Surface Mount PIN Diodes in SOT-323 (SC-70) Technical Data HSMP-381A Series HSMP-386A Series HSMP-389A Series Features • Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation • Surface Mount SOT-323 (SC-70)Package Single and Pair Versions Tape and Reel Options Available • Low Failure in Time (FIT) Rate* Package Lead Code Identification (Top View) SINGLE SERIES B C COMMON ANODE COMMON CATHODE E F Description/Applications The HSMP-381A series is specifically designed for low distortion attenuator applications. The HSMP-386A series is a general purpose PIN diode designed for low current attenuators and low cost switches. The HSMP-389A series is optimized for switching applications where low resistance at low current, and low capacitance are required. * For more information see the Surface Mount PIN Reliability Data Sheet. Absolute Maximum Ratings [1], TC = + 25°C Symbol Parameter If Piv TJ TSTG θjc Unit Absolute Maximum Forward Current (1 µs Pulse) Amp Peak Inverse Voltage V Junction Temperature °C Storage Temperature °C [2] Thermal Resistance °C/W 1 Same as VBR 150 -65 to 150 300 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = 25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. 2-63 5966-0939E Electrical Specifications, TC = +25°C, each diode PIN Attenuator Diodes Minimum Maximum Maximum Minimum Maximum Breakdown Total Total High Low Voltage Resistance Capacitance Resistance Resistance VBR (V) RT (Ω) CT (pF) RH (Ω) RL (Ω) Part Package Number Marking Lead HSMP- Code[1] Code Configuration 381B E0 381C E2 381E E3 381F E4 Test Conditions B C E F Single Series Common Anode Common Cathode 100 3.0 0.35 1500 VR = VBR Measure IR ≤ 10 µA IF = 100 mA f = 100 MHz VR = 50 V f = 1 MHz 10 IR = 0.01 mA IF = 20 mA f = 100 MHz f = 100 MHz PIN General Purpose Diodes Part Number HSMP- Package Marking Code[1] 386B L0 386C L2 386E L3 386F L4 Test Conditions Lead Code Configuration B C E F Single Series Common Anode Common Cathode Minimum Breakdown Voltage VBR (V) 50 Typical Total Resistance RT (Ω) 3.0 1.5* Typical Total Capacitance CT (pF) 0.20 VR = VBR Measure IR ≤ 10 µA IF = 10 mA f = 100 MHz IF = 100 mA* VR = 50 V f = 1 MHz Minimum Breakdown Voltage VBR (V) Maximum Total Resistance RT (Ω) Maximum Total Capacitance CT (pF) 100 2.5 0.30 VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz VR = 5 V f = 1 MHz PIN Switching Diodes Part Number HSMP- Package Marking Code[1] 389B G0 389C G2 389E G3 389F G4 Test Conditions Lead Code Configuration B C E F Single Series Common Anode Common Cathode Typical Parameters at TC = +25°C Part Number HSMP381A Series 386A Series 389A Series Test Conditions Total Resistance Carrier Lifetime RT (Ω) τ (ns) 75 22 3.8 IF = 1 mA f = 100 MHz 1500 500 200* IF = 50 mA TR = 250 mA IF = 10 mA* IR = 6 mA* Note: 1. Package marking code is laser marked. 2-64 Reverse Recovery Time Trr (ns) Total Capacitance (pF) 300 80 — VR = 10 V IF = 20 mA 90% Recovery 0.27 0.20 — 50 V Typical Performance, TC = 25°C 0.35 0.35 1 MHz 0.30 30 MHz 0.20 frequency>100 MHz 0 2 4 6 8 1 MHz 0.25 100 MHz 0.20 1 GHz 0.15 10 12 14 16 18 20 0 Figure 1. RF Capacitance vs. Reverse Bias, HSMP-381A Series. 6 8 10 12 14 16 18 20 100 10 1.2 1 0.8 0.6 0.4 0 HSMP-3880 HSMP-389A 100 95 HSMP-386A 90 85 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 7. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes. 0 10 20 30 40 Diode Mounted as a 110 Series Attenuator in a 50Ω Microstrip and 100 Tested at 123 MHz 90 80 70 HSMP-381A 60 50 40 1000 50 100 10 DIODE RF RESISTANCE (OHMS) Figure 5. Capacitance vs. Reverse Voltage at 1 MHz. Figure 6. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuator Diodes. 1000 200 Trr - REVERSE RECOVERY TIME (nS) 105 1 VR – REVERSE VOLTAGE (V) Figure 4. RF Resistance vs. Forward Bias Current for HSMP-381A Series. Diode Mounted as a 115 Series Switch in a 50Ω Microstrip and 110 Tested at 123 MHz 10 120 HSMP-381A HSMP-386A HSMP-389A 0.2 120 HSMP-386A Figure 3. Total RF Resistance at 25°C vs. Forward Bias Current. 1.4 1.0 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) INPUT INTERCEPT POINT (dBm) 4 Figure 2. RF Capacitance vs. Reverse Bias, HSMP-386A Series. CT – CAPACITANCE (pF) TOTAL RF RESISTANCE (OHMS) 1000 2 REVERSE VOLTAGE (V) TA = +85°C TA = +25°C TA = –55°C 100 HSMP-389A REVERSE VOLTAGE (V) 10000 1000 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) INPUT INTERCEPT POINT (dBm) 0.15 0.30 VR = 5V VR = 10V 100 VR = 20V 10 10 20 30 FORWARD CURRENT (mA) Figure 8. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-386A Series. 2-65 Trr – REVERSE RECOVERY TIME (nS) 0.25 RF RESISTANCE (OHMS) 0.40 10000 HSMP-381A TOTAL CAPACITANCE (pF) TOTAL CAPACITANCE (pF) 0.45 160 VR = –2V 120 80 VR = –5V 40 VR = –10V 0 10 15 20 25 30 FORWARD CURRENT (mA) Figure 9. Typical Reverse Recovery Time vs. Reverse Voltage. HSMP-389A Series. Typical Performance, TC = 25°C 100 10 1 0.1 0.01 125°C 0 0.2 0.4 25°C –50°C 0.6 0.8 10 1 0.1 0.01 1.0 100 IF – FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) 100 1.2 125°C 0 0.4 25°C –50°C 0.6 0.8 1.0 1.2 VF – FORWARD VOLTAGE (V) VF – FORWARD VOLTAGE (mA) Figure 10. Forward Current vs. Forward Voltage. HSMP-381A Series. 0.2 Figure 11. Forward Current vs. Forward Voltage. HSMP-386A Series. 10 1 0.1 0.01 125°C 25°C –50°C 0 0.2 0.4 0.6 0.8 1.0 1.2 VF – FORWARD VOLTAGE (V) Figure 12. Forward Current vs. Forward Voltage. HSMP-389A Series. Typical Applications for Multiple Diode Products RF COMMON RF COMMON RF 1 RF 1 BIAS 1 RF 2 RF 2 BIAS 2 Figure 13. Simple SPDT Switch, Using Only Positive Bias Current. BIAS Figure 14. High Isolation SPDT Switch. 2-66 BIAS Typical Applications for Multiple Diode Products (continued) RF COMMON RF COMMON BIAS RF 1 RF 2 RF 2 RF 1 BIAS Figure 15. SPDT Switch Using Both Positive and Negative Bias Current. Figure 16. Very High Isolation SPDT Switch. VARIABLE BIAS RF IN/OUT INPUT FIXED BIAS VOLTAGE Figure 17. Four Diode π Attenuator. BIAS HSMP-389U λ/4 @ 900 MHz diplexer PA LNA HSMP-389U PA λ/4 @ 1.8 GHz LNA Figure 18. High Isolation SPST Switch (Repeat Cells as Required). Figure 19. Dualmode 900/1800 MHz Tx/Rx Switch. 2-67 SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT-323 (SC-70) package is shown in Figure 20 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance. 0.026 0.07 0.035 0.016 Figure 20. PCB Pad Layout (dimensions in inches). SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323 package, will reach solder reflow temperatures faster than those with a greater mass. HP’s SOT-323 diodes have been qualified to the time-temperature profile shown in Figure 21. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 °C. These parameters are typical for a surface mount assembly process for HP SOT-323 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 250 TMAX 200 TEMPERATURE (°C) Assembly Information 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 21. Surface Mount Assembly Profile. 2-68 240 300 Device Orientation REEL TOP VIEW END VIEW 4 mm 8 mm CARRIER TAPE USER FEED DIRECTION ## ## ## ## Note: “##” represents Package Marking Code. COVER TAPE Tape Dimensions For Outline SOT-323 (SC-70 3 Lead) P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 8° MAX. A0 DESCRIPTION 5° MAX. B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.24 ± 0.10 2.34 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.088 ± 0.004 0.092 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.255 ± 0.013 0.315 ± 0.012 0.010 ± 0.0005 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 2-69 Package Dimensions Outline SOT-323 (SC-70) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 0.650 BSC (0.025) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.30 REF. 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 10° 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Characteristics Lead Material .............................................................................. Copper Lead Finish ................................................................... Tin-Lead 85/15% Maximum Soldering Temperature .......................... 260°C for 5 seconds Minimum Lead Strength .................................................... 2 pounds pull Typical Package Inductance ........................................................... 2 nH Typical Package Capacitance ........................... 0.08 pF (opposite leads) Ordering Information Specify part number followed by option. For example: HSMP- 38XA – XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Hewlett-Packard Option – BLK = Bulk, 100 pcs. per antistatic bag Option – TR1 = Tape and Reel, 3000 devices per 7" reel Conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Standard Quantity is 3,000␣ Devices per Reel. 2-70