Surface Mount RF Schottky Diodes in SOT-323 (SC-70) Technical Data HSMS-280A Series HSMS-281A Series HSMS-282A Series Features • Surface Mount SOT-323 Package • Low Turn-On Voltage (As Low as 0.34 V at 1 mA) • Low FIT (Failure in Time) Rate* • Six-sigma Quality Level • Single and Dual Versions Package Lead Code Identification (Top View) SINGLE SERIES B COMMON ANODE C COMMON CATHODE E F • Tape and Reel Options Available * For more information see the Surface Mount Schottky Reliability Data Sheet. Absolute Maximum Ratings, TC= 25ºC Symbol Parameter If PIV TJ TSTG θ jc Unit Absolute Maximum [1] Forward Current (1µs Pulse) Amp Peak Inverse Voltage V Junction Temperature °C Storage Temperature °C [2] Thermal Resistance °C/W 1 Same as VBR 150 -65 to 150 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. Description/Applications These Schottky diodes are specifically designed for analog and digital applications requiring devices in SOT-323 surface mount packages. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. Typical applications of these Schottky diodes are mixing, detecting, switching, sampling, clamping, and wave shaping. 2 Electrical Specifications, TC = +25°C, Single Diode [1] Part Package Number Marking Lead HSMS- Code[2] Code Configuration 280B A0 280C A2 280E A3 280F A4 281B B0 281C B2 281E B3 281F B4 282B C0 282C C2 282E C3 282F C4 Test Conditions B C E F B C E F B C E F Minimum Breakdown Voltage VBR (V) Maximum Forward Voltage VF (mV) 70 400 1.0 15 200 50 2.0 35 20 400 1.0 35 200 15 1.2 15 15 340 0.7 30 100 1 1.0 12 VF = 0 V IF = 5 mA Single Series Common Anode Common Cathode Single Series Common Anode Common Cathode Single Series Common Anode Common Cathode Maximum Forward Voltage VF (V) @ IF (mA) Maximum Typical Reverse Maximum Dynamic Leakage Capacitance Resistance IR (nA) @ CT (pF) RD (Ω) VR (V) IR = 10 µA IF = 1 mA[3] f = 1 MHz [4] Notes: 1. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA, except HSMS-282X which is measured at 20 mA. 2. Package marking code is laser marked. 3. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA. 4. ∆CTO for diodes in pairs is 0.2 pF maximum. Typical Performance, TC = 25°C (unless otherwise noted), Single Diode 10 1 TA = +125°C TA = +75°C TA = +25°C TA = –25°C 0.1 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 VF – FORWARD VOLTAGE (V) Figure 1. Forward Current vs. Forward Voltage at Temperatures— HSMS-280A Series. 100 10 1 TA = +125°C TA = +75°C TA = +25°C TA = –25°C 0.1 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF – FORWARD VOLTAGE (V) Figure 2. Forward Current vs. Forward Voltage at Temperatures— HSMS-281A Series. I F – FORWARD CURRENT (mA) 100 I F – FORWARD CURRENT (mA) I F – FORWARD CURRENT (mA) 100 TA = +125°C TA = +75°C TA = +25°C TA = –25°C 10 1 0.1 0.01 0 0.10 0.20 0.30 0.40 0.50 VF – FORWARD VOLTAGE (V) Figure 3. Forward Current vs. Forward Voltage at Temperatures— HSMS-282A Series. 3 Typical Performance, TC = 25°C (unless otherwise noted), Single Diode, continued 10,000 10,000 10,000 1000 100 TA = +125°C TA = +75°C TA = +25°C 10 1 0 10 20 30 40 1000 100 TA = +125°C TA = +75°C TA = +25°C 10 1 50 0 VR – REVERSE VOLTAGE (V) 10 10 HSMS-2800 SERIES HSMS-2810 SERIES HSMS-2820 SERIES 10 0.8 0.6 0.4 0.2 0 4 6 1 0.5 8 VR – REVERSE VOLTAGE (V) Figure 10. Total Capacitance vs. Reverse Voltage—HSMS-282A Series. 10 15 Figure 6. Reverse Current vs. Reverse Voltage at Temperatures— HSMS-282A Series. 1 0.75 0.50 0.25 0 0 10 20 30 40 50 Figure 8. Total Capacitance vs. Reverse Voltage—HSMS-280A Series. 1 2 1.5 VR – REVERSE VOLTAGE (V) Figure 7. Dynamic Resistance vs. Forward Current. 5 1.25 0 100 I F – FORWARD CURRENT (mA) 0 1 VR – REVERSE VOLTAGE (V) C T – CAPACITANCE (pF) C T – CAPACITANCE (pF) 100 1 TA = +125°C TA = +75°C TA = +25°C 10 0 2 1 0.1 100 15 Figure 5. Reverse Current vs. Reverse Voltage at Temperatures— HSMS-281A Series. 1000 RD – DYNAMIC RESISTANCE (Ω) 5 1000 VR – REVERSE VOLTAGE (V) Figure 4. Reverse Current vs. Reverse Voltage at Temperatures— HSMS-280A Series. C T – CAPACITANCE (pF) I R – REVERSE CURRENT (nA) 100,000 I R – REVERSE CURRENT (nA) 100,000 I R – REVERSE CURRENT (nA) 100,000 0 2 4 6 8 10 12 14 16 VR – REVERSE VOLTAGE (V) Figure 9. Total Capacitance vs. Reverse Voltage—HSMS-281A Series. 4 SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 11 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.07 0.035 0.016 Figure 11. PCB Pad Layout (dimensions in inches). passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323 package, will reach solder reflow temperatures faster than those with a greater mass. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 °C. HP’s SOT-323 diodes have been qualified to the time-temperature profile shown in Figure 12. This profile is representative of an IR reflow type of surface mount assembly process. These parameters are typical for a surface mount assembly process for HP SOT-323 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) 250 TMAX 200 TEMPERATURE (°C) Assembly Instructions 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 12. Surface Mount Assembly Profile. 240 300 5 Package Dimensions Outline SOT-323 (SC-70 3 Lead) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 0.650 BSC (0.025) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.30 REF. 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 10° 0.30 (0.012) 0.10 (0.004) 0.20 (0.008) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) Part Number Ordering Information Part Number HSMS-28XA-TR1* HSMS-28XA-BLK* No. of Devices 3000 100 * where X = 0, 1, or 2; A = B, C, E, or F Container 7" Reel antistatic bag Tape Dimensions and Product Orientation For Outline SOT-323 (SC-70 3 Lead) P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 8° MAX. A0 DESCRIPTION 5° MAX. B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.24 ± 0.10 2.34 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.088 ± 0.004 0.092 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.255 ± 0.013 0.315 ± 0.012 0.010 ± 0.0005 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 www.hp.com/go/rf For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5965-4705E Printed in U.S.A. 5966-4901E (3/98)