0 Line Regulation Io min - Io max Load Regulation Temperature Coefficient Tc Combined Variation 5000 µF +0.5 % +0.5 % 0.01 %/°C Vin min-max &/or Io min-max TA=25°C- 85°C Protection µS 12 -2 +2 % Note 3 General Switching Frequency Dynamic Response ∆I O / ∆ t = 1A/1 0! sec, Vi = 5.0V, TA = 25°C Load Change from I O = 0% to IO = 100% Peak Deviation Settling time (VO<10% Peak Deviation) Load change from I O = 100% to I O = 0% Peak Deviation Settling time (VO<10% Peak Deviation) 800 kHz 60 150 mV µsec 90 100 mV µsec Temperature Operating Temperature Storage Temperature Note 4 +60 °C -40 +125 °C Notes 1. Input source<3” from 6-PAK™, load transient <3A per SIP. 100µF low ESR capacitor for load transients >3A per SIP. 2. Optional programming 1.8 - 3.6 or +10% available. See Table. 3. Short circuit and thermal protection. 4. 100 lfm air, Vo=3.3V, Io=6A. See Thermal Design Guide for other conditions. Page 2 6-PAK 11/99 REV D Programming Thermal Design Guide The 6-PAK™ is programmed through the Control SIP. All connected Power Boosters follow the Control SIP programming. To program the 6-PAK™ for Vout<3.3, connect a resistor across the TRIM and Vo pins. For Vout>3.3, resistor is connected across TRIM and GND. Table 2 Locate your operating current, read the junction temp rise from the graph and add to your maximum ambient. 135°C is the maximum allowable operating junction temperature. Test conditions: Device soldered into 4” X 4: PCB, 2-sided with power and ground planes for heat conduction. Due to the difficulty in predicting the thermal effects of airflow velocity and direction, and thermal conduction through ground planes, it is important that the 6-PAK™ be evaluated thermally in each application. For high ambient temperature/ high current application, please request our Application Note, “Accurate Measurements of 6-PAK™ Junction Temperature.” Vout Resistor Value Vout Resistor Value 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 0Ω 15.6Ω 34Ω 55.6Ω 80.6Ω 110Ω 147Ω 196Ω 255Ω 332Ω 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 442Ω 604Ω 866Ω 1.37k 2.80k Open 2.32k 1.00k 649Ω Tj Rise vs. Io (Junction Temp Rise vs. Output Current) Operating conditions are as follows: Vin=5V, Vo=3.3V, Load change from Io=0% to Io=100%, TA=25°C, Cin=0F, Co=µF. Temp Rise C° Transient Response Output Current - Amps Efficiency % Efficiency Operating conditions are as follows: Vin=5V, Vo=3.3V, Load change from Io=100% to Io=0%, TA=25°C, Cin=0F, Co=µF. Output Current - Amps Ordering Information Typical examples: 6-PAK 11/99 REV D 6P 25 - C 6A Control SIP 6P 25 - P 6A Power Booster SIP Page 3 Mechanical Outline TOLERANCES +.008” for 3 place decimals + .02” for 2 place decimals + .002” for pin diameter Pin Out Pin 1 2 3 4 5 6 7 8 9 System Interconnection Guidelines Function Vo Vo TRIM GND INTI Gnd INT2 Vi Vi Description Output Voltage Output Voltage Output Adjust* Ground InterModule 1 Ground InterModule 2 5V Input Voltage 5V Input Voltage 1. Each SIP must have input, ground and output pins sunk into common input ground and output planes in the host PC board. 2. Two additional common signal traces are required to interconnect INT1 and INT2 pins. These traces must be a least 0.06” wide and make a straight connection among the modules. 3. Power Booster SIP must be adjacent to the Control SIP located in the center of the layout, as shown in the Typical Example figure. Recommended distance between SIP pin centers is 0.5”. * not connected on Boosters Standard Options are shown, consult factory for other available options. The information provided herein is believed to be reliable; however, C&D TECHNOLOGIES assumes no responsibility for inaccuracies or omissions. C&D TECHNOLOGIES assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. C&D TECHNOLOGIES does not authorize or warrant any C&D TECHNOLOGIES product for use in life support devices/systems or in aircraft control applications. Page 4 6-PAK 11/99 REV D