INTEGRATED CIRCUITS 74F1240 Octal inverter buffer (3-State) Product specification Supercedes data of 1999 Jan 08 IC15 Data Handbook Powered by ICminer.com Electronic-Library Service CopyRight 2003 2000 Jun 30 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 FEATURES • High impedance NPN base inputs for reduced loading TYPE TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT (TOTAL) 74F1240 3.5ns 40mA (20µA in High and Low states) • Low power, light loading • Functional pin-for-pin equivalent of 74F240 • 1/30th the bus loading of 74F240 • Provides ideal interface and increase fan-out of MOS ORDERING INFORMATION microprocessors • Octal bus interface • 3-State buffer outputs sink 64mA • 15mA source current DESCRIPTION COMMERCIAL RANGE VCC = 5V ±10%, Tamb = 0°C to +70°C DRAWING NUMBER 20-pin plastic DIP N74F1240N SOT146-1 20-pin plastic SOL N74F1240D SOT163-1 DESCRIPTION The 74F1240 is an octal buffer that is ideal for driving bus lines or buffer memory address registers. The outputs are capable of sinking 64mA and sourcing up to 15mA, producing very good capacitive drive characteristics. The device features two Output Enables, OEa and OEb, each controlling four of the 3-State outputs. INPUT AND OUTPUT LOADING AND FAN OUT TABLE PINS Ian, Ibn DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW Data inputs 1.0/0.033 20µA/20µA OEa, OEb Output enable inputs (active Low) 1.0/0.033 20µA/20µA Yan, Ybn Data outputs (74F1240) 750/106.7 15mA/64mA NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state. 2000 Jun 30 Powered by ICminer.com Electronic-Library Service CopyRight 2003 2 853–0039 24025 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 PIN CONFIGURATION LOGIC SYMBOL OEa 1 20 VCC Ia0 2 19 OEb Yb0 3 18 Ya0 Ia1 4 17 Ib0 Yb1 5 16 Ya1 Ia2 6 15 Ib1 Yb2 7 14 Ya2 Ia3 8 13 Ib2 Yb3 9 12 Ya3 GND 10 14 8 12 17 5 13 7 11 9 SF01367 LOGIC DIAGRAM OEb Ia2 Ia3 Ib0 Ib1 Ib2 Ib3 OEa 19 OEb 16 14 12 3 5 7 9 SF00321 OUTPUTS OEa Ia OEb Ib Ya Yb L L L L H H L H L H L L X H X Z Z H H L X Z 3 2 15 Ib3 Ia1 18 1 6 Ib2 Ia0 1 11 FUNCTION TABLE 16 Ib1 13 VCC = Pin 20 GND = Pin 10 4 Ib0 15 18 EN2 2 OEa 17 EN1 19 Ia3 8 INPUTS 1 Ia2 6 11 Ib3 IEC/IEEE SYMBOL Ia1 4 Ya0 Ya1 Ya2 Ya3 Yb0 Yb1 Yb2 Yb3 SF00320 Ia0 2 2 18 4 16 6 14 8 12 Ya0 Ya1 Ya2 Ya3 1 17 3 15 5 13 7 11 9 Yb0 Yb1 Yb2 Yb3 19 SF01369 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 3 = = = = High voltage level Low voltage level Don’t care High impedance “off” state Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 ABSOLUTE MAXIMUM RATINGS (Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the operating free-air temperature range.) SYMBOL PARAMETER RATING UNIT VCC Supply voltage –0.5 to +7.0 V VIN Input voltage –0.5 to +7.0 V IIN Input current –30 to +5 mA VOUT Voltage applied to output in High output state –0.5 to VCC V IOUT Current applied to output in Low output state Tamb Operating free-air temperature range Tstg Storage temperature range 128 mA 0 to +70 °C –65 to +150 °C RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL PARAMETER UNIT MIN NOM MAX 5.0 5.5 VCC Supply voltage 4.5 VIH High-level input voltage 2.0 VIL Low-level input voltage 0.8 V IIK Input clamp current –18 mA IOH High-level output current –15 mA IOL Low-level output current 64 mA Tamb Operating free-air temperature range +70 °C 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 0 4 V V Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 DC ELECTRICAL CHARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) SYMBOL VOH O VCC = MIN VIL = MAX VIH = MIN High level output voltage High-level VOL O Low level output voltage Low-level VIK LIMITS TEST CONDITIONS1 PARAMETER VCC = MIN VIL = MAX VIH = MIN IOH 3mA O = –3mA IOH 15mA O = –15mA MIN TYP2 MAX UNIT ±10% VCC 2.4 ±5% VCC 2.7 ±10% VCC 2.0 V ±5% VCC 2.0 V V 3.3 V IOL = 48mA ±10% VCC 0.38 0.55 V IOL = 64mA ±5% VCC 0.42 0.55 V –0.73 –1.2 V 100 µA Input clamp voltage VCC = MIN, II = IIK II Input current at maximum input voltage VCC = 0.0V, VI = 7.0V IIH High-level input current VCC = MAX, VI = 2.7V 20 µA IIL Low-level input current VCC = MAX, VI = 0.5V –20 µA IOZH Off-state output current, High-level voltage applied VCC = MAX, VO = 2.7V 50 µA IOZL Off-state output current, Low-level voltage applied VCC = MAX, VO = 0.5V –50 µA IOS Short-circuit output current3 VCC = MAX –225 mA 22 30 mA ICC Supply current (total) 58 75 mA 44 58 mA –100 ICCH ICCL VCC = MAX ICCZ NOTES: 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb = 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. AC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER Tamb = +25°C VCC = +5.0V CL = 50pF, RL = 500Ω TEST CONDITION Tamb = 0°C to +70°C VCC = +5.0V ± 10% CL = 50pF, RL = 500Ω MIN TYP MAX MIN MAX UNIT tPLH tPHL Propagation delay Ian, Ibn, to Yn Waveform 1 3.0 1.5 4.5 2.5 6.5 4.5 2.5 1.5 7.5 5.0 ns ns tPZH tPZL Output Enable time to High or Low level Waveform 3 Waveform 4 3.0 4.0 5.5 7.0 7.5 9.0 3.0 4.0 8.0 9.5 ns ns tPHZ tPLZ Output Disable time to High or Low level Waveform 3 Waveform 4 2.0 2.0 4.0 4.0 6.0 5.5 2.0 2.0 6.5 6.0 ns ns 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 5 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 AC WAVEFORMS For all waveforms, VM = 1.5V. Ian, Ibn VM Ian, Ibn VM tPHL VM tPHL tPLH tPLH VM Yn VM Yn VM VM VM SF00328 Waveform 1. SF00329 For Inverting Outputs Waveform 2. OEn For Non-inverting Outputs OEn VM VM VM OEb VM OEb tPZH VOH -0.3V tPHZ Yn, Yn tPZL VM tPLZ 3.5V VM Yn, Yn 0V VOL +0.3V SF00330 SF00331 Waveform 3. 3-State Output Enable Time to High Level and Output Disable Time from High Level Waveform 4. 3-State Output Enable Time to Low Level and Output Disable Time from Low Level TEST CIRCUIT AND WAVEFORMS VCC 7.0V VIN RL VOUT PULSE GENERATOR tw 90% NEGATIVE PULSE VM CL AMP (V) VM 10% D.U.T. RT 90% 10% tTHL (tf ) tTLH (tr ) tTLH (tr ) tTHL (tf ) 0V RL AMP (V) 90% 90% Test Circuit for Open Collector Outputs POSITIVE PULSE VM VM 10% TEST tPLZ tPZL All other SWITCH closed closed open DEFINITIONS: RL = Load resistor; see AC electrical characteristics for value. CL = Load capacitance includes jig and probe capacitance; see AC electrical characteristics for value. RT = Termination resistance should be equal to ZOUT of pulse generators. 10% tw SWITCH POSITION 0V Input Pulse Definition INPUT PULSE REQUIREMENTS family amplitude VM 74F 3.0V 1.5V rep. rate tw tTLH tTHL 1MHz 500ns 2.5ns 2.5ns SF00128 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 6 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 DIP20: plastic dual in-line package; 20 leads (300 mil) 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 7 SOT146-1 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 SO20: plastic small outline package; 20 leads; body width 7.5 mm 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 8 SOT163-1 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 NOTES 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 9 Philips Semiconductors Product specification Octal inverter buffer (3-State) 74F1240 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 2000 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 06-00 Document order number: 2000 Jun 30Electronic-Library Service CopyRight 2003 Powered by ICminer.com 10 9397-750 07279