PR31MA11NTZ PR31MA11NTZ 6-pin DIP Type SSR for Low Power Control ■ Features ■ Outline Dimensions 1. Low operating current type (IT (rms) =60mA) 2. Compact 5-pin dual-in-line package type Internal connection diagram 5 4 R31MA1 1. Home appliances Viso (rms) Topr Tstg Tsol 5.0 −30 to +80 −55 to +125 260 kV °C °C °C 3 0.6±0.2 1.2±0.3 2 7.62±0.3 7.12±0.3 0.5±0.1 1 2 3 ❈ Pin 5 0.26±0.1 θ 2.54±0.25 Anode Cathode NC 3 0.5 V *1 50Hz sine wave *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s Notice 1 4 TYP. 600 2 3.25±0.5 3.5±0.5 VDRM 1 2.9±0.5 Input Output Rating 50 6 60 1.2 (Ta=25°C) Unit mA V mA A Parameter Symbol IF Forward current VR Reverse voltage IT (rms) RMS ON-state current *1 Isurge Peak one cycle surge current Isolation voltage Operating temperature Storage temperature *3 Soldering temperature 5 NC ■ Absolute Maximum Ratings *2 6 6.5±0.3 6 Anode mark ■ Applications Repetitive peak OFF-state voltage (Unit : mm) 4 5 6 θ=0 to 13˚ θ Anode, Cathode No external connection Anode, Cathode is not allowed external connection In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/ PR31MA11NTZ ■ Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF Reverse current IR Repetitive peak OFF-state current IDRM ON-state voltage VT IH Holding current Critical rate of rise of OFF-state voltage dV/dt IFT Minimum trigger current Isolation resistance RISO Turn-on time ton 70 60 60 50 50 40 30 MIN. − − − − 0.1 500 − 5×1010 − TYP. 1.2 − − − 1.0 − − 1011 − 20 40 30 20 0 50 0 −30 100 Ambient temperature Ta (˚C) 0 50 100 Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 12 Minimum trigger current IFT (mA) Forward current IF (mA) 100 20 Ta=75˚C 50˚C 25˚C 0˚C −25˚C 10 5 2 1 0.9 (Ta=25˚C) Unit V µA µA V mA V/µs mA Ω µs 10 0 −30 50 MAX. 1.4 10 1 2.5 3.5 − 10 − 100 Fig.2 Forward Current vs. Ambient Temperature Forward current IF (mA) RMS ON-state current IT (mA) Fig.1 RMS ON-state Current vs. Ambient Temperature Conditions IF=20mA VR=3V VD =VDRM IT=60mA VD=6V − VD=(1/√2 )•VDRM VD=6V, RL=100Ω DC=500V, 40 to 60%RH VD=6V, RL=100Ω, IF=20mA 1.0 1.1 1.2 1.3 Forward voltage VF (V) 1.4 1.5 VD =6V RL =100Ω 10 8 6 4 2 0 −30 0 20 40 60 Ambient temperature Ta (˚C) 80 100 PR31MA11NTZ Fig.5 ON-state Voltage vs. Ambient Temperature 2.00 Fig.6 Relative Holding Current vs. Ambient Temperature 1 000 Relative holding current IH(t˚C)/IH(25˚C)×100% IT =60mA 1.90 ON-state voltage VT (V) 1.80 1.70 1.60 1.50 1.40 1.30 1.20 1.10 1.00 −40 −20 0 20 40 60 80 100 VD =6V 100 10 −40 −20 Ambient temperature Ta (˚C) 0 20 40 60 Fig.7 ON-state Current vs. ON-state Voltage 100 Fig.8 Turn-on Time vs. Forward Current 100 100 VD =6V RL=100Ω IF =20mA IF =20mA Ta=25˚C Turn-on time ton (µs) 80 ON-state current IT (mA) 80 Ambient temperature Ta (˚C) 60 40 10 20 0 0 0.5 1 1.5 ON-state voltage VT (V) 2 1 10 20 30 40 50 Forward current IF (mA) 60 70 PR31MA11NTZ ■ Basic Operation Circuit R1 +VCC 1 D1 ZS SSR 2 Load 6 AC 100V AC 200V 4 VI ZS :Surge absorption circuit Tr1 (1) DC Drive (2) Pulse Drive (3) Phase Control AC supply voltage Input signal Load current (for resistance load) Notes 1) 2) 3) If large amount of surge is loaded onto VCC or the driver circuit, add a diode D1 between terminals 1 and 2 to prevent reverse bias from being applied to the infrared LED. Be sure to install a surge absorption circuit. An appropriate circuit must be chosen according to the load (for CR, choose its constant). This must be carefully done especially for an inductive load. For phase control, adjust such that the load current immediately after the input signal is applied will be more than 10mA. NOTICE ● The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. ● Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. ● Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: - - - Personal computers - -- Office automation equipment - -- Telecommunication equipment [terminal] - - - Test and measurement equipment - - - Industrial control - -- Audio visual equipment - -- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: - -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) - - - Traffic signals - - - Gas leakage sensor breakers - - - Alarm equipment - -- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: - - - Space applications - -- Telecommunication equipment [trunk lines] - -- Nuclear power control equipment - -- Medical and other life support equipment (e.g., scuba). ● If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. ● This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. ● Contact and consult with a SHARP representative if there are any questions about the contents of this publication.