Seven Segment Displays for High Light Ambient Conditions Technical Data High Efficiency Red HDSP-553x/-3900 Series Yellow HDSP-4030/-4130/-5730/ -4200 Series Features Description • High Light Output Typical Intensities of Up to 7.0 mcd/seg at 100 mA pk 1 of 5 Duty Factor • Capable of High Current Drive Excellent for Long Digit String Multiplexing • Four Character Sizes 7.6 mm, 10.9 mm, 14.2 mm, and 20.3 mm • Choice of Two Colors High Efficiency Red Yellow • Excellent Character Appearance Evenly Lighted Segments Wide Viewing Angle Gray Body for Optimum Contrast • Categorized for Luminous Intensity; Yellow Categorized for Color Use of Like Categories Yields a Uniform Display • IC Compatible • Mechanically Rugged The HDSP-553x/-3900 and HDSP-4030/-4130/-5730/-4200 are 7.6 mm, 10.9 mm/14.2 mm/ 20.3 mm high efficiency red and yellow displays designed for use in high light ambient condition. The four sizes of displays allow for viewing distances at 3, 6, 7, and 10 meters. These seven segment displays utilize large junction high efficiency LED chips made from GaAsP on a transparent GaP substrate. Due to the large junction area, these displays can be driven at high peak current levels needed for high ambient conditions or many character multiplexed operation. These displays have industry standard packages, and pin configurations and ± 1 overflow display are available in all four sizes. These numeric displays are ideal for applications such as Automotive and Avionic Instrumentation, Point of Sale Terminals, and Gas Pump. 2 Devices Part No. HDSP4030 4031 4033 4036 4130 4131 4133 4136 5537 5538 5731 5733 5737 5738 3900 3901 3903 3905 3906 4200 4201 4203 4205 4206 Color Yellow Yellow High Efficiency Red Yellow High Efficiency Red Yellow Description 7.6 mm Common Anode Left Hand Decimal 7.6 mm Common Anode Right Hand Decimal 7.6 mm Common Cathode Right Hand Decimal 7.6 mm Universal Overflow ± 1 Right Hand Decimal 10.9 mm Common Anode Left Hand Decimal 10.9 mm Common Anode Right Hand Decimal 10.9 mm Common Cathode Right Hand Decimal 10.9 mm Universal Overflow ± 1 Right Hand Decimal 14.2 mm Overflow ± 1 Common Anode 14.1 mm Overflow ± 1 Common Cathode 14.2 mm Common Anode Right Hand Decimal 14.2 mm Common Cathode Right Hand Decimal 14.2 mm Overflow ± 1 Common Anode 14.1 mm Overflow ± 1 Common Cathode 20.3 mm Common Left Hand Decimal 20.3 mm Common Anode Right Hand Decimal 20.3 mm Common Cathode Right Hand Decimal 20.3 mm Common Cathode Left Hand Decimal 20.3 mm Universal Overflow ± 1 Right Hand Decimal 20.3 mm Common Left Hand Decimal 20.3 mm Common Anode Right Hand Decimal 20.3 mm Common Cathode Right Hand Decimal 20.3 mm Common Cathode Left Hand Decimal 20.3 mm Universal Overflow ± 1 Right Hand Decimal Package Drawing A B C D E F G H K L I J K L M N O P Q M N O P Q Note: Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams D and H. Absolute Maximum Ratings (All Products) Average Power per Segment or DP (TA = 25°C) ................................................................................. 105 mW Peak Forward Current per Segment or DP (TA = 25°C) ............................... 135 mA (Pulse Width = 0.16 ms) DC Forward Current per Segment[2] or DP (TA = 25°C) ........................................................................ 40 mA Operating Temperature Range ................................................................................................. -40°C to +85°C Storage Temperature Range .................................................................................................... -40°C to +85°C Reverse Voltage per Segment or DP ........................................................................................................ 5.0 V Lead Solder Temperature (1.59 mm [1/16 inch] below seating plane) .................................... 260°C for 3 sec Notes: 1. See Figure 1 to establish pulsed operating conditions 2. Derate maximum DC current above TA = 25°C at 0.50 mA/°C per segment, see Figure 2. 3 Package Dimensions (HDSP-4030 Series) FUNCTION Pin A -4030 B -4031 C -4033 D -4036 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CATHODE-a CATHODE-f ANODE [3] NO PIN NO PIN CATHODE-dp CATHODE-e CATHODE-d NO CONN. [5] CATHODE-c CATHODE-g NO PIN CATHODE-b ANODE [3] CATHODE-a CATHODE-f ANODE [3] NO PIN NO PIN NO CONN. [5] CATHODE-e CATHODE-d CATHODE-dp CATHODE-c CATHODE-g NO PIN CATHODE-b ANODE [3] CATHODE [6] ANODE-f ANODE-g ANODE-e ANODE-d CATHODE [6] ANODE-dp ANODE-c ANODE-b ANODE-a ANODE-d NO PIN CATHODE-d CATHODE-c CATHODE-e ANODE-e ANODE-c ANODE-dp NO PIN CATHODE-dp CATHODE-b CATHODE-a ANODE-a ANODE-b Package Dimensions (HDSP-4130 Series) FUNCTION Pin E -4130 F -4131 G -4133 H -4136 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CATHODE-a CATHODE-f ANODE [3] NO PIN NO PIN CATHODE-dp CATHODE-e CATHODE-d NO CONN. [5] CATHODE-c CATHODE-g NO PIN CATHODE-b ANODE [3] CATHODE-a CATHODE-f ANODE [3] NO PIN NO PIN NO CONN. [5] CATHODE-e CATHODE-d CATHODE-dp CATHODE-c CATHODE-g NO PIN CATHODE-b ANODE [3] ANODE-a ANODE-f CATHODE [6] NO PIN NO PIN NO CONN. [6] ANODE-e ANODE-d ANODE-dp ANODE-c ANODE-g NO PIN ANODE-b CATHODE [8] CATHODE-d ANODE-d NO PIN CATHODE-c CATHODE-e ANODE-e ANODE-c ANODE-dp CATHODE-dp CATHODE-b CATHODE-a NO PIN ANODE-a ANODE-b 4 Package Dimensions (-553x/-5730 Series) FUNCTION Pin 1 2 3 4 5 6 7 8 9 10 Package Dimensions (-3900/-4200 Series) K -5537 CATHODE-c ANODE-c,d CATHODE-b ANODE-a,b, DP CATHODE DP CATHODE-a ANODE-a,b, DP ANODE-c,d CATHODE-d NO PIN [5] L -5538 ANODE-c CATHODE-c,d ANODE-b CATHODE-a,b DP ANODE DP ANODE-a CATHODE-a,b, DP CATHODE-c,d ANODE-d NO PIN [5] 5 Internal Circuit Diagram (HDSP-4030 Series) Internal Circuit Diagram (HDSP-4130 Series) Internal Circuit Diagram (HDSP-553x/-5730 Series) 6 Internal Circuit Diagram (HDSP-3900/-4200 Series) Electrical/Optical Characteristics at TA = 25°C Parameter Luminous Intensity/ Segment[9,10] (Digit Average) Peak Wavelength Dominant Wavelength[11,12] (Digit Average) Forward Voltage/Seg or D.P. Reverse Current/Seg or D.P. Temp. Coeff. of VF/Seg or D.P. Thermal Resistance LED Junction-to-Pin Sym. IV λPEAK λd VF IR ∆VF/°C RθJ-PIN Device HDSP553x 3900 553x 3900 4030 4130 5730 4200 4030 4130 5730 4200 553x/3900 4030/4130/ 5730/4200 553x/3900 4030/4130/ 5730/4200 All Devices All Devices All Devices 4030/4130 553x/5730 3900/4200 Min. 2200 2200 1500 1500 2200 2200 581.5 Typ. 7000 7000 Max. Units µcd Test Condition 100 mA Pk 1 of 5 Duty Factor 4800 4800 4500 5000 7000 7000 2200 2500 3400 3400 635 583 µcd 20 mA DC µcd 100 mA Pk; 1 of 5 Duty Factor µcd 20 mA DC 626 586 nm nm 2.6 –1.1 282 345 375 nm nm 592.5 3.5 100 V µA mV/°C °C/W/Seg °C/W/Seg °C/W/Seg IF = 100 mA VR = 3.0 V IF = 100 mA Notes: 9. Case temperature of the device immediately prior to the intensity measurement is 25°C. 10. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package. 11. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device. 12. The yellow displays are categorizes as to dominant wavelength with the category designated by a number adjacent to the intensity category letter. 7 Figure 1. Maximum Allowed Peak Current vs. Pulse Duration. HDSP-553x/-3900 Series HDSP-553x/-3900 Series Figure 2. Maximum Allowable DC Current per Segment vs. Ambient Temperature. Figure 3. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Segment Current. Electrical These display devices are composed of eight light emitting diodes, with light from each LED optically stretched to form individual segments and a decimal point. The devices utilize LED chips which are made from GaAsP on a transparent GaP substrate. Figure 5. Relative Luminous Intensity vs. DC Forward Current. These display devices are designed for strobed operation. The typical forward voltage values, scaled from Figure 4, should be used for calculating the current limiting resistor value and typical power dissipation. Figure 4. Peak Forward Segment Current vs. Peak Forward Voltage. Expected maximum VF values, for the purpose of driver circuit design and maximum power dissipation, may be calculated using the following VF MAX models: VF MAX = 2.15 V + IPEAK (13.5 Ω) For: IF ≥ 30 mA VF MAX = 1.9 V + IDC (21.8 Ω) For: 10 mA ≤ IF ≤ 30 mA Temperature derated strobed operating conditions are obtained from Figures 1 and 2. Figure 1 relates pulse duration (tp), refresh rate (f), and the ratio of maximum peak current to maximum dc current (IPEAK MAX/IDC MAX). Figure 2 presents the maximum allowed dc current vs. ambient temperature. Figure 1 is based on the principle that the peak junction temperature for pulsed operation at a specified peak current, pulse duration and refresh rate should be the same as the junction temperature at maximum DC operation. Refresh rates of 1 kHz or faster minimize the pulsed junction heating effect of the device resulting in the maximum possible time average luminous intensity. Mechanical Contrast Enhancement These devices are constructed utilizing a lead frame in a standard DIP package. The LED dice are attached directly to the lead frame. Therefore, the cathode leads are the direct thermal and mechanical stress paths to the LED dice. The absolute maximum allowed junction temperature, TJ MAX, is 105°C. The maximum power ratings have been established so that the worst case VF device does not exceed this limit. The objective of contrast enhancement is to optimize display readability. Adequate contrast enhancement can be achieved in indoor applications through luminous contrast techniques. Luminous contrast is the observed brightness of the illuminated segment compared to the brightness of the surround. Appropriate wavelength filters maximize luminous contrast by reducing the amount of light reflected from the area around the display while transmitting most of the light emitted by the segment. These filters are described further in Application Note 1015. The time average luminous intensity can be calculated knowing the average forward current and relative efficiency characteristic, η |PEAK, of Figure 3. Time average luminous intensity for a device case temperature of 25°C, I V (25°C), is calculated as follows: Worst case thermal resistance pin-to-ambient is 400°C/W/Seg when these devices are soldered into minimum trace width PC boards. When installed in a PC board that provides RθPIN-A less than 400°C/W/Seg these displays may be operated at higher average currents as shown in Figure 2. IAVG IV (25°C) = [ –––––] [η|PEAK] [IV DATA SHEET] 20 mA Optical Example: For HDSP-4030 series η |PEAK = 1.00 at IPEAK = 100 mA. For DF = 1/5: 20 mA IV (25°) = [––––––] [1.00][4.5 mcd] 20 mA The radiation pattern for these devices is approximately Lambertian. The luminous sterance may be calculated using one of the two following formulas. IV(cd) LV (cd/m2) = –––––– A(m2) = 4.5 mcd/segment The time average luminous intensity may be adjusted for operating junction temperature by the following exponential equation: IV (TJ) = IV (25°C) e[k(TJ + 25°C)] where T J = TA + PD • RθJ-A Device -553x/-3900 -4030/-4130/ -5730/-4200 K -0.0131/°C -0.0112/°C πIV (cd) LV (footlamberts) = ––––––– A(ft2) Device -4030 -4130 -553x/-5730 -3900/-4200 Chrominance contrast can further improve display readability. Chrominance contrast refers to the color difference between the illuminated segment and the surrounding area. These displays are assembled with a gray package and untinted encapsulating epoxy in the segments to improve chrominance contrast of the ON segments. Additional contrast enhancement in bright ambients may be achieved by using a neutral density gray filter such as Panelgraphic Chromafilter Gray 10, or 3M Light Control Film (louvered film). Area/Seg. Area/Seg. mm2 in2 2.5 0.0039 4.4 0.0068 8.8 0.0137 14.9 0.0231 www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. March 10, 2001 Obsoletes 5964-6374E (11/99) 5988-1734EN