ETC STB3N60-1

STB3NA60-1
N - CHANNEL ENHANCEMENT MODE
FAST POWER MOS TRANSISTOR
PRELIMINARY DATA
TYPE
STB3NA60-1
■
■
■
■
■
■
■
V DSS
R DS(on)
ID
600 V
<4Ω
2.9 A
TYPICAL RDS(on) = 0.7 Ω
AVALANCHE RUGGED TECHNOLOGY
± 30V GATE TO SOURCE VOLTAGE RATING
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLIES (SMPS)
■ DC-DC & DC-AC CONVERTERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)
■
3
12
I2PAK
TO-262
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
VDGR
V GS
Value
Unit
Drain-source Voltage (V GS = 0)
Parameter
600
V
Drain- gate Voltage (R GS = 20 kΩ)
600
V
± 30
V
Gate-source Voltage
o
ID
Drain Current (continuous) at T c = 25 C
2.9
A
ID
Drain Current (continuous) at T c = 100 o C
1.8
A
11.6
A
I DM (•)
P tot
Drain Current (pulsed)
o
Total Dissipation at T c = 25 C
Derating Factor
T stg
Tj
Storage Temperature
Max. Operating Junction Temperature
80
W
0.64
W/ o C
-65 to 150
o
C
150
o
C
(•) Pulse width limited by safe operating area
March 1996
1/9
STB3NA60-1
THERMAL DATA
R thj-case
R thj-amb
R thj-amb
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Maximum Lead Temperature For Soldering Purpose
o
1.56
62.5
0.5
300
Max
Max
Typ
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max, δ < 1%)
2.9
A
E AS
Single Pulse Avalanche Energy
(starting T j = 25 o C, ID = I AR , V DD = 50 V)
42
mJ
EAR
Repetitive Avalanche Energy
(pulse width limited by T j max, δ < 1%)
1.6
mJ
I AR
Avalanche Current, Repetitive or Not-Repetitive
(T c = 100 o C, pulse width limited by T j max, δ < 1%)
1.8
A
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbol
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Conditions
I D = 250 µA
V GS = 0
I DSS
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating x 0.8
I GSS
Gate-body Leakage
Current (V DS = 0)
Min.
Typ.
Max.
600
Unit
V
250
1000
µA
µA
±100
nA
Typ.
Max.
Unit
3
3.75
V
3.3
4
8
Ω
T c = 125 o C
V GS = ± 30 V
ON (∗)
Symbol
Parameter
Test Conditions
V GS(th)
Gate Threshold Voltage V DS = VGS
R DS(on)
Static Drain-source On
Resistance
ID(on)
ID = 250 µA
V GS = 10 V
V GS = 10 V
Min.
2.25
I D = 1.5 A
I D = 1.5 A T C = 100 o C
On State Drain Current V DS > I D(on) x R DS(on)max V GS = 10 V
2.9
A
DYNAMIC
Symbol
g fs (∗)
C iss
C oss
C rss
2/9
Parameter
Test Conditions
Forward
Transconductance
V DS > I D(on) x R DS(on)max
I D = 1.5 A
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
V GS = 0
f = 1 MHz
Min.
Typ.
1
2
380
57
17
Max.
Unit
S
500
75
23
pF
pF
pF
STB3NA60-1
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
Typ.
Max.
Unit
Turn-on Time
Rise Time
Parameter
V DD = 300 V
I D = 1.5 A
R G = 18 Ω
V GS = 10 V
(see test circuit, figure 3)
Test Conditions
Min.
14
25
20
35
ns
ns
Turn-on Current Slope
V DD = 400 V
ID = 3 A
R G = 18 Ω
V GS = 10 V
(see test circuit, figure 5)
300
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
ID = 3 A
V DD = Max Rating x 0.8
V GS = 10 V
A/µs
22
6
9
30
nC
nC
nC
Typ.
Max.
Unit
13
24
12
18
34
17
ns
ns
ns
Typ.
Max.
Unit
2.9
11.6
A
A
1.5
V
SWITCHING OFF
Symbol
t r(Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
Min.
V DD = 480 V
ID = 3 A
R G = 18 Ω
V GS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Min.
I SD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 2.9 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 3 A
di/dt = 100 A/µs
V DD = 100 V
T j = 150 o C
(see test circuit, figure 5)
t rr
Q rr
I RRM
V GS = 0
460
ns
5.6
µC
24
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/9
STB3NA60-1
Derating Curve
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
4/9
STB3NA60-1
Capacitance Variations
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Turn-on Current Slope
Turn-off Drain-source Voltage Slope
Cross-over Time
5/9
STB3NA60-1
Switching Safe Operating Area
Accidental Overload Area
Source-drain Diode Forward Characteristics
Fig. 1: Unclamped Inductive Load Test Circuit
6/9
Fig. 2: Unclamped Inductive Waveform
STB3NA60-1
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And DIode Recovery Times
7/9
STB3NA60-1
TO-262 (I2PAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
4.3
4.6
0.169
0.181
A1
2.49
2.69
0.098
0.106
B
0.7
0.93
0.027
0.036
B1
1.2
1.38
0.047
0.054
B2
1.25
1.4
0.049
0.055
C
0.45
0.6
0.017
0.023
C2
1.21
1.36
0.047
0.053
D
9
9.35
0.354
0.368
e
2.44
2.64
0.096
0.104
E
10
10.28
0.393
0.404
L
13.2
13.5
0.519
0.531
L1
3.48
3.78
0.137
0.149
L2
1.27
1.37
0.050
0.054
E
e
B
B2
C2
A1
A
C
A
L1
L2
8/9
MAX.
D
L
STB3NA60-1
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
© 1995 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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