NSC LM48861

March 16, 2010
Ground-Referenced, Ultra Low Noise, Stereo Headphone
Amplifier
General Description
Key Specifications
The LM48861 is a single supply, ground-referenced stereo
headphone amplifier. Part of National's PowerWise® product
family, the LM48861 consumes only 3mW of power, yet still
provides great audio performance. The ground-referenced
architecture eliminates the larger DC blocking capacitors required by traditional headphone amplifier's saving board
space and reducing cost.
The LM48861 features common-mode sensing that corrects
for any differences between the amplifier ground and the potential at the headphone return terminal, minimizing noise
created by any ground mismatches.
The LM48861 delivers 22mW/channel into a 32Ω load with
<1% THD+N with a 1.8V supply. Power supply requirements
allow operation from 1.2V to 2.8V. High power supply rejection ratio (PSRR), 83dB at 217Hz, allows the device to operate in noisy environments without additional power supply
conditioning. A low power shutdown mode reduces supply
current consumption to 0.01µA.
Superior click and pop suppression eliminates audible transients on power-up/down and during shutdown. The
LM48861 is available in an ultra-small 12-bump, 0.4mm pitch,
micro SMD package (1.215mm x 1.615mm).
■ Output Power/channel at
VDD = 1.5V, THD+N = 1%
RL = 16Ω
RL = 32Ω
12mW (typ)
13mW (typ)
■ Output Power/channel at
VDD = 1.8V, THD+N = 1%
RL = 16Ω
RL = 32Ω
24mW (typ)
22mW (typ)
■ Quiescent Power Supply Current
at 1.5V
■ PSRR at 217Hz
■ Shutdown Current
2mA (typ)
83dB (typ)
0.01μA (typ)
Features
■ Ground referenced outputs – eliminates output coupling
■
■
■
■
■
■
■
capacitors
Common-mode sensing
Advanced click-and-pop suppression
Low supply current
Minimum external components
Micro-power shutdown
ESD protection of 8kV HBM contact
Available in space-saving 12-bump microSMD package
Applications
■ Mobile Phones
■ Portable electronic devices
■ MP3 Players
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2010 National Semiconductor Corporation
300541
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LM48861 PowerWise® Ground-Referenced, Ultra Low Noise, Stereo Headphone Amplifier
LM48861
LM48861
Typical Application
300541a9
FIGURE 1. Typical Audio Amplifier Application Circuit
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2
LM48861
Connection Diagrams
TM Package
1.215mm x 1.615mm x 0.6mm
12 – Bump TM Marking
300541h5
Top View
X = Date code
V = Lot traceability
G = Boomer
K3 = LM48861TM
300541a8
Top View
Order Number LM48861TM
See NS Package Number TMD12AAA
Ordering Information
Order Number
Package
LM48861TM
12 Bump microSMD
0.4mm Pitch
Package DWG #
Transport Media
MSL Level
Green Status
TMD12AAA
250 and 3000 units on tape
and reel
1
RoHS/no Sb/Br
Bump Description
Bump
Name
A1
CPP
Description
A2
PGND
A3
CPN
Charge Pump Flying Capacitor Negative Terminal
B1
VDD
Positive Power Supply
B2
SHDN
Active Low Shutdown
Charge Pump Flying Capacitor Positive Terminal
Power Ground
B3
CPVSS
Charge Pump Output
C1
OUTL
Left Channel Output
C2
VSS
Negative Power Supply
C3
INL
Left Channel Input
D1
OUTR
Right Channel Output
D2
COM
Ground reference for inputs and HP
D3
INR
Right Channel Input
3
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LM48861
ESD Susceptibility
(Machine Model) (Note 5)
Junction Temperature
Thermal Resistance
Absolute Maximum Ratings (Note 1, Note
2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note1)
Storage Temperature
Input Voltage
Power Dissipation (Note 3)
ESD Ratings (HBM) (Note 4)
ESD Ratings
(OUTL, OUTR) (Note 4)
200V
150°C
θJA (TM)
70°C/W (typ)
Operating Ratings
3V
−65°C to +150°C
-0.3V to VDD + 0.3V
Internally Limited
2000V
Temperature Range
TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ +85°C
1.2V ≤ VDD ≤ 2.8V
Supply Voltage (VDD)
8000V
Electrical Characteristics VDD = 1.5V
(Note 1, Note 2)
The following specifications apply for VDD = 1.5V, AV = –1V/V, RL = 32kΩ, f = 1kHz, unless otherwise specified. Limits apply for
TA = 25°C.
LM48861
Symbol
IDD
Parameter
Conditions
Typical
(Note 6)
Limit
(Note 7)
Units
(Limits)
Quiescent Power Supply Current
VIN = 0V, Both channels enabled
2
2.8
mA (max)
ISD
Shutdown Current
Shutdown Enabled
VSHDN = GND
0.01
1.5
µA (max)
VOS
Output Offset Voltage
VIN = 0V, RL = 32Ω
Both channels enabled
0.5
1.5
mV (max)
VIH
Shutdown Input Voltage High
1.4
V(min)
VIL
Shutdown Input Voltage Low
0.4
V(max)
TWU
Wake Up Time
PO
Output Power
500
700
μs (max)
THD+N = 1% RL = 32Ω, f = 1kHz,
Both channels in phase and active
VDD = 1.5V
VDD = 1.8V
13
22
12
20
mW (min)
mW (min)
THD+N = 1% RL = 16Ω, f = 1kHz,
Both channels in phase and active
VDD = 1.5V
VDD = 1.8V
12
24
mW
mW
RL = 10kΩ, f = 1kHz
VLINE-OUT
THD+N
Output Voltage to Line Out
VDD = 1.5V, THD+N = 1%, RL = 10kΩ
1.1
1
VRMS (min)
VDD = 1.8V, THD+N = 1%, RL = 10kΩ
1.3
1.2
VRMS (min)
PO = 8mW, f = 1kHz, RL = 32Ω
0.04
%
0.07
%
0.001
%
Total Harmonic Distortion + Noise PO = 8mW, f = 1kHz, RL = 16Ω
VOLIF = 900mVRMS, f = 1kHz, RL = 10kΩ
VRIPPLE = 200mVP-P Sine, Inputs AC GND, C1 = C2 = 0.39μF
PSRR
Power Supply Rejection Ratio
SNR
Signal-to-Noise Ratio
XTALK
Crosstalk
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fRIPPLE = 217Hz
fRIPPLE = 1kHz
fRIPPLE = 15kHz
83
77
57
dB
dB
dB
RL = 32Ω, POUT = 8mW
(A-weighted), f = 1kHz
BW = 20Hz to 22kHz
102
dB
RL = 32Ω, POUT = 5mW, f = 1kHz
93
dB
4
Parameter
NOUT
Output Noise
C-P
Click-Pop
Conditions
A-weighted, AV = 5.1dB
R1 = R2 = 10kΩ, R3 = R4 = 18kΩ
Inputs Grounded
BW = <10Hz to >500kHz
Typical
(Note 6)
Units
(Limits)
Limit
(Note 7)
5
μV
79
dB
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum RatingsRatings or other conditions beyond those
indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional
and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: Maximum allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings, whichever is lower.
Note 4: Human body model, applicable std. JESD22-A114C.
Note 5: Machine model, applicable std. JESD22-A115-A.
Note 6: Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product
characterization and are not guaranteed.
Note 7: Datasheet min/max specification limits are guaranteed by test or statistical analysis.
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LM48861
LM48861
Symbol
LM48861
Typical Performance Characteristics
THD+N vs Frequency
VDD = 1.5V, RL = 16Ω, PO = 8mW
THD+N vs Frequency
VDD = 1.5V, RL = 32Ω, PO = 8mW
300541b3
300541b2
THD+N vs Frequency
VDD = 1.8V, RL = 16Ω, PO = 18mW
THD+N vs Frequency
VDD = 1.8V, RL = 32Ω, PO = 20mW
300541b5
300541b4
THD+N vs Output Power
VDD = 1.5V & 1.8V, RL = 16Ω, f = 1kHz
THD+N vs Output Power
VDD = 1.5V & 1.8V, RL = 32Ω, f = 1kHz
300541d1
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300541d2
6
LM48861
Power Dissipation vs Output Power
RL = 16Ω, f = 1kHz
Power Dissipation vs Output Power
RL = 32Ω, f = 1kHz
300541h2
300541h3
PSRR vs Frequency
VDD = 1.5V, VRIPPLE = 200mVP-P, RL = 32Ω
Output Power vs Supply Voltage
RL = 16Ω, f = 1kHz
300541c8
30054102
Output Power vs Supply Voltage
RL = 32Ω, f = 1kHz
Supply Current vs Supply Voltage
No Load
300541d0
30054103
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LM48861
Shutdown Current vs Supply Voltage
No Load
Crosstalk vs Frequency
VDD = 1.5V, POUT = 5mW, RL = 32Ω
300541c9
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300541c7
8
voltage to the SHDN pin. Driving the SHDN pin with active
circuitry eliminates the pull-up resistor.
GENERAL AMPLIFIER FUNCTION
The LM48861 headphone amplifier features National’s
ground referenced architecture that eliminates the large DCblocking capacitors required at the outputs of traditional headphone amplifiers. A low-noise inverting charge pump creates
a negative supply (CPVSS) from the positive supply voltage
(VDD). The headphone amplifiers operate from these bipolar
supplies, with the amplifier outputs biased about GND, instead of a nominal DC voltage (typically VDD/2), like traditional
amplifiers. Because there is no DC component to the headphone output signals, the large DC-blocking capacitors (typically 220μF) are not necessary, conserving board space and
system cost, while improving frequency response.
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier, especially one in mobile devices. In the LM48861,
the power dissipation comes from the charge pump and two
operational amplifiers. Refer to the Power Dissipation vs Output Power curve in the Typical Performance Characteristics
section of the datasheet to find the power dissipation associated the output power level of the LM48861. The power
dissipation should not exceed the maximum power dissipation point of the micro SMD package given in equation 1.
PDMAX = (TJMAX - TA) / (θJA)
COMMON MODE SENSE
The LM48861 features a ground (common mode) sensing
feature. In noisy applications, or where the headphone jack is
used as a line out to other devices, noise pick up and ground
imbalance can degrade audio quality. The LM48861 COM input senses and corrects any noise at the headphone return,
or any ground imbalance between the headphone return and
device ground, improving audio reproduction. Connect COM
directly to the headphone return terminal of the headphone
jack (Figure 2). No additional external components are required. Connect COM to GND if the common-mode sense
feature is not in use.
(1)
For the LM48861TM micro SMD package, θJA = 70°C/W.
TJMAX = 150°C, and TA is the ambient temperature of the system surroundings.
PROPER SELECTION OF EXTERNAL COMPONENTS
Power Supply Bypassing/Filtering
Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass capacitors as close to the supply pins as possible. Place a 1μF
ceramic capacitor from VDD to GND. Additional bulk capacitance may be added as required.
Charge Pump Capacitor Selection
Use low ESR ceramic capacitors (less than 100mΩ) for optimum performance.
Charge Pump Flying Capacitor (C5)
The flying capacitor (C5) affects the load regulation and output impedance of the charge pump. A C5 value that is too low
results in a loss of current drive, leading to a loss of amplifier
headroom. A higher valued C5 improves load regulation and
lowers charge pump output impedance to an extent. Above
2.2μF, the RDS(ON) of the charge pump switches and the ESR
of C5 and C6 dominate the output impedance. A lower value
capacitor can be used in systems with low maximum output
power requirements.
30054101
FIGURE 2.
MICRO POWER SHUTDOWN
The voltage applied to the shutdown (SHDN) pin controls the
LM48861’s shutdown function. Activate micro-power shutdown by applying a logic-low voltage to the SHDN pin. When
active, the LM48861’s micro-power shutdown feature turns
off the amplifier’s bias circuitry, reducing the supply current.
The trigger point is 0.4V (max) for a logic-low level, and 1.4V
(min) for a logic-high level. The low 0.1μA (typ) shutdown current is achieved by applying a voltage that is as near as
ground as possible to the SHDN pin. A voltage that is higher
than ground may increase the shutdown current.
There are a few ways to control the micro-power shutdown.
These include using a single-pole, single-throw switch, a microprocessor, or a microcontroller. When using a switch,
connect an external 100kΩ pull-up resistor between the
SHDN pin and GND. Connect the switch between the
SHDN pin and VDD. Select normal amplifier operation by closing the switch. Opening the switch connects the SHDN pin to
ground, activating micro-power shutdown. The switch and resistor guarantee that the SHDN pin will not float. This prevents
unwanted state changes. In a system with a microprocessor
or microcontroller, use a digital output to apply the control
Charge Pump Hold Capacitor (C6)
The value and ESR of the hold capacitor (C6) directly affects
the ripple on CPVSS. Increasing the value of C6 reduces output ripple. Decreasing the ESR of C6 reduces both output
ripple and charge pump output impedance. A lower value capacitor can be used in systems with low maximum output
power requirements.
Power Supply Bypassing /Filtering
Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass capacitors as close to the device as possible. Typical applications
employ a voltage regulator with 10µF and 0.1µF bypass capacitors that increase supply stability. These capacitors do
not eliminate the need for bypassing of the LM48861 supply
pins. A 1µF capacitor is recommended.
Input Capacitor Selection
The LM48861 requires input coupling capacitors. Input capacitors block the DC component of the audio signal, eliminating any conflict between the DC component of the audio
source and the bias voltage of the LM48861. The input capacitors create a high-pass filter with the input resistors RIN.
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LM48861
Application Information
LM48861
The -3dB point of the high-pass filter is found using Equation
(2) below.
f = 1 / 2πRINCIN
PCB Layout Guidelines
Minimize trace impedance of the power, ground and all output
traces for optimum performance. Voltage loss due to trace
resistance between the LM48861 and the load results in decreased output power and efficiency. Trace resistance between the power supply and ground has the same effect as a
poorly regulated supply, increased ripple and reduced peak
output power. Use wide traces for power supply inputs and
amplifier outputs to minimize losses due to trace resistance,
as well as route heat away from the device. Proper grounding
improves audio performance, minimizes crosstalk between
channels and prevents switching noise from interfering with
the audio signal. Use of power and ground planes is recommended.
As described in the Common Mode Sense section, the
LM48861 features a ground sensing feature. On the PCB layout, connect the COM pin (pin D2) directly to the headphone
jack ground and also to the left and right input grounds. This
will help correct any noise or any ground imbalance between
the headphone return, input, and the device ground, therefore
improving audio reproduction.
The charge pump capacitors and traces connecting the capacitor to the device should be kept away from the input and
output traces to avoid any switching noise injected into the
input or output.
(2)
Where the value of RIN is selected based on the gain-setting
resistor selection. In relation to Figure 1, RIN = R1 = R2, CIN
= C1 = C2.
The input capacitors can also be used to remove low frequency content from the audio signal. Small speakers can not
reproduce, and may even be damaged by low frequencies.
High-pass filtering the audio signal helps protect the speakers. When the LM48861 is using a single-ended source,
power supply noise on the ground is seen as an input signal.
Setting the high-pass filter point above the power supply noise
frequencies, 217Hz in a GSM phone, for example, filters out
the noise such that it is not amplified and heard on the output.
Capacitors with a tolerance of 10% or better are recommended for impedance matching and improved CMRR and PSRR.
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LM48861
Demo Board Schematic and Layout
30054199
FIGURE 4: Top Solder Mask
30054110
FIGURE 3: Top Silkscreen Layer
30054106
FIGURE 5: Bottom Solder Mask
30054109
FIGURE 6: Top Layer
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LM48861
30054108
30054107
FIGURE 8: Layer 3
FIGURE 7: Layer 2
30054105
FIGURE 10: Bottom Silkscreen
30054104
FIGURE 9: Bottom Layer
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LM48861
Revision History
Rev
Date
1.0
06/11/08
Initial release.
Description
1.01
02/08/10
Input text edits.
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LM48861
Physical Dimensions inches (millimeters) unless otherwise noted
TM Package
Order Number LM48861TM
NS Package Number TMD12AAA
X1 = 1.215mm, X2 = 1.615mm, X3 = 0.6mm
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LM48861
Notes
15
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LM48861 PowerWise® Ground-Referenced, Ultra Low Noise, Stereo Headphone Amplifier
Notes
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