PR3BMF11NSZ PR3BMF11NSZ 8-Pin DIP Type SSR for Low Power Control ■ Features ■ Outline Dimensions 2.54 Brand name "S" 8 6 Rank mark 5 A 1 Anode mark 1 2 (Unit : mm) ±0.25 3 A (Model No.) R3BMF1 6.5±0.5 1. Compact 8-pin dual-in-line package type 2. RMS ON-state current IT(rms):1.2A (Ta≤25˚C) 3. High repetitive peak OFF-state voltage (VDRM:MIN. 600V) 4. Isolation voltage between input and output (Viso(rms):4kV) 5. Recognized by UL (No. E94758) 6. Recognized by CSA (No. LR63705) 4 1.2±0.3 9.66±0.5 7.62±0.3 0.5TYP. 3.5±0.5 ■ Applications Output Input (Ta=25°C) Parameter Symbol Rating Unit *1 Forward current 50 mA IF V VR Reverse voltage 6 *1 A 1.2 RMS ON-state current IT (rms) Isurge A 12 (50Hz sine wave) Peak one cycle surge current V 600 Repetitive peak OFF-state voltage VDRM *2 Viso (rms) Isolation voltage kV 4.0 −30 to 105 Topr Operating temperature °C −40 to 125 Tstg Storage temperature °C °C Soldering temperature Tsol 260 (For 10s) *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.1, 2 *2 40 to 60%RH, AC for 1 minute, f=60Hz 3.25±0.5 ■ Absolute Maximum Ratings 2.9±0.5 1. Various types of home appliances. 0.5±0.1 0.26±0.1 θ:0 to 13˚ θ Internal connection Diagram 8 1 1 2 3 4 2 Cathode Anode Cathode Cathode 6 5 3 4 5 6 8 G T1 T2 Terminal 1 , 3 and 4 are common ones of cathode.To radiate the heat, solder all of the lead pins on the pattern of PWB. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/ PR3BMF11NSZ ■ Electrical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF Reverse current IR Repetitive peak OFF-state current IDRM ON-state voltage VT IH Holding current Critical rate of rise of OFF-state voltage dV/dt Minimum trigger current IFT Isolation resistance RISO ton Turn-on time 1.4 60 1.2 50 1.0 0.8 0.6 CONDITION ∗No heat sink ∗Paper phenol boad: 100mm×100mm×1.6mm ∗All pins should be installed in the print board with soldering ∗Solder land:140mm2 (the total of all solder land area) 0.4 0.2 TYP. 1.2 − − − − − − 1011 − (Ta=25˚C) Unit V µA µA V mA V/µs mA Ω − µs 100 MAX. 1.4 10 100 3.0 25 − 10 40 30 20 10 0 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 0 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 200 12 Ta=75˚C 50˚C 50 Minimum trigger current IFT (mA) 100 Forward current IF (mA) MIN. − − − − − 100 − 5×1010 − Fig.2 Forward Current vs. Ambient Temperature Forward current IF (mA) RMS ON-state current IT (rms) (A) Fig.1 RMS ON-state Current vs. Ambient Temperature Conditions IF=20mA VR=3V VD=VDRM IT=1.2A VD=6V − VD=1/√ 2 • VDRM VD=6V, RL=100Ω DC=500V, 40 to 60%RH VD=6V, RL=100Ω, IF=20mA 0˚C 25˚C −25˚C 20 10 5 2 1 0 0.5 1 1.5 2 Forward voltage VF (V) 2.5 3 VD=6V RL=100Ω 10 8 6 4 2 0 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 Ambient temperature Ta (˚C) PR3BMF11NSZ Fig.5 ON-state Voltage vs. Ambient Temperature Fig.6 Relative Holding Current vs. Ambient Temprature 1000 1.4 Relative holding current IH (t˚C) / IH (25˚C)×100% IT=1.2A ON-state voltage VT (V) 1.3 1.2 1.1 1 0.9 100 101 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 0.8 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.7 ON-state Current vs. ON-state Voltage 2.1 1 000 1.5 Turn-on time tON (µs) ON-state current IT (A) Fig.8 Turn-on Time vs. Forward Current IF=20mA Ta=25˚C 1.8 VD=6V 1.2 0.9 0.6 VD=6V RL=100Ω Ta=25˚C 100 10 0.3 0 0 0.5 1 ON-state voltage VT (V) 1.5 1 10 20 30 40 50 Forward current IF (mA) 100 NOTICE ● The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. ● Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. ● Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: - - - Personal computers - -- Office automation equipment - -- Telecommunication equipment [terminal] - - - Test and measurement equipment - - - Industrial control - -- Audio visual equipment - -- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: - -- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) - - - Traffic signals - - - Gas leakage sensor breakers - - - Alarm equipment - -- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: - - - Space applications - -- Telecommunication equipment [trunk lines] - -- Nuclear power control equipment - -- Medical and other life support equipment (e.g., scuba). ● If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. ● This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. 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